Copper electroplating filling method for fine blind holes in high-density circuit board

A filling method and circuit board technology, which is applied in the direction of electrical connection formation of printed components, etc., can solve the problems that copper plating technology cannot meet the process requirements and electroplating technology requirements are high, so as to broaden the selection range and use conditions, improve the electroplating filling effect, cost reduction effect

Active Publication Date: 2017-11-03
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Microporous copper electroplating filling is one of the most important processes in the manufacture of high-density circuit boards. It has high requirements for electroplating technology. The filling structure must not only avoid defects such as holes and gaps, but also the surface thickness and groove depth must be strictly limited. Within a certain range, the traditional copper plating technology cannot meet the process requirements

Method used

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  • Copper electroplating filling method for fine blind holes in high-density circuit board
  • Copper electroplating filling method for fine blind holes in high-density circuit board
  • Copper electroplating filling method for fine blind holes in high-density circuit board

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Embodiment 1

[0047] In this embodiment, the geometric dimension of the blind hole on the circuit board: 100 μm (diameter) × 50 μm (depth); figure 2 shown in The operation procedure of the jet flow device as a parameter is as follows: the jet angle is 90° and lasts for 10 minutes. One cycle is 10min, and the total plating time is 1h.

[0048] Pretreatment conditions: Soak for 5 minutes under the condition of 25L / min jet flow.

[0049] Basic plating solution ratio: 200g / L copper sulfate pentahydrate, 50g / L sulfuric acid, and 99mg / L sodium chloride, and the rest is water.

[0050] Additives include inhibitor, brightener and leveling agent, inhibitor: brightener: leveling agent=100ppm: 10ppm: 5ppm. In this embodiment, the inhibitor is polyethylene glycol, the brightener is sodium polydithiodipropane sulfonate, and the leveling agent is Kenna Green B.

[0051] Experimental conditions: temperature = 25°C, flow rate = 15L / min, current density = 2A / dm 2 , Plating time = 60min.

[0052] Res...

Embodiment 2

[0054] In this embodiment, the geometric dimension of the blind hole on the circuit board: 100 μm (diameter) × 50 μm (depth); Figure 4 shown in The operation procedure of the jet flow device as a parameter is as follows: jet angle 45°, last 1min; jet angle 90°, last 2min; jet angle 135°, last 1min; jet angle 180°, last 1min; jet angle -180°, Last 1min; spray angle -135°, last 1min; spray angle -90°, last 2min; spray angle -45°, last 1min. One cycle is 10min, and the total plating time is 1h.

[0055] Pretreatment conditions: Soak for 5 minutes under the condition of 25L / min jet flow.

[0056] Basic plating solution ratio: 200g / L copper sulfate pentahydrate, 50g / L sulfuric acid, and 99mg / L sodium chloride, the rest is water.

[0057] Additives include inhibitor, brightener and leveling agent, inhibitor: brightener: leveling agent=100ppm: 10ppm: 5ppm. In this embodiment, the inhibitor is polyethylene glycol, the brightener is sodium polydithiodipropane sulfonate, and the l...

Embodiment 3

[0061] In this embodiment, the geometric dimension of the blind hole on the circuit board: 150 μm (diameter) × 80 μm (depth); Figure 6 shown in The operation procedure of the jet flow device as a parameter is as follows: spray angle 0°, last 1min; spray angle 90°, last 3min; spray angle 180°, last 1min; spray angle -180°, last 1min; spray angle -90° , lasted 3min; spray angle 0°, lasted 1min. One cycle is 10min, and the total plating time is 1h.

[0062] Pretreatment conditions: Soak for 5 minutes under the condition of 25L / min jet flow.

[0063] Basic plating solution ratio: 200g / L copper sulfate pentahydrate, 50g / L sulfuric acid, and 99mg / L sodium chloride, the rest is water.

[0064] Additives include inhibitor, brightener and leveling agent, inhibitor: brightener: leveling agent=100ppm: 10ppm: 8ppm. In this embodiment, the inhibitor is polypropylene glycol, the brightener is sodium phenyldithiopropane sulfonate, and the leveling agent is thiourea.

[0065] Experimen...

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Abstract

The invention relates to the application field of circuit board manufacturing in the micro-electronics industry, in particular to a copper electroplating filling method for fine blind holes in a high-density circuit board, and the method is suitable for high-density circuit board copper electroplating and related electroplating equipment. According to the method, the best additive adsorption effect can be achieved by adjusting the electroplating liquid convection manner, a jet-flow device is arranged on a rotation device with a programming control function, the electroplating liquid convection manner is adjusted by controlling the jetting angle and the corresponding time, accordingly, the convection manner matched with the electroplating liquid is established, and accordingly the best electroplating filling effect is achieved. By means of the method, complexity and dependency of electroplating liquid components in the electroplating technology can be reduced, the cost of the electroplating liquid is reduced, meanwhile, the additive monitoring, analyzing and supplementing difficulty is lowered, and controllability and stability of the technology are improved.

Description

technical field [0001] The invention relates to the application field of circuit board manufacturing in the microelectronics industry, in particular to a copper electroplating filling method for tiny blind holes in high-density circuit boards, which is suitable for copper electroplating of high-density circuit boards and the manufacture of related electroplating equipment. Background technique [0002] The contact distance of integrated circuit components is reduced, and the speed of signal transmission is relatively increased, followed by the increase in the number of wiring and the shortening of the length of wiring between points. This requires the application of high-density line configuration and micro-hole technology to achieve the goal , that is, high-density circuit board (HighDensity Interconnection, HDI). The emergence of parts assembly methods such as BGA, CSP, and DCA has further promoted the unprecedented high density of printed circuit boards. Compared with tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D5/08C25D3/38H05K3/42
Inventor 祝清省祝汉品崔学顺张贤
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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