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Plating solution for neodymium-iron-boron product direct copper plating, preparation method and plating method

An electroplating solution and NdFeB technology, applied in the field of copper electroplating, can solve the problems of complex electroplating process, high electroplating cost, and large shielding effect, and achieve the effects of good ductility, low cost and stable electroplating solution

Active Publication Date: 2017-11-03
CENT IRON & STEEL RES INST +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above analysis, the present invention aims to provide an electroplating solution, a preparation method and an electroplating method for direct copper electroplating of NdFeB products, so as to solve the shielding effect caused by the complicated electroplating process, high electroplating cost and thick coating in the prior art. big problem

Method used

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  • Plating solution for neodymium-iron-boron product direct copper plating, preparation method and plating method
  • Plating solution for neodymium-iron-boron product direct copper plating, preparation method and plating method
  • Plating solution for neodymium-iron-boron product direct copper plating, preparation method and plating method

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Embodiment 1

[0046] The content of each component in the electroplating solution of a kind of NdFeB product direct electroplating copper of the present embodiment is:

[0047]

[0048] The preparation method of the electroplating solution of a kind of NdFeB product direct electroplating copper of this embodiment specifically comprises the following steps:

[0049] Step 1. Add 80 liters of deionized water into the container, and under stirring, add 700 grams of copper pyrophosphate, and stir until completely dissolved;

[0050] Step 2. While stirring, add 2200 grams of EDTA and continue stirring until fully dissolved;

[0051] Step 3. In the state of stirring, add 1200 grams of borax, 2200 milliliters of hydrazine hydrate, 30 grams of sodium dodecylbenzenesulfonate, and 1300 milliliters of lactic acid, and continue stirring after completion;

[0052]Step 4, adding 12.5 liters of deionized water to constant volume, stirring evenly, and preparing an electroplating solution for electroplat...

Embodiment 2

[0060] The content of each component in the electroplating solution of a kind of NdFeB product direct electroplating copper of the present embodiment is:

[0061]

[0062] The preparation method of the electroplating solution of a kind of NdFeB product direct electroplating copper of this embodiment specifically comprises the following steps:

[0063] Step 1. Add 80 liters of deionized water into the container, and under stirring, add 500 grams of copper pyrophosphate, and stir until completely dissolved;

[0064] Step 2. While stirring, add 2000 grams of EDTA and continue stirring until fully dissolved;

[0065] Step 3. While stirring, add 1000 grams of borax, 2300 ml of hydrazine hydrate, 20 grams of sodium dodecylbenzenesulfonate, and 1500 ml of lactic acid, and continue stirring after completion;

[0066] Step 4, adding 13 liters of deionized water and stirring evenly to prepare an electroplating solution for electroplating copper on the surface of NdFeB products.

[...

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Abstract

The invention relates to technical field of copper plating in particular to a plating solution for neodymium-iron-boron product direct copper plating and meanwhile further discloses a preparation and plating method of the plating solution for neodymium-iron-boron product direct copper plating. A solvent of the plating solution is deionized water, and the plating solution comprises the components, by concentration, of 5-15 g / L of copper pyrophosphate, 15-25 ml / L of hydrazine hydrate, 15-30 g / L of EDTA, 5-20 g / L of borax, 0.1-0.3 g / L of sodium dodecylbenzene sulfonate and 10-20 ml / L of lactic acid. The plating solution for neodymium-iron-boron product direct copper plating and the preparation and plating method of the plating solution for neodymium-iron-boron product direct copper plating have the beneficial effects that through the plating solution, a copper layer is directly plated on a neodymium-iron-boron product, and a compact and shining plating layer is formed on the neodymium-iron-boron surface; through the plating solution, the neodymium-iron-boron product can be directly plated, the depth capacity of the copper plating layer can further be good, the copper plating layer is smooth and good in ductility, and the plating solution is stable; and the technique is simple, the cost is low, and the potential industrial application value is achieved.

Description

technical field [0001] The invention relates to the technical field of copper electroplating, in particular to an electroplating solution for direct copper electroplating of NdFeB products, a preparation method and an electroplating method. Background technique [0002] NdFeB magnet is currently the most excellent permanent magnet material in the world. NdFeB has extremely high energy density, strong magnetic energy product and excellent magnetic coercive force. These advantages make NdFeB widely used in computers and medical equipment. , Communication devices and other fields are widely used, known as the "Magnetic King" in the field of magnetism. However, since NdFeB material is a powder sintered material and its surface is relatively loose and porous, it is easy to be oxidized and corroded, so the NdFeB material has poor corrosion resistance to the outside world during use. This not only puts forward higher requirements for the existing NdFeB protection technology, but a...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D7/00C25D5/36
CPCC25D3/38C25D5/36C25D7/001
Inventor 陈小平王向东王帆贾书君刘清友汪兵黄涛
Owner CENT IRON & STEEL RES INST
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