Insulating material for light emitting diode package and preparation method thereof

Abstract

The invention discloses an insulating material for light emitting diode package, and the insulating material comprises the following raw materials by weight: 30-50 parts of epoxy resin, 15-25 parts of vinyl silicone rubber, 10-15 parts of polyamide, 3-6 parts of nano silica, 4-5 parts of precipitated silica, 10-15 parts of polytetrafluoroethylene, 12-17 parts of nano-scale alumina hydrate particles, 4-7 parts of Tris(2-ethylhexyl) phosphate , 6-10 parts of silicon carbide, 4-7 parts of carbon fiber, 3-7 parts of antimony oxide, 5-10 parts of a curing agent, 2-3 parts of an antioxidant, 3-6 parts of a silane coupling agent and 7-15 parts of a tackifier. The insulating material for the light emitting diode package can improve the comprehensive performance of a substrate and prolong the service life of components while meeting the basic properties of a packaging material.

Description

technical field [0001] The invention belongs to the technical field of insulating materials, and in particular relates to an insulating material used for packaging light-emitting diodes and a preparation method thereof. Background technique [0002] In the electronics and information industries, many functional components need to be packaged as a whole after assembly to improve their performance and service life. As a packaging material, it can neither affect the performance of the component, but also play a protective role. At present, with the development of electronics, information industry and science and technology, people put forward requirements for packaging materials in terms of thermal conductivity, insulation, necessary mechanical properties and resistance to chemical environments. However, metal materials and polymer materials alone cannot satisfy the above properties at the same time. In the prior art, the two are often used in combination, and the metal or in...

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Problems solved by technology

However, the use of metal materials and polymer materials alone cannot meet the above properties at the same time.

In the prior art, the two are often used in combination, and the metal or inorganic filler is used to fill the low-viscosity, heat-resistant resin with a high multiple. The mechanical properties of the packaging material prepared by this method are not good, and the material is hard and brittle. Vibration is prone to cracks, which in turn affects the service life of components