Manufacturing method for environment-friendly type high-density wood and bamboo fiber board

A kind of bamboo fiber and environment-friendly technology, applied in the direction of wood processing equipment, pretreatment of molding materials, manufacturing tools, etc., can solve the problems of waste water and gas discharge energy consumption, high energy consumption, poor waterproof performance, etc., to achieve no waste water discharge, Good flame retardant performance and good styling effect

Inactive Publication Date: 2017-05-24
HUNAN ACAD OF FORESTRY
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the addition of urea-formaldehyde resin or other adhesives with free formaldehyde in its process formula, it may cause serious air pollution, and because its adhesives are mostly water-based adhesives, the waterproof performance is poor.
The production process requires the wood fiber to be digested and softened, and a large amount of steam is required from the coal-fired boiler, so there is a large amount of waste water and waste gas discharge and high energy consumption
The production process requires cooking and thermal grinding of wood materials, resulting in a large amount of waste water discharge, and boilers are required to provide a large amount of heat energy. The production process has the disadvantages of high pollutant discharge and high energy consumption.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method for environment-friendly type high-density wood and bamboo fiber board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0028] like figure 1 Shown, a kind of environment-friendly type high-density wood bamboo fiber board manufacture method,

[0029] The environment-friendly high-density wood and bamboo fiber plate disclosed by the invention is composed of 50-60% of wood fiber; 20-30% of bamboo fiber; 20-30% of pvc; 8-15% of medical stone, and 1-3% of environmentally friendly flame retardant constitute.

[0030] The environment-friendly high-density wood-bamboo fiber plate disclosed by the invention is further optimized, and is composed of 50% of wood fiber, 20% of bamboo fiber, 20% of pvc, 8% of medical stone and 2% of environmentally friendly flame retardant.

[0031] The manufacturing method of the environment-friendly high-density wood and bamboo fiber board disclosed by the invention comprises the following steps:

[0032] An environment-friendly high-density wood and bamboo fiber board manufacturing method, comprising the following steps:

[0033]Step 1. Slicing-screening: (1) All the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
thicknessaaaaaaaaaa
particle size (mesh)aaaaaaaaaa
Login to view more

Abstract

The invention discloses an environment-friendly type high-density wood and bamboo fiber board. The environment-friendly type high-density wood and bamboo fiber board is composed of 50%-60% of wood fibers, 20%-30% of bamboo fibers, 20%-30% of pvc, 8%-15% of medical stones and 1%-3% of environment-friendly fire retardant. A processing method for the environment-friendly type high-density wood and bamboo fiber board includes the steps of slicing, smashing, kneading, hot pressing and drying, and the environment-friendly type high-density wood and bamboo fiber board is manufactured, wherein density of the environment-friendly type high-density wood and bamboo fiber board is generally 880 kg/m<3> or above, and the thickness ranges from 2 mm to 30 mm. The environment-friendly type high-density wood and bamboo fiber board has the beneficial effects that releasing of free formaldehyde is avoided, the waterproof performance is good, the wear resisting performance is good, the flame retardant property is good, the texture of a plate face is smooth, the internal organizational structure is fine, and especially a tight edge is achieved; and the environment-friendly type high-density wood and bamboo fiber board is suitable for replacing traditional medium-and-high-density fiber boards and natural wood for serving as structural materials.

Description

technical field [0001] The invention relates to the field of preparation of environment-friendly boards, in particular to a method for making an environment-friendly high-density wood and bamboo fiber board. Background technique [0002] The medium density fiberboard currently sold on the market is made of small-diameter logs, harvesting, processing residues, and non-woody plant fiber raw materials. After slicing, cooking, fiber separation, and drying, urea-formaldehyde resin or other applicable adhesives are applied. A man-made board made after hot pressing. Composition: Wood or vegetable fibers other than wood. Density: 0.5-0.88g / cm 3 , Thickness: generally 2-30mm. MDF is a product developed in the mid-1960s, and has developed rapidly since then. The reason is that it has excellent physical and mechanical properties, decorative properties and processing properties. However, due to the addition of urea-formaldehyde resin or other adhesives with free formaldehyde in its...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/04B27N3/12B27N3/18B27N1/00B27L11/06C08L97/02C08L27/06C08K3/34
CPCB27L11/06B27N1/00B27N3/04B27N3/12B27N3/18C08L97/02C08L2205/025C08L2205/03C08L2205/16C08L27/06C08K3/346
Inventor 何洪城邓腊云胡伟袁光明谭林朋何可丹
Owner HUNAN ACAD OF FORESTRY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products