Method for preparing high-heat-conduction aluminum nitride ceramic substrate by adding compound sintering auxiliary

Abstract

The invention relates to a method for preparing a high-heat-conduction aluminum nitride ceramic substrate by adding a compound sintering auxiliary. A preparation method comprises the following steps of (1), confecting of aluminum nitride ceramic powder, wherein a Li2O-MgO-CaO-YF3 system is adopted for the added compound sintering auxiliary; (2), ball milling; (3), vacuum bubble removal; (4), primary tape casting; (5), hydrostatic molding; (6), rubber discharge; (7), sintering. The method has the advantages that, according to the preparation method provided by the invention, through changing the formula of a sintering auxiliary, the compound sintering auxiliary can greatly improve heat conduction efficiency; moreover, the densification of aluminum nitride ceramic is further promoted; meanwhile, after the primary tape casting, the hydrostatic molding step is added; the consistency of performance is further improved.

Description

technical field [0001] The invention relates to a method for preparing an aluminum nitride ceramic substrate, in particular to an additive [0002] A method for preparing a high thermal conductivity aluminum nitride ceramic substrate with a composite sintering aid. Background technique [0003] Aluminum nitride is a new type of ceramic material with excellent comprehensive performance. It has a series of excellent properties such as excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, non-toxic and thermal expansion coefficient matching silicon. , is considered to be an ideal material for a new generation of high-density semiconductor substrates and electronic device packaging. Aluminum nitride substrates can be used in the fields of hybrid integrated circuits, semiconductor power devices, power electronic devices, optoelectronic devices, semiconductor refrigeration stacks, microwave devices, etc., as substrates and pa...

AI Technical Summary

Problems solved by technology

In the present invention, by adding a ternary composite sintering agent to the aluminum nitride powder, an aluminum nitride ceramic substrate with high thermal conductivity can be obtained without high-temperature sintering, which reduces energy consumption and saves production costs; but the method still exists Certain disadvantages: 1. The sintering aid used in the present invention can obtain high thermal conductivity at a lower sintering temperature and reduce energy consumption, but in the formula, Y 2 o 3 The melting point is 2415°C, and the melting point is relatively high, thereby suppressing the thermal conductivity to a certain extent; 2. In the present invention, tape casting is adopted for one-step molding, and the force on the green body cannot be guaranteed to be consistent in all directions, which makes the overall performance inconsistent