High silicon aluminum matrix composite brazing filler metal and preparation method thereof as well as brazing method

A technology of composite materials and brazing methods, which is applied in the direction of welding/cutting media/materials, welding media, manufacturing tools, etc., can solve the problems of difficulty in meeting the requirements for the use of electronic packaging products in solder joints, poor wettability, etc., and achieve air tightness High, high connection strength, strong diffusion effect

Inactive Publication Date: 2017-07-18
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In summary, the purpose of the present invention is to provide a high-silicon-aluminum-based composite material for the poor wettability of high-silicon-aluminum-based composite materials, which is difficult to mee

Method used

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  • High silicon aluminum matrix composite brazing filler metal and preparation method thereof as well as brazing method
  • High silicon aluminum matrix composite brazing filler metal and preparation method thereof as well as brazing method
  • High silicon aluminum matrix composite brazing filler metal and preparation method thereof as well as brazing method

Examples

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Effect test

Embodiment 1

[0027] A preparation method of high-silicon-aluminum-based composite material brazing filler metal, which is carried out according to the following steps:

[0028] S1. Mixing: Place Al, Cu elemental and Al-20Si master alloy with a purity higher than 99.99% in the graphite crucible of the high vacuum induction melting furnace, and place the Al-10Ce master alloy above the crucible. In the secondary feeding device, the Al-50Mg master alloy is placed in a stainless steel mold, and then the smelting furnace cavity is evacuated to 1×10 -3 Pa~3×10 -3 Pa, then filled with high-purity argon until the pressure in the smelting furnace cavity is 0MPa;

[0029] S2. Electromagnetic induction melting to prepare solder blanks: turn on the induction heating power supply, preheat the graphite crucible to 300℃~400℃, and then heat the graphite crucible to 1500℃~1600℃ within 10min to melt the metal raw materials in the graphite crucible Completely, keep the temperature for 15min, then cool down ...

Embodiment 2

[0038] A preparation method of high-silicon-aluminum-based composite material brazing filler metal, which is carried out according to the following steps:

[0039] S1. Mixing: Place Al, Cu elemental and Al-20Si master alloy with a purity higher than 99.99% in the graphite crucible of the high vacuum induction melting furnace, and place the Al-10Ce master alloy above the crucible. In the secondary feeding device, the Al-50Mg master alloy is placed in a stainless steel mold, and then the smelting furnace cavity is evacuated to 1×10 -3 Pa, then filled with high-purity argon until the pressure in the smelting furnace cavity is 0MPa;

[0040] S2. Preparation of solder blank by electromagnetic induction melting: turn on the induction heating power supply, preheat the graphite crucible to 400°C, and then heat the graphite crucible to 1500°C within 8 minutes, so that the metal raw materials in the graphite crucible are completely melted, and the temperature is kept for 12 minutes. Th...

Embodiment 3

[0049] A preparation method of high-silicon-aluminum-based composite material brazing filler metal, the steps are as follows:

[0050] S1. Mixing: Place Al, Cu elemental and Al-20Si master alloy with a purity higher than 99.99% in the graphite crucible of the high vacuum induction melting furnace, and place the Al-10Ce master alloy above the crucible. In the secondary feeding device, the Al-50Mg master alloy is placed in a stainless steel mold, and then the smelting furnace cavity is evacuated to 1×10 -3 Pa, then filled with high-purity argon until the pressure in the smelting furnace cavity is 0MPa;

[0051] S2. Electromagnetic induction melting to prepare solder blanks: turn on the induction heating power supply, preheat the graphite crucible to 400°C, and then heat the graphite crucible to 1600°C within 10 minutes, so that the metal raw materials in the graphite crucible are completely melted, and the temperature is kept for 12 minutes. Then, the temperature was lowered to...

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Abstract

The invention discloses a high-silicon-aluminum-based composite brazing filler metal, a preparation method thereof and a brazing method using the brazing filler metal. The brazing filler metal is in the form of a foil, and its composition includes mass fractions of 5-8% Si, 19.6-28.6% Cu, 1.2-2.5% Mg, 0.5-3.5% Ce, and the balance is Al. The preparation method comprises the following steps: mixing materials; electromagnetic induction smelting to prepare brazing filler metal blanks; molten salt protecting refined brazing filler metal; and preparing quenched foil-shaped brazing filler metal. The brazing method using the brazing material comprises the following steps: pretreatment of the surface to be welded; clamping of the weldment and the brazing material; and vacuum brazing. The invention solves the problem that the silicon particles and refractory oxide film on the surface of the high-silicon-aluminum-based composite material hinder the wetting and spreading of the brazing filler metal during the welding process of the high-silicon-aluminum-based composite material, and the prepared foil-shaped solder is closely combined with the high-silicon-aluminum-based composite material, and the welding Good seam formation, strong corrosion resistance, high joint shear strength and air tightness, and can be used in the field of electronic packaging of high-silicon-aluminum matrix composite materials.

Description

technical field [0001] The invention belongs to the technical field of material welding and connection, and in particular relates to a high-silicon-aluminum-based composite material brazing material, a preparation method thereof, and a brazing method using the brazing material. Background technique [0002] High silicon aluminum matrix composite material (Vol.%, Si=30~60%) integrates excellent comprehensive properties such as high thermal conductivity, low density, low expansion coefficient and high wear resistance, and is widely used in aviation, aerospace, automobile, space technology and Camera manufacturing and other fields have broad application prospects. Electronic packaging of phased array radar T / R modules is one of its important application directions. It can replace traditional electronic packaging materials such as Kovar alloy, W / Cu, Mo / Cu and become a new A generation of electronic packaging materials. Welding is an important secondary processing technology for...

Claims

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Application Information

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IPC IPC(8): B23K35/28B23K35/40B23K1/008B23K1/20
CPCB23K35/286B23K1/008B23K1/20B23K1/206B23K35/40B23K2103/16
Inventor 徐冬霞王鹏王东斌许国星牛济泰
Owner HENAN POLYTECHNIC UNIV
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