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Method for improving stability of copper ion ink and conductivity of copper film

A copper ion and stability technology, which is applied in the field of improving the stability of copper ion ink and the conductivity of copper film, can solve the problems that the stability of copper ion ink and the conductivity of copper film cannot meet the use requirements at the same time, and achieve both room temperature stability , Ease of storage and transportation

Inactive Publication Date: 2017-06-13
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the problem that the stability of the existing copper ion ink and the conductivity of the copper film cannot meet the requirements for use at the same time, and provides a method for improving the stability of the copper ion ink and the conductivity of the copper film, which is characterized in that it comprises the following steps:

Method used

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  • Method for improving stability of copper ion ink and conductivity of copper film
  • Method for improving stability of copper ion ink and conductivity of copper film
  • Method for improving stability of copper ion ink and conductivity of copper film

Examples

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Embodiment 1

[0025] (1) Preparation of ink stock solution: Add phenolic resin to absolute ethanol and stir evenly; then, according to the complexation ratio of 1:2, anhydrous copper formate from copper source, ligand 2-ethylhexylamine and 2-amino- Dissolve 2-methyl-1-propanol in the above-mentioned ethanol solution, fully stir at 35°C, and prepare ink stock solution, wherein the mass fraction of copper ions is 9.5%, the mass fraction of phenolic resin is 0.1%, and 2-ethylhexylamine accounts for The molar percentage of total ligands is 95%;

[0026] (2) Preparation of ready-to-use ink: add ultrapure water to the ink stock solution obtained in step (1) one day before printing, mix evenly, the mass fraction of ultrapure water is 1-2%, and seal the ink at room temperature after preparation;

[0027] (3) Print the ink prepared in step (2) on the polyimide film, ventilate and dry it at 50°C, and then transfer it to 250°C for heating for 30min under a nitrogen atmosphere to obtain a copper film; ...

Embodiment 2

[0030] (1) Prepare stock solution: add polyamide resin to absolute ethanol, stir evenly; then according to the complexation ratio of 1:2, anhydrous copper formate of copper source, ligand n-octylamine and 2-amino-2-formazol Base-1-propanol was dissolved in the above ethanol solution, fully stirred at 35°C, and prepared into an ink stock solution, wherein the mass fraction of copper ions was 9%, the mass fraction of polyamide was 0.1%, and the molar percentage of n-octylamine to the total ligands 75%;

[0031] (2) Preparation of ready-to-use ink: add ultrapure water to the ink stock solution obtained in step (1) one day before printing, mix evenly, the mass fraction of ultrapure water is 0.5-2%, and seal the ink at room temperature after preparation;

[0032] (3) Print the ink prepared in step (2) on a glass plate, ventilate and dry at 50°C, and then transfer to a nitrogen atmosphere and heat at 200°C for 30min to obtain a copper film;

[0033] (4) The surface resistance and t...

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Abstract

The invention discloses a method for improving the stability of copper ion ink and the conductivity of a copper film. The method comprises the following steps: dissolving a mixed ligand of anhydrous organic acid copper salt, alkylamine and hydramine in an anhydrous alcohol solvent, adding an alcohol-soluble binding agent to obtain a uniform and stable ink stock solution, adding a certain proportion of water prior to ink jet printing to prepare ink, printing the ink on a substrate in a ink jet printing manner, and performing heating and reduction in nitrogen to obtain the conductive copper film. The method adopts anhydrous organic acid copper salt and the anhydrous solvent and adjusts proportions of alkylamine and hydramine, so that the ink stock solution with good room temperature stability can be prepared, has no deterioration for at least three months, and is convenient to transport and store; an appropriate amount of water is added prior to the printing to prepare the ink to be printed into a pattern; the copper film with high conductivity can be obtained by the heating and the reduction in the nitrogen after drying; and the resistivity of the copper film obtained by the reduction at below 250 DEG C is only 3-10 times of that of bulk copper. The method is easy and simple to operate, and gives consideration to the room temperature stability of the ink and the high conductivity of the copper film.

Description

technical field [0001] The invention belongs to the technical field of conductive ink, and in particular relates to a method for improving the stability of copper ion ink and the conductivity of copper film. Background technique [0002] In the traditional electronics industry, photolithography technology is widely used to make circuits. However, this method involves etching, plate making, electroplating and other processes, which not only takes a long time to process, wastes raw materials, but also pollutes the environment. Printed electronics technology is an emerging technology that uses printing methods to print liquid functional materials on various substrates to make electronic products. Compared with traditional electronic product manufacturing methods, printed electronic technology has unparalleled advantages in the manufacture of large-area, flexible, transparent, and low-cost electronic products, and is more environmentally friendly and resource-saving. Therefore,...

Claims

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Application Information

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IPC IPC(8): C09D11/52C09D11/38C09D11/102C09D11/103C09D11/03
CPCC09D11/03C09D11/102C09D11/103C09D11/38C09D11/52
Inventor 王涛许文
Owner TSINGHUA UNIV
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