Flame-retardant adhesive and preparation method and application thereof

A technology of adhesives and flame-retardant adhesives, which is applied in the direction of adhesives, adhesive additives, adhesive types, etc., and can solve problems such as failure to meet strong bonding requirements, high curing temperature, and low cohesive strength of adhesives

Active Publication Date: 2017-11-10
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN104449499A provides a method for preparing a phenolic resin adhesive that can be used for bonding bamboo and wood. The combination of epoxy resin and phenolic resin and the synergistic effect of other components overcome the brittleness and low peel strength of the phenolic resin adhesive. Disadvantages, but its curing temperature is high and curing is slow, not suitable for room temperature bonding
Chinese patent CN102875751A provides a ki

Method used

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  • Flame-retardant adhesive and preparation method and application thereof

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Embodiment approach

[0096] According to a preferred embodiment of the present invention, the weight ratio of water to formaldehyde is (0.9-2.4):1.

[0097] In the present invention, the form of the formaldehyde raw material is not limited, solid formaldehyde can be used, liquid formaldehyde can also be used, or the two can be used in combination, wherein, when using liquid formaldehyde, the consumption of water can be reduced as appropriate.

[0098] According to a preferred embodiment of the present invention, in step a, the temperature is raised to 60-120°C at a rate of 2-3°C / min, and the temperature is kept constant for 10-30min.

[0099] In a further preferred embodiment, the temperature is raised to 90-110° C. at a rate of 2-3° C. / min, and the temperature is kept constant for 15-25 minutes.

[0100] In a further preferred embodiment, the temperature is raised to 80-100° C. at a rate of 2-3° C. / min, and the temperature is kept constant for 20 minutes.

[0101] According to a preferred embodi...

Embodiment 1

[0169] (1) Preparation of phenolic resin

[0170] Weigh 1000g of solid formaldehyde and 2000g of demineralized water into the reaction kettle, turn on the stirring and condenser, raise the temperature of the material from room temperature to 85°C at a rate of 2-3°C / min, keep the temperature constant for 20 minutes, add 3600g of phenol, and use The hydrochloric acid solution with a mass concentration of 35% adjusts the pH of the material to 2.0, continues the constant temperature reaction for 4 hours, then vacuumizes and dehydrates the material, cools and discharges the material, pulverizes it and seals it for storage.

[0171] (2) Preparation of phenolic resin composition

[0172] Weigh 2000g of phenolic resin and 1200g of ethyl acetate into the reaction kettle, fill with nitrogen to remove the air, seal and stir until the phenolic resin is completely dissolved, then add 2000g of aluminum hydroxide, stir for 1 hour to mix the materials evenly, and pack the obtained product int...

Embodiment 2

[0178] (1) Preparation of phenolic resin

[0179] Weigh 1500g of solid formaldehyde and 2530g of demineralized water into the reaction kettle, turn on the stirring and condenser, raise the temperature of the material from room temperature to 95°C at a rate of 2-3°C / min, keep the temperature for 20 minutes, then add 5800g of phenol, Adjust the pH to 2.5 with 45% acetic acid solution, react at a constant temperature for 5 hours, then vacuumize and dehydrate the material, cool and discharge, pulverize and store in a sealed container.

[0180] (2) Preparation of phenolic resin composition

[0181] Weigh 2000g of phenolic resin and 1000g of dichloromethane into the reaction kettle, fill with nitrogen to remove the air, seal and stir until the phenolic resin is completely dissolved, then add 1800g of magnesium hydroxide, stir for 1.5 hours to mix the materials evenly, and distribute the obtained product in an airtight container. Store in a container filled with nitrogen and sealed....

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Abstract

The invention discloses a flame-retardant adhesive. The adhesive is prepared from the following components, in parts by weight, 100 parts of a phenolic resin composition, 15-70 parts of liquid-state polyurethane, and 0.05-0.5 part of a catalyst, wherein the phenolic resin composition comprises phenolic resin and a fire retardant, and the fire retardant is preferably an inorganic fire retardant; and a preparation method for the flame-retardant adhesive comprises the following steps: step 1, preparing the phenolic resin composition, step 2, preparing the liquid-state polyurethane, step 3, adding the phenolic resin composition obtained in the step 1 to a reaction kettle, introducing a protective gas, wherein the protective gas is preferably nitrogen gas, then adding the liquid-state polyurethane obtained in the step 2, and performing stirring for 0.5-1h, and step 4, adding the catalyst to the reaction kettle, performing stirring for 5-10h, discharging the prepared adhesive, and then allowing the adhesive to be directly used for bonding or subpackaging the adhesive in containers for storage, wherein the storage is preferably performed at the atmosphere of nitrogen gas. The flame-retardant adhesive is an environmentally friendly material, can be solidified at room temperature, has excellent toughness, bonding performance and flame-retardant performance, and is suitable for the bonding of bamboo materials, wood materials and straws.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a flame retardant adhesive, in particular to a room temperature curable flame retardant adhesive and its application. Background technique [0002] Phenolic resin is a resin made by polycondensation of phenol and formaldehyde under catalyst conditions. It has good acid resistance, mechanical properties, and heat resistance, and is widely used in the adhesive industry. However, phenolic resin adhesives also have shortcomings such as dark color, hard and brittle cured adhesive layer, and easy cracking. Certain limitations, e.g. unsuitability for bonding of large thickness dimensions to sheet or profile manufacturing processes due to hindered heat transfer. [0003] Polyurethane refers to a polymer material containing a carbamate group (-NHCOO-) or isocyanate group (-NCO) in the molecular chain. It is widely used in the adhesive industry. Polyurethane adhesives have excellent shear strengt...

Claims

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Application Information

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IPC IPC(8): C09J161/10C09J175/08C09J11/04C08G8/10C08G18/76C08G18/48
CPCC08G8/10C08G18/4825C08G18/4833C08G18/4854C08G18/7664C08L2201/02C09J11/04C09J161/06C08L75/08C08K2003/2224C08K2003/2227
Inventor 陈晓农罗鑫桂起林夏宇正石淑先
Owner BEIJING UNIV OF CHEM TECH
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