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Film for oled encapsulation, manufacturing method thereof, and method for encapsulating oled using the film

A technology of film and water vapor, which is applied in semiconductor/solid-state device manufacturing, coating, electric solid-state devices, etc., can solve the problems of material cracking in OLED, bubble retention, affecting OLED performance and life, etc., to improve performance and prolong OLED The effect of service life and high mechanical strength

Active Publication Date: 2019-09-24
WUHAN CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using UV glue and filling glue for encapsulation, due to the viscous nature of the liquid filling glue, air bubbles that are not easy to get rid of will often be generated in the encapsulation layer when poured into the sealing strip, resulting in air bubbles remaining in the encapsulation layer, and in the air bubbles There is moisture and oxygen, which will affect the performance and life of OLED
[0005] In addition, there are also desiccants combined with UV glue and filling glue for packaging to solve the problem of water vapor and oxygen in the bubbles, but some desiccants are corrosive after filling, causing cracking of the OLED internal materials, especially liquid desiccants.

Method used

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  • Film for oled encapsulation, manufacturing method thereof, and method for encapsulating oled using the film
  • Film for oled encapsulation, manufacturing method thereof, and method for encapsulating oled using the film
  • Film for oled encapsulation, manufacturing method thereof, and method for encapsulating oled using the film

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specific Embodiment

[0064] Hereinafter, the content disclosed by the present invention will be specifically described using specific embodiments. However, the content disclosed in the present invention is not limited to the following examples.

Embodiment 1

[0067] Embodiment 1. OLED packaging film 1

[0068] Butadiene-acrylonitrile epoxy resin (Hypro 1300× sold by Emerald Performance Material, U.S.) of 68g of triglycidyl isocyanurate (TEPIC-S sold by Nissan Chemical), 24g of epoxy-terminated butadiene-acrylonitrile epoxy resin 44ETBN), 8g of phenoxy resin (H360 sold by Japan Ink Chemical Industry Co., Ltd. DIC), 6g of dicyandiamide (sold by Germany Degussa), bis (dimethyl urea) compound (sold by Japan SANAPRO company U-CAT 3513N), photoinitiator (CPI-200S sold by Japanese SANAPRO company) and 1g of the modified nano-montmorillonite D2000 / MMT of the preparation example are mixed evenly, and the mixture is epoxy resin-modified nano-montmorillonite slurry.

[0069] The epoxy resin-modified nano-montmorillonite slurry was precision-coated onto a polyethylene terephthalate release sheet to form a wet film with a thickness of 60 μm, and baked in a continuous oven at 90°C for 10 Minutes, and at the same time, ultraviolet light can be ...

Embodiment 2

[0070] Example 2. OLED encapsulation film 2

[0071] The manufacturing steps are the same as in Example 1, as shown in Table 1, the only difference is that the modified nano-montmorillonite D2000 / MMT of the preparation example added to the epoxy resin / modified nano-montmorillonite slurry is 2 g.

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Abstract

The invention discloses a film for OLED encapsulation, a manufacturing method thereof, and a method for encapsulating OLEDs using the film, wherein the film for OLED encapsulation includes a first release sheet and a water vapor barrier layer, and the water vapor barrier layer is Formed on the peelable surface of the first release sheet, wherein the moisture barrier layer includes modified nano-montmorillonite and epoxy resin. In addition to effectively blocking moisture and oxygen, the film for OLED packaging of the present invention also has properties of high mechanical strength, high thermal stability, gas barrier and solvent resistance, so as to improve the performance of OLED packaging and prolong the service life of OLED.

Description

technical field [0001] The invention relates to a film for encapsulating OLEDs, which can be used for encapsulating OLEDs, especially semiconductor devices. Background technique [0002] OLED (Organic Light Emitting Diode) has already replaced the traditional CRT display due to its advantages of high luminous rate, high brightness, wide viewing angle and fast response speed of the screen, as the light emitting device of the display, such as mobile phone, computer monitor, TV screen, etc Handheld devices, or other devices used to display information. [0003] Today, the OLED industry has been devoting itself to the development of OLED packaging technology. Whether the OLED packaging is good or not is often the key factor affecting the internal performance and service life of the OLED. Poor packaging will cause moisture and oxygen to enter the OLED, causing problems such as electrode oxidation, peeling of the light-emitting layer, or material cracking. [0004] Common OLED p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C08J7/12C08L67/02C09D163/00C09D7/62H01L51/52
CPCC09D7/62C09D163/00C08J7/123C08J2367/02C08L2203/206C08K2201/011C08J2463/00C08J7/0427H10K50/84C08L71/12C08K9/08C08K3/346
Inventor 郑宪徽伍得颜铭佑
Owner WUHAN CHOICE TECH CO LTD
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