Novel composite used for computer casing
A technology for composite materials and computer shells, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve problems such as poor grounding, dim color, difficult processing and molding, etc., to improve fluidity and release moldability, reduce interface adhesion performance, and reduce the overall production cost
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Embodiment 1
[0026] This embodiment provides a novel composite material for a computer casing, the novel composite material for a computer casing includes a first layer, a second layer, a third layer and a fourth layer, and the first layer is plastic layer, the second layer is an alloy layer, the third layer is a fiber layer, and the fourth layer is a plastic layer;
[0027] The plastic layer includes polyphenylene sulfide, polyimide, polyether ether ketone and additives, the additives include phosphorus pentoxide and potassium hydroxide, the polyphenylene sulfide, polyimide, polyetherether The mass ratio of ketone and additive is 13:6:5:1, and the mass concentration of described potassium hydroxide is 9%;
[0028] The alloy layer includes aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant, and the mass ratio of the aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant is 13:5:4:1, wherein the aluminum-magnesium Aluminum in the alloy accounts for 8...
Embodiment 2
[0040] This embodiment provides a novel composite material for a computer casing, the novel composite material for a computer casing includes a first layer, a second layer, a third layer and a fourth layer, and the first layer is plastic layer, the second layer is an alloy layer, the third layer is a fiber layer, and the fourth layer is a plastic layer;
[0041] The plastic layer includes polyphenylene sulfide, polyimide, polyether ether ketone and additives, the additives include phosphorus pentoxide and potassium hydroxide, the polyphenylene sulfide, polyimide, polyetherether The mass ratio of ketone and additive is 9:9:3:1, and the mass concentration of described potassium hydroxide is 13%;
[0042] The alloy layer includes aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant, and the mass ratio of the aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant is 11:7:2:1, wherein the aluminum-magnesium Aluminum in the alloy accounts for 8...
Embodiment 3
[0054] This embodiment provides a novel composite material for a computer casing, the novel composite material for a computer casing includes a first layer, a second layer, a third layer and a fourth layer, and the first layer is plastic layer, the second layer is an alloy layer, the third layer is a fiber layer, and the fourth layer is a plastic layer;
[0055] The plastic layer includes polyphenylene sulfide, polyimide, polyether ether ketone and additives, the additives include phosphorus pentoxide and potassium hydroxide, the polyphenylene sulfide, polyimide, polyetherether The mass ratio of ketone and additive is 11:7:4:1, and the mass concentration of described potassium hydroxide is 11%;
[0056] The alloy layer includes aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant, and the mass ratio of the aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant is 12:6:3:1, wherein the aluminum-magnesium Aluminum in the alloy accounts for ...
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