A Method for Cutting Squared Monocrystalline Silicon Rods Using Diamond Wire

A technology of diamond cutting wire and monocrystalline silicon, which is applied in metal processing equipment, fine working devices, grinding machines, etc., can solve the problems of large head margin, poor verticality, and great influence on finished products, so as to achieve easy operation, The effect of cost reduction
CN107415067BActive Publication Date: 2019-03-22德州倍力刀具有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
德州倍力刀具有限公司
Publication Date
2019-03-22

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Abstract

The invention provides a method of cutting and squaring a single crystal silicon round rod by utilizing a diamond line. The method utilizes high-speed feeding of the diamond line to cut the single crystal silicon round rod and comprises the following concrete steps of (1) wire winding: winding a diamond wire to form a wire net of a well-shaped structure after the diamond passes through a cutting wheel and guide wheels; (2) crystal rod mounting: mounting a crystal rod on a workbench, enabling the diamond cutting wire to form a field angle between the crystal rod and each of the guide wheels at the front, the back, the left and the right of the crystal rod; (3) parameter setting: setting a line tension, a feeding speed and a new wire feeding quantity according to the diameter of the crystal rod; (4) cutting: carrying out continuous cutting through relative movement of the diamond cutting wire and the single crystal round rod to be cut; and (5) finishing cutting, and ending a program. The method has the advantages that the feeding speed is increased, the new wire feeding quantity and the steel wire consumption quantity are reduced, and the quality of a quasi-square rod subjected to squaring is in a controlled state.
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Description

technical field

[0001] The invention relates to the technical field of single crystal silicon processing, in particular to a method for cutting a square rod of single crystal silicon by using a diamond wire. Background technique

[0002] The existing wire squaring technology originated from the multi-wire cutting technology, which is a physical processing method that does not affect the characteristics of the workpiece. Through the high-speed reciprocating motion of the staggered wire mesh, the abrasive grains are brought into the workpiece processing area for grinding, and finally the monocrystalline silicon round rod is cut into a quasi-square rod. During the whole cutting process, it mainly involves high-speed moving metal wire, cutting sand (green silicon carbide), cutting fluid and cutting workpiece. The cutting process is a complex process in which the metal wire, the cutting sand in the cutting fluid and the workpiece contact each other. The cutting sand plays the r...

Claims

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