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Copper-based composite material and preparation method thereof

A copper-based composite material and copper-based technology, applied in the field of metal alloys, can solve the problems of low comprehensive performance, high porosity, and low equipment requirements, and achieve good wear resistance, good impact toughness, and good electrical and thermal conductivity.

Active Publication Date: 2017-11-28
SEED TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The powder metallurgy process is mature, which is characterized by relatively low equipment requirements and is convenient for mass production, but the product has low density, high porosity, and relatively low comprehensive performance

Method used

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  • Copper-based composite material and preparation method thereof
  • Copper-based composite material and preparation method thereof
  • Copper-based composite material and preparation method thereof

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preparation example Construction

[0026] The present invention also provides a method for preparing the above-mentioned copper-based composite material, including: establishing 3D model data of the copper-based composite material through a computer; bonding 30-60 parts by weight of tungsten carbide to 70-40 parts by weight of Phase powder is mixed, and in a protective atmosphere, powder is spread according to 3D model data, and then electron beam scanning is used for selective sintering to obtain a copper-based composite material; in terms of mass percentage, the copper-based binder phase powder includes 7%~ 25% of nickel, 0-15% of cobalt, 8%-23% of manganese, 0-2% of molybdenum, 0.1%-0.3% of silicon and the balance of copper.

[0027] The tungsten carbide and copper-based binder phase powders are the same as those described above, and will not be repeated here.

[0028] Establish 3D model data of copper-based composite materials by computer; mix 30-60 parts by weight of tungsten carbide with 70-40 parts by we...

Embodiment 1

[0034] Obtain the 3D data of the product to be prepared through CAD software, and send this data to the EBSM equipment.

[0035]Mix tungsten carbide (WC) powder and copper-based binder phase powder according to a certain mass ratio, and put the obtained mixture into the EBSM equipment; inject helium into the EBSM equipment as a protective gas, and follow the 3D The data is powdered, and then electron beam scanning is used for selective sintering and molding. The electron beam power in the electron beam scanning process is 1000W~1200W, the beam spot width is 0.16mm, and the line scanning speed is 25mm / s~30mm / s. The thickness of the layer is 0.1 mm, and the scanning interval is 0.1 mm.

[0036] The composition of tungsten carbide powder and copper-based binder phase powder is shown in Table 1, and the performance parameters of the obtained copper-based composite material are shown in Table 2.

[0037] Table 1 Composition of raw materials and performance parameters of copper mat...

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Abstract

The invention provides a copper-based composite material and a preparation method thereof. The copper-based composite material is prepared from 30-60 parts by weight of tungsten carbide and 70-40 parts by weight of copper-based binding phase powder through electron beam selective melting forming, wherein the copper-based binding phase powder contains the following components in percentage by mass: 7-25% of nickel, 0-15% of cobalt, 8-23% of manganese, 0-2% of molybdenum, 0-0.3% of silicon and the balance of copper. Compared with the prior art, the copper-based composite material disclosed by the invention has the advantages that the components and usage amount of raw materials are controlled, and the electron beam selective melting forming is adopted, so that the copper-based composite material of an integral structure can be obtained by virtue of one-step near-net forming. Moreover, the prepared copper-based composite material has high wear resistance, corrosion resistance, high impact toughness and electrical and thermal conductivity.

Description

technical field [0001] The invention belongs to the technical field of metal alloys, in particular to a copper-based composite material and a preparation method thereof. Background technique [0002] Copper and its alloys have played a pivotal role in the long history of human development and productivity improvement. With the rapid development of modern science and technology, copper and its alloys have excellent electrical and thermal conductivity, good corrosion resistance and processing performance. And it has increasingly become an indispensable metal material in the process of industrialization, and plays an increasingly important role in human production and life. However, the hardness and strength of copper are low, and its poor wear resistance restricts its application in industrial and military fields. [0003] The introduction of reinforcements into the copper matrix can improve the mechanical properties of copper materials at room temperature and high temperatur...

Claims

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Application Information

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IPC IPC(8): C22C29/08C22C9/00C22C32/00C22C1/05B22F1/00B22F3/105B33Y10/00B33Y70/00
CPCB22F1/0003C22C1/05C22C1/051C22C9/00C22C29/067C22C29/08C22C32/0052B33Y10/00B33Y70/00B22F10/00B22F10/34B22F10/28B22F10/36B22F10/366Y02P10/25
Inventor 徐跃华张汝南
Owner SEED TECH CORP LTD