Insulating paint for electronic components, and preparation method of insulating paint

A technology of electronic components and insulating varnish, which is applied in the direction of fireproof coatings, coatings, etc., can solve the problems of long curing time, poor high temperature resistance, and poor adhesion, etc., to achieve enhanced heat conduction and heat dissipation capabilities, and good heat conduction and heat transfer performance , Improve the effect of job stability

Inactive Publication Date: 2017-10-03
HEFEI TONGYOU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the insulating varnish produced in China generally has the problems of long curing time, poor high temperature resistance and poor adhesion, and is prone to cracking and warping, which affects the insulating effect of the insulating varnish to a certain extent.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] This embodiment relates to an insulating varnish for electronic components, including the following raw materials in parts by weight: 20 parts of cellulose nitrate, 15 parts of modified polyester resin, 12 parts of epoxy modified silicone resin, methyl vinyl 6 parts of dichlorosilane, 5 parts of dicumyl peroxide, 13 parts of organic solvent, 3 parts of modified nano-diamond, 6 parts of filler, 1.5 parts of leveling agent, 1 part of film forming agent, 1 part of curing agent, heat dissipation 4 parts of enhancer, 2 parts of dispersant.

[0026] Wherein, the film forming agent is dimethyl silicone rubber.

[0027] Wherein, the heat dissipation enhancer is nanometer aluminum oxide.

[0028] Wherein, the curing agent is diethylenetriamine.

[0029] Wherein, described modified nano-diamond is made by following steps:

[0030] (1) Treatment of nano-diamonds: Select nano-diamonds with a particle size of ≤500nm, put them into a small reaction kettle, inject concentrated sulf...

Embodiment 2

[0038] This embodiment relates to an insulating varnish for electronic components, including the following raw materials in parts by weight: 30 parts of cellulose nitrate, 25 parts of modified polyester resin, 24 parts of epoxy modified silicone resin, methyl vinyl 14 parts of dichlorosilane, 10 parts of dicumyl peroxide, 22 parts of organic solvent, 5 parts of modified nano-diamond, 11 parts of filler, 2.5 parts of leveling agent, 5 parts of film forming agent, 5 parts of curing agent, heat dissipation 12 parts of enhancer, 3 parts of dispersant.

[0039] Wherein, the film forming agent is methyl vinyl silicone rubber.

[0040] Wherein, the heat dissipation enhancer is nano-silicon carbide.

[0041] Wherein, the curing agent is m-xylylenediamine.

[0042] Wherein, described modified nano-diamond is made by following steps:

[0043] (1) Treatment of nano-diamonds: Select nano-diamonds with a particle size of ≤500nm, put them into a small reaction kettle, inject concentrated s...

Embodiment 3

[0051] This embodiment relates to an insulating varnish for electronic components, including the following raw materials in parts by weight: 23 parts of cellulose nitrate, 18 parts of modified polyester resin, 15 parts of epoxy modified silicone resin, methyl vinyl 8 parts of dichlorosilane, 7 parts of dicumyl peroxide, 15 parts of organic solvent, 3.5 parts of modified nano-diamond, 8 parts of filler, 1.7 parts of leveling agent, 2 parts of film forming agent, 2 parts of curing agent, heat dissipation 6 parts of enhancer, 2.3 parts of dispersant.

[0052] Wherein, the film-forming agent is polydimethylsiloxane.

[0053] Wherein, the heat dissipation enhancer is vinyltrimethoxysilane modified aluminum oxide.

[0054] Wherein, the curing agent is diethylenetriamine and m-xylylenediamine.

[0055] Wherein, described modified nano-diamond is made by following steps:

[0056] (1) Treatment of nano-diamonds: Select nano-diamonds with a particle size of ≤500nm, put them into a sm...

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Abstract

The invention discloses insulating paint for electronic components. The insulating paint for the electronic components comprises the following raw materials in parts by weight: 20 to 30 parts of cellulose nitrate, 15 to 25 parts of modified polyester resin, 12 to 24 parts of epoxy modified organic silicon resin, 6 to 14 parts of dichloromethylvinylsilane, 5 to 10 parts of dicumyl peroxide, 13 to 22 parts of an organic solvent, 3 to 5 parts of modified nanometer diamond, 6 to 11 parts of fillers, 1.5 to 2.5 parts of a flatting agent, 1 to 5 parts of a film-forming agent, 1 to 5 parts of a curing agent, 4 to 12 parts of a heat-dissipating enhancer and 2 to 3 parts of a dispersing agent. The insulating paint for the electronic components, provided by the invention, has high adhesiveness and high temperature resistance, has the advantage that heat does not gather in high-power density electrical equipment and is conducted and dissipated by a dipping or coating insulating layer successfully, and improves the load carrying capability of the electrical equipment.

Description

technical field [0001] The invention belongs to the technical field of electronic components, and in particular relates to an insulating varnish used for electronic components and a preparation method thereof. Background technique [0002] Insulation is a safety measure that uses a non-conductive substance to isolate or wrap the charged body to protect against electric shock. Good insulation is the most basic and reliable means to ensure the safe operation of electrical equipment and circuits and prevent personal electric shock accidents. Insulating varnish is a kind of special varnish in the varnish category. It is based on high molecular polymer and can be solidified into an insulating film or an important insulating material for insulating the whole under certain conditions. At present, the insulating varnish produced in China generally has the problems of long curing time, poor high temperature resistance and poor adhesion, and is prone to cracking and warping, which af...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/06C09D5/25C09D7/12
CPCC09D4/06C09D5/00C09D5/18
Inventor 李丹丹
Owner HEFEI TONGYOU ELECTRONICS TECH CO LTD
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