Graphene nano silver-copper paste

A nano-silver and graphene technology, applied in the field of electronic information, can solve the problems of easy and irreversible stacking, poor dispersion, etc., and achieve the effects of strong adaptability, low cost, and avoiding electron migration.

Inactive Publication Date: 2017-12-29
郴州国盛新材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shortcomings of graphene, such as easy irreversible stacking and poor dispersion during processing, limit the excellent performance of graphene in conductive pastes.

Method used

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  • Graphene nano silver-copper paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] S1. Add 5mg / ml graphene, 10mg / ml nano-silver, 120mg / ml cetyltrimethylammonium bromide, KH550 coupling agent 30mg / ml into N,N-dimethylformamide, heat to 50°C, ultrasonic treatment for 2 hours to obtain a graphene nano-silver dispersion;

[0038] S2. Add 8 parts of epoxy resin to 33 parts of N,N-dimethylformamide, heat to dissolve, add 5 parts of graphene nano-silver dispersion, 30 parts of copper powder, 0.3 parts of nano-nickel powder and a mixture of nano-calcium carbonate , constant temperature and high-speed stirring, three-roll rolling mill rolling 5 times, and filtering through a 400-mesh sieve.

Embodiment 2

[0040] S1. Add 8mg / ml graphene, 12mg / ml nano-silver, 220mg / ml hexadecyltrimethylammonium bromide, KH550 coupling agent 40mg / ml into N,N-dimethylformamide, heat to 60°C, ultrasonic treatment for 2 hours to obtain a graphene nano-silver dispersion;

[0041] S2. 9 parts of epoxy resins are added in 45 parts of N,N-dimethylformamide, heat to dissolve, add 9 parts of graphene nano-silver dispersion liquid, 36 parts of copper powder, 0.5 part of nano-nickel powder and nano-calcium carbonate The mixture was stirred at constant temperature and high speed, rolled by a three-roll mill for 5 times, and filtered through a 400-mesh sieve.

Embodiment 3

[0043] S1. Add 11mg / ml graphene, 15mg / ml nano-silver, 330mg / ml hexadecyltrimethylammonium bromide, and 51mg / ml silane coupling agent into N,N-dimethylformamide, heat To 68 ° C, ultrasonic treatment for 2 hours, to obtain graphene nano-silver dispersion;

[0044] S2. Add 10 parts of epoxy resin to 51 parts of N,N-dimethylformamide, heat and dissolve, add 10 parts of graphene nano-silver dispersion, 40 parts of copper powder, 1 part of nano-nickel powder and nano-calcium carbonate The mixture was stirred at constant temperature and high speed, rolled by a three-roll mill for 8 times, and filtered through a 400-mesh sieve.

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Abstract

The invention discloses a graphene nano silver-copper paste comprising, by mass, 30-50 parts of copper powders, 5-15 parts of graphene nanosilver dispersion liquid, 33-60 parts of organic solvent, 18 parts of resin, and 0.3 to 5.0 parts of additives. The excellent electrical conductivity, mechanical property and thermal property of the graphene increase the flexibility of the paste on a flexible substrate and improve the overall performance of the paste. The graphene nano silver-copper paste is simple in operation method, easy in industrial production, remarkable in economic and social benefits. Since the electronic paste provided by the present invention has better flexibility, high transmittance and good adaptability after being printed, the electronic paste can be widely used in the fields of touch screens and flexible displays.

Description

technical field [0001] The invention relates to the technical field of electronic information, in particular to a graphene nano-silver copper paste. Background technique [0002] With the increasing number of multimedia information query devices, conductive paste, as a basic electronic material with specific functions, has been widely used in the fields of printed circuit boards, touch screen circuits, flexible printed circuit FPC and other electronic circuits. [0003] With the large-scale promotion of fine electronic equipment, the conductive silver paste is also growing at an alarming rate every year, but most of the conductive silver paste in the prior art is prepared by using metallic silver powder as the conductive metal powder, and silver ions are prone to migration, which will cause Bypasses are formed between conductors without electrical connections, resulting in insulation degradation or even short circuits. It is difficult to increase the filling density of metal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02H01B1/04H01B1/22H01B1/24
CPCH01B1/026H01B1/04H01B1/22H01B1/24
Inventor 李丽萍
Owner 郴州国盛新材科技有限公司
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