Novel composite used for computer casing

A technology for composite materials and computer shells, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve problems such as poor grounding, dim color, difficult processing and molding, etc., to improve fluidity and release moldability, reduce interface adhesion performance, and reduce the overall production cost

Active Publication Date: 2017-10-24
威海台基电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned materials all have their own shortcomings. Among them, the disadvantage of polycarbonate PC is that it is relatively brittle and will break if it falls; ABS engineering plastic has a high density and heavy weight, which is not good for the weight control of notebooks, so it is generally used in Products that focus on mobility will not be used, and the thermal conductivity of plastic itself is poor, so it is not conducive to the heat dissipation of notebooks; aluminum-magnesium alloys are not very wear-resistant, and the color will appear dull after a long time, and painted products Prone to scratches, paint peeling, etc.
Moreover, its cost is high, and its processing is more difficult than ABS, so notebooks generally only use aluminum-magnesium alloys on the top cover or palm rest, and few products use aluminum-magnesium alloys to manufacture the entire chassis; the disadvantage of carbon fiber is the cost. It is relatively high, and it is not as easy to form as an ABS shell. In addition, there is another disadvantage of the carbon fiber shell, that is, if the grounding is not good
[0005] The above materials all have the problem of being difficult to degrade

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment provides a novel composite material for a computer casing, the novel composite material for a computer casing includes a first layer, a second layer, a third layer and a fourth layer, and the first layer is plastic layer, the second layer is an alloy layer, the third layer is a fiber layer, and the fourth layer is a plastic layer;

[0027] The plastic layer includes polyphenylene sulfide, polyimide, polyether ether ketone and additives, the additives include phosphorus pentoxide and potassium hydroxide, the polyphenylene sulfide, polyimide, polyetherether The mass ratio of ketone and additive is 13:6:5:1, and the mass concentration of described potassium hydroxide is 9%;

[0028] The alloy layer includes aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant, and the mass ratio of the aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant is 13:5:4:1, wherein the aluminum-magnesium Aluminum in the alloy accounts for 8...

Embodiment 2

[0040] This embodiment provides a novel composite material for a computer casing, the novel composite material for a computer casing includes a first layer, a second layer, a third layer and a fourth layer, and the first layer is plastic layer, the second layer is an alloy layer, the third layer is a fiber layer, and the fourth layer is a plastic layer;

[0041] The plastic layer includes polyphenylene sulfide, polyimide, polyether ether ketone and additives, the additives include phosphorus pentoxide and potassium hydroxide, the polyphenylene sulfide, polyimide, polyetherether The mass ratio of ketone and additive is 9:9:3:1, and the mass concentration of described potassium hydroxide is 13%;

[0042] The alloy layer includes aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant, and the mass ratio of the aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant is 11:7:2:1, wherein the aluminum-magnesium Aluminum in the alloy accounts for 8...

Embodiment 3

[0054] This embodiment provides a novel composite material for a computer casing, the novel composite material for a computer casing includes a first layer, a second layer, a third layer and a fourth layer, and the first layer is plastic layer, the second layer is an alloy layer, the third layer is a fiber layer, and the fourth layer is a plastic layer;

[0055] The plastic layer includes polyphenylene sulfide, polyimide, polyether ether ketone and additives, the additives include phosphorus pentoxide and potassium hydroxide, the polyphenylene sulfide, polyimide, polyetherether The mass ratio of ketone and additive is 11:7:4:1, and the mass concentration of described potassium hydroxide is 11%;

[0056] The alloy layer includes aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant, and the mass ratio of the aluminum-magnesium alloy, carbon fiber, plant fiber starch and lubricant is 12:6:3:1, wherein the aluminum-magnesium Aluminum in the alloy accounts for ...

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PUM

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Abstract

The invention belongs to the technical field of computer materials and provides a novel composite used for a computer casing. The novel composite used for the computer casing comprises a first layer, a second layer, a third layer and a fourth layer, wherein the first layer is a plastic layer, the second layer is an alloy layer, the third layer is a fiber layer and the fourth layer is a plastic layer. The novel composite used for the computer casing is formed by compositing four layers of different materials, wherein an additive comprising phosphorus pentoxide and an oxidant is added to the plastic layers, and phosphorus pentoxide has high oxidability and can decompose plastic; the alloy layer comprises aluminum and magnesium alloys, carbon fiber, plant fiber starch and a lubricant, the toughness of the composite is improved by compositing the aluminum and magnesium alloys and the carbon fiber, and the degradable effect is realized after plant fiber starch is added.

Description

technical field [0001] The invention belongs to the technical field of computer materials, and in particular relates to a novel composite material used for computer casings. Background technique [0002] Laptops are also known as "portable computers", and their biggest feature is their compact body, which is easier to carry than PCs. NotebookComputer, also known as laptop, PDA or laptop, is a small, portable personal computer. [0003] Traditional notebook computer shell materials usually use the following types: polycarbonate PC, ABS engineering plastics, aluminum-magnesium alloy, carbon fiber, etc. [0004] However, the above-mentioned materials all have their own shortcomings. Among them, the disadvantage of polycarbonate PC is that it is relatively brittle and will break if it falls; ABS engineering plastics have a high density and heavy weight, which is not good for the weight control of notebooks, so it is generally used in Products that focus on mobility will not be...

Claims

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Application Information

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IPC IPC(8): B32B27/28B32B27/18B32B15/08B32B15/14B32B27/02C08L81/02C08L79/08C08L61/16C08L23/06C08L67/04C08L1/02C08K5/057C08K3/32C08K3/22
CPCB32B5/02B32B15/08B32B15/14B32B27/18B32B27/28B32B2262/14B32B2307/558C08K2201/014C08L67/04C08L81/02C08L2203/20C08L2205/035C08L2205/16C08L79/08C08L61/16C08L23/06C08K3/32C08K3/22C08L1/02C08K5/057
Inventor 齐慧
Owner 威海台基电子科技有限公司
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