Radar component package and manufacturing method thereof
A package and radar technology, used in semiconductor/solid-state device manufacturing, measurement devices, electrical components, etc., can solve the problems of excessively long line length, large component thickness, and reduced thickness, and achieve reduction in line length, thickness, and thickness. Loss reduction effect
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[0043] It should be noted that components in the various figures may be shown exaggerated for the purpose of illustration and are not necessarily true to scale. In the various figures, identical or functionally identical components are assigned the same reference symbols.
[0044] Unless otherwise specified, in this application, the quantifiers "a" and "an" do not exclude the scene of multiple elements.
[0045] figure 1 A schematic diagram of a radar component package 100 according to the present invention is shown.
[0046] Such as figure 1 As shown, the radar component package 100 according to the present invention includes a box cover 101 and a box body 102 .
[0047]The case cover 101 may be made of a material with a low dielectric constant, such as polytetrafluoroethylene. On the inner wall of the lid 101 is arranged a metal layer 103 made of, for example, titanium, copper, nickel, tungsten, silver, gold or alloys thereof. By arranging the metal layer 103, the hole ...
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