Special epoxy resin adhesive for stone material
A technology of epoxy resin and adhesive, applied in the direction of epoxy resin glue, adhesive type, non-polymer adhesive additives, etc., can solve the problem of poor impact toughness, poor mechanical properties, easy to crack, etc. problem, to achieve the effect of improving bond strength, excellent stability, good heat resistance and weather resistance
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Embodiment 1
[0018] A special epoxy resin adhesive for stone proposed by the present invention, its raw materials include by weight: 100 parts of epoxy resin, 20 parts of amino-terminated liquid nitrile rubber, 50 parts of dicyandiamide, 2 parts of curing accelerator, nano 10 parts of calcium carbonate, 2 parts of kaolin, 5 parts of fly ash, 5 parts of nano silicon dioxide.
Embodiment 2
[0020] A special epoxy resin adhesive for stone proposed by the present invention, its raw materials include by weight: 100 parts of epoxy resin, 35 parts of amino-terminated liquid nitrile rubber, 20 parts of dicyandiamide, 5 parts of curing accelerator, nano 3 parts of calcium carbonate, 10 parts of kaolin, 1 part of fly ash, 12 parts of nano silicon dioxide.
Embodiment 3
[0022] A special epoxy resin adhesive for stone proposed by the present invention, its raw materials include by weight: 100 parts of epoxy resin, 25 parts of amino-terminated liquid nitrile rubber, 38 parts of dicyandiamide, 2.6 parts of curing accelerator, nano 8 parts of calcium carbonate, 4 parts of kaolin, 4.1 parts of fly ash, 8 parts of nano silicon dioxide, 3.8 parts of silane coupling agent KH-560;
[0023] Wherein, the curing accelerator is prepared according to the following process: 1-cyanoethyl-2-methylimidazole, Raney nickel and potassium hydroxide are added to the reactor, then ethanol is added, and hydrogen gas is passed into the reactor to remove the Air, heat the reactor to 100°C, and keep the hydrogen pressure in the reactor at 3MPa, react for 3.5h, discharge the hydrogen after the reaction, filter, rotate and evaporate, and then distill under reduced pressure to obtain material A; add material A and copper chloride In the mixed solution of N,N-dimethylformam...
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