LTCC substrate component and eutectic sintering process method thereof
A process method and substrate technology, applied in the field of brazing process in microelectronic assembly, can solve the problems of large microwave loss, large resistivity of conductive adhesive bonding, small size of hair buttons, etc., achieve good welding, achieve high-precision control, The effect of improving consistency
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[0033] The specific implementation process of a eutectic sintering process method for LTCC substrate assembly is as follows:
[0034] Step 1: Such as figure 1 , 2 As shown, according to the structural drawing of the LTCC substrate structure 5 that requires eutectic sintering, processing can provide 0.02g / mm2 fixed pressure, 0.1mm positioning accuracy for eutectic sintered products of different thicknesses, and elastic positioning tooling that can conduct good heat transfer. , The elastic positioning tool 1 needs to reserve a high-temperature protective solder mask coating position in the connector mounting hole position on the LTCC substrate structure 5;
[0035] Step 2: Process a preformed silver-tin solder sheet with a thickness of 0.08mm matching the pressure applied by the elastic positioning tool 1 according to the same size of the LTCC substrate structure 5;
[0036] Step 3: Perform ultrasonic cleaning of the elastic positioning tool 1 described in step 1 and reserve it for use...
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