Cyanate ester adhesive with low dielectrics and high toughness, and preparation method thereof

Abstract

The invention discloses a cyanate ester adhesive with low dielectrics and high toughness, and a preparation method thereof, and belongs to the field of high polymer materials. Bisphenol AF type epoxy resin (DGEBHF) and organic metal salt catalyst are used for jointly modifying cyanate ester so as to solve the problem of poor dielectrics, poor toughness and insufficient adhesion of the cyanate ester. The cyanate ester adhesive is used for the bonding of electronic products. The preparation method comprises the following steps: (1) at a ratio of 70-95%, weighing cyanate ester resin, smelting at the temperature of 100-120DEG C, cooling to 75-90DEG C, and adding 4.9-29.957% of DGEBHF to be stirred to be transparent to obtain premixing adhesive; (2) adding 0.025-0.1% of organic metal salt catalyst into the premixing adhesive obtained in (1) to be evenly mixed at the temperature of 75-90DEG C to obtain the cyanate ester adhesive with low dielectrics and high toughness. The cyanate ester adhesive has the advantages of excellent dielectricity, toughness, adhesion and solidification, simple preparation technology, low equipment requirement and environment protection.

Description

technical field [0001] The invention relates to a low-dielectric and high-toughness cyanate adhesive and a preparation method thereof, belonging to the field of polymer materials. Background technique [0002] Cyanate Ester Resin (CE) is a kind of resin with -OCN in the terminal group, which forms a triazine ring resonance structure after curing, and has low dielectric constant, low dielectric loss, high dimensional stability, and heat resistance. It is an ideal adhesive resin matrix for electronic products. However, the triazine ring structure formed by ordinary cyanate adhesives after curing is highly symmetrical, high in crystallinity, and high in crosslinking density, which makes ordinary cyanate adhesives poor in toughness and becomes an important factor limiting their application; in addition, ordinary cyanate Adhesives cannot be fully cured at relatively low temperatures (adhesives generally used in electronic products require a curing temperature below 200 °C), and ...

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Problems solved by technology

Epoxy resin is an ideal toughening modifier for cyanate ester resin. It can react with cyanate ester group to form oxazoquinolone, which has a good toughening effect on cyanate ester. Ester materials will reduce the dielectric properties of cyanate esters; in the method of preparing low-dielectric cyanate ester materials, the effect is better to introduce F atoms into cyanate esters, but the conditions for preparing fluorinated cyanate esters are harsh. , easy to cause environmental pollution, so there are still many problems in the preparation of cyanate ester materials with good toughness and excellent dielectric properties

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