Temperature-controlled mechanical property test device for thin film

Abstract

The invention provides a temperature-controlled mechanical property test device for a thin film and belongs to the technical field of material property tests and optical measurement mechanics. The temperature-controlled mechanical property test device mainly comprises a temperature control part, a deflection measurement part, a pressure loading part, a test piece clamping structure and a data receiving and displaying part. During a test, an electric heating tape heats up gas in a pressure cavity to a certain temperature, and an injector is pushed to perform pressure loading; a flow equalizing plate in the pressure cavity ensures relatively uniform pressure exerted on the thin film; the increasingly rising pressure enables the thin film mounted on a test piece table to be subjected to bulging deformation; a laser displacement sensor above the test piece table is used for measuring central deflection of the deformed thin film in real time; and the data receiving and display part is used for receiving and displaying pressure and deflection data. In combination with a film-bulging theoretical model, such mechanical parameters as the elasticity modulus of the thin film at a certain temperature can be obtained according to such measured data as pressure and deflection.

Description

technical field [0001] The invention combines the optical measurement technology and the principle of the tympanic membrane method to propose a temperature-controllable thin film mechanical performance testing device, which belongs to the technical fields of material performance testing and optical measurement mechanics. Background technique [0002] Thin film is a semiconductor material with excellent mechanical, optical, thermal and electrical properties, which creates conditions for the integration and miniaturization of micro-nano electromechanical system devices. Often used as light-emitting diodes, field effect transistors, protective layers, solar cells and other occasions. Linear one-dimensional and planar two-dimensional suspended thin-film structures are important components of micro-nano electromechanical systems. Testing and improving the mechanical properties of thin-film materials such as elastic modulus and residual stress is the key to improving the stability...

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Problems solved by technology

[0003] The test methods for the mechanical properties of films mainly include tensile method, nano-indentation method, tympanic membrane method, etc. The disadvantage of the stretching method is that it is difficult to overcome the influence of the clamping end, and the film is easily damaged during installation; the nano-indentation method is difficult to overcome the substrate The impact on the mechanical properties of the film is difficult to obtain accurate test results; the tympanic membrane method has a simple principle and high measurement accuracy, which overcomes the shortcomings of the above two methods, and can simultaneously measure multiple parameters, including the elastic modulus and residual stress of the film Wait

[0004] Chinese patent CN106198206A proposes to use the digital speckle correlation method to measure the mechanical properties of the film. During the test, the speckle image needs to be image-processed, the operation is complicated and delayed, and the corresponding relationship between the obtained deflection value and the pressure value is not good; the deflection value is determined by The in-plane displacement is calculated according to the projection angle, and it is difficult to accurately control the an

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