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A kind of low viscosity anti-collapse lead-free solder paste and preparation method thereof

A lead-free solder paste, lead-free solder technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as sticking scrapers, plugging holes, collapse, etc., to reduce viscosity, prolong storage time, and strengthen thixotropy. Effect

Active Publication Date: 2019-04-16
广东斯特纳新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, it is necessary to develop a new type of solder paste to solve the problems of scraper sticking, hole blocking, collapse, etc.

Method used

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  • A kind of low viscosity anti-collapse lead-free solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A low-viscosity anti-collapse lead-free solder paste, including 85kg lead-free solder powder and 20kg flux, the composition of lead-free solder powder is: 88wt% tin, 2.1wt% silver, 0.5wt% copper, 9wt% cobalt and 0.4wt% %titanium, the composition of flux is: 22wt% epoxy resin, 8wt% thixotropic agent, 8wt% activator and 62wt% solvent, thixotropic agent is made of 45wt% fumed silica, 30wt% organic bentonite and 25wt% stearin Acid amide, the solvent is composed of 20wt% propylene glycol, 22wt% diethanol dimethyl ether, 40wt% cyclohexanone and 18wt% ethyl acetoacetate, and the activator is triethanolamine succinate.

[0033] Follow the steps below to prepare lead-free solder paste:

[0034] S1. Propylene glycol, diethanol dimethyl ether, cyclohexanone and ethyl acetoacetate are compounded into a mixed solvent according to the amount, and the epoxy resin and the mixed solvent are added to the reactor, heated and stirred until completely melted;

[0035] S2. Compound the fume...

Embodiment 2

[0038] A low-viscosity anti-collapse lead-free solder paste, including 91kg lead-free solder powder and 18kg flux, the composition of lead-free solder powder is: 94wt% tin, 0.5wt% silver, 0.2wt% copper, 5.2wt% cobalt and 0.1 wt% titanium, the composition of the flux is: 28wt% epoxy resin, 5wt% thixotropic agent, 4wt% activator and 63wt% solvent, the thixotropic agent consists of 45wt% fumed silica, 30wt% organic bentonite and 25wt% hard Composed of fatty acid amide, the solvent is composed of 20wt% propylene glycol, 22wt% diethanol dimethyl ether, 40wt% cyclohexanone and 18wt% ethyl acetoacetate, and the activator is triethanolamine succinate.

[0039] Prepare according to the same steps as in Example 1.

Embodiment 3

[0041] A low-viscosity anti-collapse lead-free solder paste, including 95kg lead-free solder powder and 15kg flux, the composition of lead-free solder powder is: 91.4wt% tin, 3wt% silver, 0.4wt% copper, 5wt% cobalt and 0.2wt% %titanium, the composition of flux is: 25wt% epoxy resin, 6wt% thixotropic agent, 5wt% activator, 63wt% solvent, 1wt% antioxidant, thixotropic agent is made of 45wt% fumed silica, 30wt% organic Composed of bentonite and 25wt% stearic acid amide, the solvent is composed of 20wt% propylene glycol, 22wt% diglyl dimethyl ether, 40wt% cyclohexanone and 18wt% ethyl acetoacetate, and the activator is triethanolamine citrate.

[0042] Prepare according to the same steps as in Example 1.

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Abstract

The invention belongs to the technical field of welding materials, and discloses a low-viscosity collapse prevention lead-free solder paste. Lead-free solder powder comprises cobalt and titanium, scaling powder comprises epoxy resin, activating agents, thixotropic agents and solvents, the thixotropic agents comprise fumed silica, organic bentonite and octadecanamide, and the solvents comprise propylene glycol, diethyl alcohol dimethyl ether, cyclohexanone and ethyl acetoacetate. The invention further discloses a preparation method of the low-viscosity collapse prevention lead-free solder paste. According to the paste, the cobalt is added into the lead-free solder powder, so that viscosity is reduced, holes cannot be plugged, the mixer will not stick on a scraper, storage time of the solder paste is prolonged, the titanium is added into the paste, the thixotropic agents and the solvents are changed, and the problems of collapse and caving of the solder paste are systematically solved.

Description

technical field [0001] The invention belongs to the technical field of soldering materials, in particular to a low-viscosity anti-collapse lead-free solder paste and a preparation method thereof. Background technique [0002] Surface Mount Technology (SMT) is currently the most popular technology and process in the electronic assembly industry. Solder paste is a new type of soldering material that accompanies SMT. Solder paste is a complex system, which is a paste mixed with solder powder, flux and other additives. Solder paste has a certain viscosity at room temperature, which can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and printed circuit pads are welded together to form Permanent connection. [0003] Solder paste is widely used in high-precision electronic components. On the one hand, solder paste can isolate electronic components from...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 黄政成王奕务
Owner 广东斯特纳新材料有限公司