Boron nitride nanotube-nano-cellulose fiber composite material and preparation method thereof

A technology of boron nitride nanotubes and fiber composite materials, which is applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems of poor interaction force, limit the use of boron nitride nanotubes, and difficult to disperse, and achieve the preparation The effect of simple and gentle method, good dimensional stability and good mechanical properties

Active Publication Date: 2017-07-25
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the inert structure of boron nitride nanotubes and their poor interaction with polymers make it difficult to disperse in polymers, which limits the use of boron nitride nanotubes.
On the other hand, traditional polymers are non-biodegradable materials. With the shortening of the life cycle of electronic devices, electronic pollution has become a common concern. It is very necessary to develop biodegradable thermal conductive composite materials.

Method used

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  • Boron nitride nanotube-nano-cellulose fiber composite material and preparation method thereof
  • Boron nitride nanotube-nano-cellulose fiber composite material and preparation method thereof

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Effect test

Embodiment 1

[0036] A preparation method of boron nitride nanotube-nanocellulose fiber composite material, the preparation method is to mix 5mg of boron nitride nanotube with 95mL of 1mg / mL nanocellulose fiber aqueous solution, ultrasonic treatment for 3h, under 0.2Pa Vacuum suction filtration, drying the obtained solid at 50° C. for 24 hours to obtain a boron nitride nanotube-nanocellulose fiber composite material.

Embodiment 2

[0038]A preparation method of boron nitride nanotube-nanocellulose fiber composite material, the preparation method is to mix 40mg of boron nitride nanotube with 60mL of 1mg / mL nanocellulose fiber aqueous solution, ultrasonic treatment for 12h, vacuum under 10Pa Filtrate with suction, and dry the obtained solid at 80° C. for 5 hours to obtain a boron nitride nanotube-nanocellulose fiber composite material.

Embodiment 3

[0040] A preparation method of boron nitride nanotube-nanocellulose fiber composite material, the preparation method is to mix 20mg boron nitride nanotube with 800mL of 0.1mg / mL nanocellulose fiber aqueous solution, sonicate for 8h, under 5Pa Vacuum suction filtration, drying the obtained solid at 60° C. for 20 h to obtain a boron nitride nanotube-nanocellulose fiber composite material.

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Abstract

The invention relates to a boron nitride nanotube-nano-cellulose fiber composite material. The composite material is prepared from the following materials in percentage by mass: 5 to 40 percent of boron nitride nanotube, and 60 to 95 percent of nano-cellulose fiber. The invention further relates to a preparation method of the boron nitride nanotube-nano-cellulose fiber composite material. The preparation method comprises the following steps: mixing the boron nitride nanotube with a nano-cellulose fiber aqueous solution; performing ultrasonic treatment; performing solid-liquid separation to obtain the boron nitride nanotube-nano-cellulose fiber composite material. By adopting the composite material, the interface thermal resistance and phonon scattering action are reduced effectively, the heat-conducting property of the composite material is improved, and high dimension stability is achieved; the composite material is biodegradable. The preparation method is simple and mild, and can be applied to industrial production.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and relates to a boron nitride nanotube material, in particular to a boron nitride nanotube-nanocellulose fiber composite material. Background technique [0002] With the miniaturization and intelligence of electronic components, multi-functional VLSI with higher integration has become the future development trend of integrated circuits, and the development of high-density packaging technology has become inevitable. High-density packaging will inevitably cause an increase in the heat generation density of integrated circuits (chips) and electronic devices, thereby increasing the temperature during operation. In addition, the power consumption of a semiconductor integrated circuit (or chip) is not only related to its integration level, but also closely related to the operating frequency of each electronic component. With the development and gradual application of high-frequency electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L1/02C08K7/24C08J3/28C09K5/14
CPCC08J3/28C08J2301/02C08K7/24C08K2201/003C08K2201/004C08K2201/011C08L2201/06C08L2205/16C09K5/14C08L1/02
Inventor 曾小亮孙蓉么依民许建斌
Owner SHENZHEN INST OF ADVANCED TECH
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