A Method for Cutting Squared Monocrystalline Silicon Rods Using Diamond Wire
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 德州倍力刀具有限公司
- Publication Date
- 2019-03-22
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Abstract
Description
technical field
[0001] The invention relates to the technical field of single crystal silicon processing, in particular to a method for cutting a square rod of single crystal silicon by using a diamond wire. Background technique
[0002] The existing wire squaring technology originated from the multi-wire cutting technology, which is a physical processing method that does not affect the characteristics of the workpiece. Through the high-speed reciprocating motion of the staggered wire mesh, the abrasive grains are brought into the workpiece processing area for grinding, and finally the monocrystalline silicon round rod is cut into a quasi-square rod. During the whole cutting process, it mainly involves high-speed moving metal wire, cutting sand (green silicon carbide), cutting fluid and cutting workpiece. The cutting process is a complex process in which the metal wire, the cutting sand in the cutting fluid and the workpiece contact each other. The cutting sand plays the r...