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Preparation method of a microchip linear negative temperature coefficient thermistor

A thermistor and negative temperature coefficient technology, which is applied in the direction of resistors, resistor manufacturing, resistor chip manufacturing, etc., can solve the problems of high product resistance, uneven distribution of product resistance, low pass rate, etc., and achieve stability Good performance and stable NTC effect

Active Publication Date: 2019-01-04
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the thick-film chip NTCR uses planar electrodes, the adjustment of the resistance value generally depends on reducing the square number, resulting in a higher resistance value of the prepared product. Secondly, due to the inherent characteristics of the thick-film printing process, the product resistance value distribution is different. And because the resistor has a thermal effect, it is difficult to adjust the product resistance by laser trimming, so the resistance accuracy is very poor, and the pass rate is low when preparing high-precision products

Method used

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  • Preparation method of a microchip linear negative temperature coefficient thermistor
  • Preparation method of a microchip linear negative temperature coefficient thermistor
  • Preparation method of a microchip linear negative temperature coefficient thermistor

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] (1) Ingredients and stirring

[0031] Weigh fluororubber (0.9) and conductive carbon black (0.1) in proportion, dissolve fluororubber with butyl acetate solvent, add silane coupling agent, add conductive carbon black under stirring state, according to product TCR value and resistance value Adjust the formula until the carbon black is uniformly dispersed in the fluororubber solution to form a slurry-like polymer composite.

[0032] (2) Configuration cast material

[0033] The uniformly stirred polymer composite material slurry is made into a casting material. The specific implementation method is to add an appropriate amount of butyl acetate (quantified according to the viscosity) to the polymer composite slurry, stir for about 2 hours, and filter to obtain the casting material.

[0034] (3) Casting and lamination

[0035]The thermistor polymer composite substrate can be prepared by tape casting, gold foil lamination, isostatic pressing, hot pressing and ultraviolet ra...

Embodiment 2

[0046] The formula in the batching and ball milling process is changed to: 0.75 parts of fluororubber and 0.25 parts of conductive carbon black, appropriate amount of coupling agent, and appropriate amount of butyl acetate solvent. Other process conditions remain unchanged, and finally choose 8 chip thermistor products, and their electrical performance test results are shown in Table 2.

[0047] Microchip linear thermistor sample electrical properties prepared after table 2 formula changes

[0048]

[0049] It can be seen from the test results in Table 2 that the room temperature resistance of the microchip thermistor is about 82Ω, the TCR value is about 6000ppm / °C, and the average deviation is small. After the film prepared by casting method is laminated and isostatically pressed, the dispersion of carbon black in the fluororubber is excellent and the uniformity is good, so that the resistance value of the product has high precision, good stability and excellent performanc...

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Abstract

The invention discloses a production method of a microchip linear negative temperature coefficient thermistor. The production method includes: producing a thermo-sensitive polymer composite material similar to slurry, producing the evenly-stirred polymer composite material into a tape casting material, performing tape casting, gold foil layer coating, isostatic pressing, hot pressing and ultraviolet radiation crosslinking to produce the polymer-composite-material substrate of the thermistor, and precisely cutting the polymer-composite-material substrate according to product technical requirements to obtain the microchip linear negative temperature coefficient thermistor. The production method has the advantages that the produced microchip linear negative temperature coefficient (NTC) thermistor is high in resistance precision, adjustable in resistance, stable in resistance and TCR (temperature coefficient of resistance), reliable in product performance, and the like; the production method has important practical value to the industrial production of the microchip linear negative temperature coefficient thermistor.

Description

technical field [0001] The invention belongs to the field of stable negative temperature coefficient (NTC) heat-sensitive polymer composite materials and components, and in particular relates to a linear and reliable chip-type NTCR preparation process. Background technique [0002] Most heat-sensitive components are made of heat-sensitive materials with positive temperature coefficient or negative temperature coefficient. Heat-sensitive materials mainly include heat-sensitive ceramic materials and heat-sensitive polymer composite materials. The working principle is to use the resistivity of heat-sensitive materials As the temperature changes, the heat-sensitive materials include nonlinear NTC (Negative Temperature Coefficient), nonlinear PTC (Positive Temperature Coefficient), linear NTC and linear PTC. At present, the most studied are nonlinear NTC (Negative Temperature Coefficient), nonlinear PTC (Positive Temperature Coefficient) and linear PTC. At present, there are few ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C17/00
CPCH01C17/00H01C17/006
Inventor 杨康庞锦标杨俊窦占明冉铧深龚漫莉韩玉成
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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