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A kind of preparation method of high heat resistance, high thermal conductivity copper clad laminate

A high thermal conductivity, high heat resistance technology, applied in chemical instruments and methods, lamination auxiliary operations, lamination and other directions, can solve the problems of neglecting high thermal conductivity and high heat resistance, and can not use copper clad laminates for electrical conductors. Heat-enhancing effect

Active Publication Date: 2019-09-20
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among high thermal conductivity materials, the thermal conductivity of graphene is 5000W / m·K, which is 36 times that of silicon, 20 times that of gallium arsenide, and more than ten times that of copper (401W / m·K at room temperature). For the silicon carbide, boron nitride, aluminum oxide and other thermal conductive materials currently used, but graphene is a good conductor, people often notice that conductors cannot be used for copper clad laminates, while ignoring the superb thermal conductivity and high heat resistance sex

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for preparing a copper-clad laminate with high heat resistance and high thermal conductivity, the steps are as follows:

[0026] (1) Preparation of high-electric insulation prepreg glue: Mix 35 parts of bisphenol A epoxy resin, 25 parts of phenolic resin, 25 parts of alumina, 20 parts of silicon micropowder, 5 parts of ceramic powder and 60 parts of acetone, and stir well ;

[0027] (2) Preparation of high heat resistance and high thermal conductivity prepreg glue: mix 10 parts of bisphenol A epoxy resin, 5 parts of phenolic resin, 50 parts of graphene, 1 part of ceramic powder and 40 parts of acetone, and stir evenly;

[0028] (3) Immerse the electronic grade glass fiber cloth in the glue solution prepared in step (1), dry it at 130°C, control the glue content to 45%, and the fluidity to 10%, to obtain a high-electric insulation prepreg ;

[0029] (4) Immerse electronic-grade glass fiber cloth or cellophane or glass mat in the glue solution prepared in step ...

Embodiment 2

[0032] A method for preparing a copper-clad laminate with high heat resistance and high thermal conductivity, the steps are as follows:

[0033] (1) Preparation of high-electric insulation prepreg glue: Mix 50 parts of dimer acid modified epoxy resin, 35 parts of phenolic resin, 45 parts of alumina, 25 parts of silicon micropowder, 10 parts of ceramic powder and 70 parts of toluene, and stir Uniform;

[0034] (2) Preparation of high heat resistance and high thermal conductivity prepreg glue: mix 40 parts of dimer acid modified epoxy resin, 25 parts of phenolic resin, 100 parts of graphene, 15 parts of silicon micropowder and 100 parts of toluene, and stir evenly;

[0035] (3) Immerse the electronic grade glass fiber cloth in the glue solution prepared in step (1), dry it at 190°C, control the glue content to 55%, and the fluidity to 20%, to prepare a high-electric insulation prepreg ;

[0036] (4) Immerse electronic-grade glass fiber cloth or cellophane or glass mat in the g...

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PUM

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Abstract

The invention relates to a preparation method for a copper-clad plate with high heat resistance and high heat conductivity, belonging to the technical field of production of copper-clad plates. The copper-clad plate prepared in the invention has substantially improved heat resistance and is free of layering and bubbling in floating soldering at 288 DEG C for 60 min or above; the heat conductivity of the copper-clad plate reaches 30 W / m.K or above; and the copper-clad plate is applicable to leadless welding process and automobiles, LEDs, the military industry, spaceflight and the like needing circuit boards with high heat dissipation.

Description

technical field [0001] The invention relates to a copper clad laminate, in particular to a method for preparing a copper clad laminate with high heat resistance and high thermal conductivity, and belongs to the technical field of copper clad laminate production. Background technique [0002] With the development of printed circuit boards (PCBs) towards high density, multilayer and lightweight, and the need for lead-free reflow soldering for environmental protection, copper clad laminates are required to have high heat resistance; and special printed circuit boards ( PCB), high thermal conductivity copper clad laminates are required to carry the installation of high-power (automotive, LED, PCB) electrical appliances, so it is necessary to develop a copper clad laminate with high heat resistance and superconductivity. [0003] Among high thermal conductivity materials, the thermal conductivity of graphene is 5000W / m·K, which is 36 times that of silicon, 20 times that of galliu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/06B32B37/12B32B38/08
Inventor 陈长浩李宝东朱义刚王卫兴秦伟峰谢峰姜晓亮朱琪琪李洪学
Owner SHANDONG JINBAO ELECTRONICS