LTCC substrate component and eutectic sintering process method thereof

Abstract

The invention relates to a LTCC substrate component and a eutectic sintering process method thereof. The LTCC substrate component comprises a LTCC substrate (2), a 0.08mm-thickness preforming silver tin soldering sheet (3), a fuzz button installing hole (a CNA8 high temperature protection resistance welding glue coating position) (4) and a LTCC substrate structure component (5). The LTCC substrate component is placed into an elastic positioning tooling (1) so as to form a product component. The component and the method are suitable for multiple sizes of special-purpose elastic tooling and substrate voidage can be increased to over 90% from below 80%; a protection technology of the fuzz button installing hole is designed so as to realize accurate protection to a welding process of different connector installing holes and subsequent connector installation is not influenced; and simultaneously, a silver tin soldering sheet is served as a welding material so that high precision control of a solder amount can be realized and product consistency is increased.

Description

technical field [0001] The invention relates to a multi-cavity LTCC substrate component low-cavity eutectic sintering process, which belongs to the brazing process technology in microelectronic assembly. Background technique [0002] Restricted by the structure of the antenna interface, multi-channel signal transmission is required for tile components and external signal transmission, which requires an LTCC substrate to have a multi-connector connection mode to achieve multi-channel transceiver signal processing. Usually, fur buttons are used as connectors for signal transmission. Due to the existence of fur buttons, it is necessary to eliminate the influence of different media such as solder and air on the transmission performance. Effective protection to prevent solder materials and impurities from affecting the installation position and size of fur buttons. The operating frequency of microwave components is high, and the overall performance is greatly affected by heat di...

AI Technical Summary

Problems solved by technology

Although conductive adhesive bonding can accurately control the amount and shape of the glue between the LTCC substrate and the carrier cold plate, and reduce the impact on the connector mounting hole, the conductive adhesive bonding has a large resistivity and a small thermal conductivity, resulting in large microwave losses. The thermal resistance of the die is large and the junction temperature is high, which affects the power performance and reliability of the module

[0004] When reflow soldering between the LTCC substrate and the aluminum-silicon cold plate, hot air reflow soldering or infrared reflow soldering is generally used, but due to the limitation of equipment capacity and the complex composition of the solder paste, it is difficult to meet the requirement that the substrate is less than 15% during reflow soldering. The following void rate requirements, and because of the small size of the button, it is difficult to effectively protect the hole where it is placed, which has always been a technical problem

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