Preparation method of a microchip linear negative temperature coefficient thermistor
A thermistor and negative temperature coefficient technology, which is applied in the direction of resistors, resistor manufacturing, resistor chip manufacturing, etc., can solve the problems of high product resistance, uneven distribution of product resistance, low pass rate, etc., and achieve stability Good performance and stable NTC effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2019-01-04
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Abstract
Description
technical field
[0001] The invention belongs to the field of stable negative temperature coefficient (NTC) heat-sensitive polymer composite materials and components, and in particular relates to a linear and reliable chip-type NTCR preparation process. Background technique
[0002] Most heat-sensitive components are made of heat-sensitive materials with positive temperature coefficient or negative temperature coefficient. Heat-sensitive materials mainly include heat-sensitive ceramic materials and heat-sensitive polymer composite materials. The working principle is to use the resistivity of heat-sensitive materials As the temperature changes, the heat-sensitive materials include nonlinear NTC (Negative Temperature Coefficient), nonlinear PTC (Positive Temperature Coefficient), linear NTC and linear PTC. At present, the most studied are nonlinear NTC (Negative Temperature Coefficient), nonlinear PTC (Positive Temperature Coefficient) and linear PTC. At present, there are few ...
Examples
Embodiment 1
[0030] (1) Ingredients and stirring
[0031] Weigh fluororubber (0.9) and conductive carbon black (0.1) in proportion, dissolve fluororubber with butyl acetate solvent, add silane coupling agent, add conductive carbon black under stirring state, according to product TCR value and resistance value Adjust the formula until the carbon black is uniformly dispersed in the fluororubber solution to form a slurry-like polymer composite.
[0032] (2) Configuration cast material
[0033] The uniformly stirred polymer composite material slurry is made into a casting material. The specific implementation method is to add an appropriate amount of butyl acetate (quantified according to the viscosity) to the polymer composite slurry, stir for about 2 hours, and filter to obtain the casting material.
[0034] (3) Casting and lamination
[0035]The thermistor polymer composite substrate can be prepared by tape casting, gold foil lamination, isostatic pressing, hot pressing and ultraviolet ra...
Embodiment 2
[0046] The formula in the batching and ball milling process is changed to: 0.75 parts of fluororubber and 0.25 parts of conductive carbon black, appropriate amount of coupling agent, and appropriate amount of butyl acetate solvent. Other process conditions remain unchanged, and finally choose 8 chip thermistor products, and their electrical performance test results are shown in Table 2.
[0047] Microchip linear thermistor sample electrical properties prepared after table 2 formula changes
[0048]
[0049] It can be seen from the test results in Table 2 that the room temperature resistance of the microchip thermistor is about 82Ω, the TCR value is about 6000ppm / °C, and the average deviation is small. After the film prepared by casting method is laminated and isostatically pressed, the dispersion of carbon black in the fluororubber is excellent and the uniformity is good, so that the resistance value of the product has high precision, good stability and excellent performanc...