LTCC substrate component and eutectic sintering process method thereof

A process method and substrate technology, applied in the field of brazing process in microelectronic assembly, can solve the problems of large microwave loss, large resistivity of conductive adhesive bonding, small size of hair buttons, etc., achieve good welding, achieve high-precision control, The effect of improving consistency

Active Publication Date: 2017-06-20
LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA
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Problems solved by technology

Although conductive adhesive bonding can accurately control the amount and shape of the glue between the LTCC substrate and the carrier cold plate, and reduce the impact on the connector mounting hole, the conductive adhesive bonding has a large resistivity and a small thermal conductivity, resulting in large microwave losses. The thermal resistance of the die is large and the junction temperature is high, which affects the power performance and reliability of the module
[0004] When reflow soldering between the

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  • LTCC substrate component and eutectic sintering process method thereof
  • LTCC substrate component and eutectic sintering process method thereof

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[0033] The specific implementation process of a eutectic sintering process method for LTCC substrate assembly is as follows:

[0034] Step 1: Such as figure 1 , 2 As shown, according to the structural drawing of the LTCC substrate structure 5 that requires eutectic sintering, processing can provide 0.02g / mm2 fixed pressure, 0.1mm positioning accuracy for eutectic sintered products of different thicknesses, and elastic positioning tooling that can conduct good heat transfer. , The elastic positioning tool 1 needs to reserve a high-temperature protective solder mask coating position in the connector mounting hole position on the LTCC substrate structure 5;

[0035] Step 2: Process a preformed silver-tin solder sheet with a thickness of 0.08mm matching the pressure applied by the elastic positioning tool 1 according to the same size of the LTCC substrate structure 5;

[0036] Step 3: Perform ultrasonic cleaning of the elastic positioning tool 1 described in step 1 and reserve it for use...

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Abstract

The invention relates to a LTCC substrate component and a eutectic sintering process method thereof. The LTCC substrate component comprises a LTCC substrate (2), a 0.08mm-thickness preforming silver tin soldering sheet (3), a fuzz button installing hole (a CNA8 high temperature protection resistance welding glue coating position) (4) and a LTCC substrate structure component (5). The LTCC substrate component is placed into an elastic positioning tooling (1) so as to form a product component. The component and the method are suitable for multiple sizes of special-purpose elastic tooling and substrate voidage can be increased to over 90% from below 80%; a protection technology of the fuzz button installing hole is designed so as to realize accurate protection to a welding process of different connector installing holes and subsequent connector installation is not influenced; and simultaneously, a silver tin soldering sheet is served as a welding material so that high precision control of a solder amount can be realized and product consistency is increased.

Description

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Claims

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Application Information

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Owner LEIHUA ELECTRONICS TECH RES INST AVIATION IND OF CHINA
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