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Epoxy resin film for nano silicon dioxide modified rfi and preparation method thereof

A technology of nano-silica and epoxy resin, which is applied in the field of inorganic/organic composite materials, can solve problems such as resin films that have not yet been seen, and achieve the effects of reducing the number of hydroxyl groups, improving the ease of agglomeration, and reducing the reaction rate

Active Publication Date: 2019-01-29
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And use the commonly used low-viscosity epoxy resin LY1564 as the resin system, which provides more resin formulations for the preparation of resin films, and has not yet seen the use of nano-SiO 2 Relevant reports on modified resin membranes for RFI (resin membrane infiltration)

Method used

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  • Epoxy resin film for nano silicon dioxide modified rfi and preparation method thereof
  • Epoxy resin film for nano silicon dioxide modified rfi and preparation method thereof
  • Epoxy resin film for nano silicon dioxide modified rfi and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment 1: the preparation of epoxy resin film

[0035] Components: epoxy resin LY1564 (g): 100, boron trifluoride ethylamine complex (g): 3, ethylene glycol (g): 15.

[0036] Step 1: Preparation of prepolymer of epoxy resin and boron trifluoride ethylamine complex: prepare a diluent according to the ratio of high-temperature latent curing agent boron trifluoride ethylamine complex and ethylene glycol. Then add the diluted solution into the epoxy resin, heat up to 80° C. in a numerically controlled ultrasonic cleaner, and stir evenly with an electric stirrer to obtain an epoxy resin prepolymer solution.

[0037]Step 2 to prepare epoxy resin film: add the resin prepolymer solution obtained in step 1 to a constant temperature heating magnetic stirrer, heat the mixed solution to 120°C, control the temperature at 120°C for a period of time (5min ~ 10min), when the ring When the temperature of the oxygen prepolymer solution rises above 120°C to 125°C, the epoxy resin mix...

Embodiment 2

[0045] Example 2: Nano-SiO 2 Preparation of modified epoxy resin film

[0046] Components: epoxy resin LY1564 (g): 100, boron trifluoride ethylamine complex (g): 3, ethylene glycol (g): 15. nano-SiO 2 (gram): 1, coupling agent KH-550 (gram): 0.05, absolute ethanol (gram): 10.

[0047] Step 1: Preparation of prepolymer of epoxy resin and boron trifluoride ethylamine complex: prepare a diluent according to the ratio of high-temperature latent curing agent boron trifluoride ethylamine complex and ethylene glycol. Then add the diluent into the epoxy resin, heat up to 80°C in a numerically controlled ultrasonic cleaner, and stir evenly with an electric stirrer.

[0048] Step 2 Preparation of modified nano-SiO 2 : Nano-SiO 2 Prepare a mixed solution with anhydrous ethanol solution according to the ratio, then add the coupling agent KH550 to the mixed solution, and ultrasonically treat it in a numerically controlled ultrasonic cleaner for 1 hour to make the coupling agent and na...

Embodiment 3

[0057] Example 3: Nano-SiO 2 Preparation of modified epoxy resin film

[0058] Components: epoxy resin LY1564 (g): 100, boron trifluoride ethylamine complex (g): 3, ethylene glycol (g): 15. nano-SiO 2 (gram): 2, coupling agent KH-550 (gram): 0.1, absolute ethanol (gram): 20.

[0059] nano-SiO 2 The preparation steps of the modified epoxy resin film are the same as in Example 2.

[0060] The product performance of embodiment 3 is as follows:

[0061] Performance of cured resin cast body:

[0062] Tensile strength (MPa): 56.96 (GB / T 2567-2008);

[0063] Bending strength (MPa): 89.61 (GB / T 2567-2008);

[0064] Impact strength (kJ / m 2 ): 18.35 (GB / T 2567-2008);

[0065] Glass transition temperature Tg (°C): 96.9 (DMA method).

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Abstract

The invention relates to an epoxy resin film for nano silicon dioxide modified RFI and a preparation method of the epoxy resin film. The resin film is prepared from the components of low-viscosity epoxy resin, a high-temperature latent curing agent, ethylene glycol, a silane coupling agent, absolute ethyl alcohol and nano inorganic particles, wherein a mass ratio of the ethylene glycol to the high-temperature latent curing agent is 1 to 5; a mass ratio of the epoxy resin to the high-temperature latent curing agent is 100 to 3; a mass ratio of the nano particles to the silane coupling agent is 100 to 5; a mass ratio of the nano particles to the absolute ethyl alcohol is 1 to 10. The method comprises the steps of preparing epoxy resin and boron trifluoride ethylamine complex prepolymer, modified nano SiO2, nano SiO2 modified epoxy resin and a nano SIO2 modified epoxy resin film. The preparation method solves the problem that an inorganic particle reinforced resin based composite material cannot be prepared through a resin transfer molding technology; and the prepared resin film is uniform in SiO2 dispersion, is uniform in thickness, can be freely bent at normal temperature, does not stick to hands, and can be reprocessed.

Description

technical field [0001] The invention relates to an inorganic / organic composite material and forms an inorganic / organic doped composite material system. Especially a nano-SiO 2 Modified epoxy resin film and its preparation method. Background technique [0002] With the research and development of composite materials, inorganic particle materials are introduced into organic material systems to form inorganic / organic doped composite material systems, which have the advantages of short process cycle of organic resin-based composite materials, and at the same time have the advantages of inorganic composite material reinforcement, high temperature resistance or The advantages of other functions have better development prospects. However, the introduction of inorganic particles cannot use the traditional low-cost RTM (resin transfer molding) process, and the product structure is relatively simple, but the combination of inorganic particles and resin film infiltration process can ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/36C08J5/18
CPCC08J5/18C08J2363/00C08K3/36C08K9/06C08K2201/003C08K2201/011C08L2203/16C08L63/00
Inventor 黄志雄曾凯秦岩
Owner WUHAN UNIV OF TECH
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