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Resin composite board and production method thereof

A technology of resin compounding and production method, applied in synthetic resin layered products, chemical instruments and methods, paper/cardboard layered products, etc., can solve the problems of long production cycle, low interface bond strength, inconsistent shrinkage rate, etc. To achieve the effect of reducing material loss, reducing material turnover, and reducing labor costs

Inactive Publication Date: 2017-08-11
WELLMADE FLOOR IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. Wood powder is used as filler in WPC base material. Because it contains a large number of hydrophilic groups-hydroxyl groups, plant fibers have strong polarity, while common resin matrices are usually non-polar and non-hydrophilic, so The compatibility between plant fiber and resin matrix is ​​poor, and the interface bonding strength is low, which affects the mechanical properties of WPC substrate;
[0005] 2. The plant filler is easy to degrade and change color during molding processing, and it is easy to produce color difference of the substrate;
[0006] 3. Glue is used for pressing and pasting during the processing, so that the finished WPC composite board will inevitably contain toxic and harmful substances such as formaldehyde, which will affect human health and pollute the environment
[0007] 4. Glue pressing may make the peeling strength between the PVC layer and the WPC substrate insufficient, and it is easy to cause glue opening
[0009] 1. Due to the process of loading and unloading materials and turnover materials caused by segmental lamination, it is bound to require greater consumption in terms of labor costs and labor intensity; the loss and waste caused by the material transfer process is also extremely huge;
[0010] 2. Segmented laminated products often need to go through multiple heating and cooling processes, resulting in huge energy consumption and poor product performance stability;
[0011] 3. The glue coating process is required in the processing technology, and the increase of process steps also makes it difficult to realize continuous production and the production cycle is long
[0014] For products with multi-layer PVC substrates, due to inconsistent shrinkage, warping and deformation are serious, and product stability is poor
[0015] At the same time, the above-mentioned production process has similar deficiencies as those of WPC composite panels.

Method used

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  • Resin composite board and production method thereof
  • Resin composite board and production method thereof
  • Resin composite board and production method thereof

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Embodiment Construction

[0046] Exemplary embodiments of the present invention are described below with reference to the drawings. It should be understood that the following description of the present invention is only used to illustrate the principle and exemplary implementation of the present invention, and is not intended to limit the scope of the present invention.

[0047] refer to figure 1 , in the first embodiment of the present invention, the resin composite board includes two layers, namely, the surface layer 1 and the resin substrate layer (ie, the resin composite substrate) 2 . The surface layer 1 can be formed by one or more of plastic film, bamboo chips, wood chips, wear-resistant materials, rubber, paper, leather, metal, cloth, carpet, cork, composite materials and the like. The resin base layer 2 is mainly composed of resin powder.

[0048] In this embodiment, the resin base material layer (ie, the resin composite base material) 2 may be expressed in the form of three layers of the fi...

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Abstract

The invention provides a resin composite plate and a production method thereof. The resin composite board includes a surface layer and a resin composite base material, and the surface layer and the resin composite base material are bonded by melting without using an adhesive. The resin composite substrate is extruded through the extrusion system, and the surface layer and the newly extruded resin composite substrate are sent to the multi-roll calendering system together, and the surface layer is formed by using the heat of the multi-roll calender system and the newly extruded resin composite substrate It is melted and pressed together with the resin composite substrate. The resin composite board of the present application will not contain toxic and harmful substances such as formaldehyde due to the use of adhesives. In the production method of the resin composite plate of the present invention, continuous production can be realized by using the extrusion system and the multi-roller calendering system, which can reduce material turnover, reduce labor costs, reduce material loss, and achieve low energy consumption and stable product performance , short production cycle and so on.

Description

technical field [0001] The invention relates to the field of composite plates, in particular to a novel multi-layer environment-friendly resin composite plate and a continuous production method thereof. Background technique [0002] In the production of existing composite panels in China, segmented lamination processing methods are commonly used, such as reinforced composite panels, solid wood composite panels, bamboo wood panels, PVC (polyvinyl chloride) plastic panels, WPC (Wood Plastic Composite) Production of composite panels (ie, wood-plastic composite panels), etc. [0003] Taking WPC composite sheet as an example, its structure is mainly divided into four layers: wear-resistant layer, color film layer, PVC layer and WPC substrate. The processing method is roughly divided into four steps: the first step is calendering to produce PVC layer; the second step is to laminate the wear-resistant layer, color film layer and PVC layer into a whole; the third step is to extrude...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/02B32B9/04B32B15/08B32B21/08B32B25/08B32B27/06B32B27/10B32B27/32B32B29/00C08L27/06C08L23/06C08K13/02C08K3/26
CPCB32B9/00B32B9/02B32B9/025B32B9/045B32B15/08B32B21/08B32B25/08B32B27/06B32B27/10B32B27/32B32B29/002C08L27/06
Inventor 陈竹
Owner WELLMADE FLOOR IND CO LTD
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