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Manufacturing method of LED epitaxial wafer

A technology of LED epitaxial wafers and epitaxial wafers, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced internal quantum efficiency, reduced diode performance, and poor anti-static breakdown ability, so as to reduce internal leakage and improve reflection. to the voltage and improve the effect of luminous efficiency

Active Publication Date: 2017-05-10
GUANGDONG HONGRUI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the traditional gallium nitride-based diode epitaxial wafer structure, the dislocation throughout the entire P-N junction is one of the main factors causing the performance degradation of the diode. Such dislocations will cause a decrease in internal quantum efficiency, reverse leakage, antistatic Poor breakdown ability
[0008] The electron blocking layer PAlGaN is indispensable in LED epitaxy. The main function is to use the high energy band of AlGaN to block the electrons from the light emitting layer from overflowing to the P layer, but it also brings many disadvantages.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] h 2 Purify the substrate at high temperature in the environment; H at 1000°C 2 Under the atmosphere, feed 100L / min of H 2 , keep the reaction chamber pressure at 100mbar, and process the substrate for 8min.

[0035] The epitaxial wafer includes a multi-quantum well layer in which a low-temperature buffer layer, a U-type gallium nitride GaN layer, an N-type GaN layer, a barrier layer / well layer / supplementary layer / slope well layer structure are sequentially formed from bottom to top on the substrate , functional layer, light emitting layer and P-type GaN layer.

[0036] Using the chemical vapor deposition method of metal organic compounds, at 550 ° C, the pressure of the reaction chamber is maintained at 300 mbar, and the flow rate of NH is 10000 sccm 3 , 50sccm TMGa, 100L / min H 2 1. Growing a low-temperature buffer layer GaN with a thickness of 20 nm on the substrate.

[0037] Grow a U-type GaN layer in the low-temperature buffer layer GaN: first grow a 2D-type GaN...

Embodiment 2

[0046] h 2 Purify the substrate at high temperature in the environment; H at 1050°C 2 Under the atmosphere, feed 120L / min of H 2 , keep the reaction chamber pressure at 200mbar, and process the substrate for 9 minutes.

[0047] The epitaxial wafer includes a multi-quantum well layer in which a low-temperature buffer layer, a U-type gallium nitride GaN layer, an N-type GaN layer, a barrier layer / well layer / supplementary layer / slope well layer structure are sequentially formed from bottom to top on the substrate , functional layer, light emitting layer and P-type GaN layer.

[0048] Using the chemical vapor deposition method of metal organic compounds, at 570 ° C, the pressure of the reaction chamber is maintained at 450 mbar, and the flow rate of NH is 15000 sccm 3 , 75sccm TMGa, 120L / min H 2 1. Growing a low-temperature buffer layer GaN with a thickness of 20nm-40nm on the substrate.

[0049] Grow a U-type GaN layer in the low-temperature buffer layer GaN: first grow a 2D...

Embodiment 3

[0058] h 2 Purify the substrate at high temperature in the environment; H at 1100°C 2 Under the atmosphere, feed 130L / min of H 2 , keep the reaction chamber pressure at 300mbar, and process the substrate for 10min.

[0059] The epitaxial wafer includes a multi-quantum well layer in which a low-temperature buffer layer, a U-type gallium nitride GaN layer, an N-type GaN layer, a barrier layer / well layer / supplementary layer / slope well layer structure are sequentially formed from bottom to top on the substrate , functional layer, light emitting layer and P-type GaN layer.

[0060] Using the chemical vapor deposition method of metal organic compounds, at 580 ° C, the pressure of the reaction chamber is maintained at 600 mbar, and the flow rate of NH is 20000 sccm 3 , 100sccm TMGa, 130L / min H 2 1. Growing a low-temperature buffer layer GaN with a thickness of 40 nm on the substrate.

[0061] Grow a U-type GaN layer in the low-temperature buffer layer GaN: first grow a 2D-type G...

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Abstract

The invention discloses a manufacturing method of an LED epitaxial wafer. By using the method, luminescence area losses can be further reduced, a supplementation layer is increased and growing quality of a quantum well is improved; and a backward voltage is increased, internal electric leakage of a device is reduced, and simultaneously, an In-component gradual-change inclined well layer is used to change a forbidden band width of the well so as to capture more electrons and cavities. Contact areas of the electrons and the cavities are increased. A luminescence area is increased too. Operation speeds of the electrons are reduced and a number of effective electrons which are contacted with the cavities is increased.

Description

[0001] Technical field [0002] The invention relates to a method for preparing an LED, in particular to a method for preparing an LED epitaxial wafer. Background technique [0003] In recent years, light-emitting diode (Light Emitting Diode, LED) lighting technology, known as "green lighting", has developed rapidly. Compared with traditional lighting sources, white light-emitting diodes not only have low power consumption, long service life, small size, environmental protection, but also have the advantages of good modulation performance and high response sensitivity. On the one hand, white light-emitting diodes have the characteristics of high emission power and safety to human eyes; on the other hand, they have the advantages of fast response, good modulation, no electromagnetic interference, and no need to apply for radio spectrum. [0004] The core part of the light-emitting diode is a chip composed of a P-type semiconductor and an N-type semiconductor. There is a transi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/06
CPCH01L33/005H01L33/06
Inventor 梁沛明
Owner GUANGDONG HONGRUI TECH CO LTD
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