Manufacturing technology of epoxy resin for sensors

A technology of epoxy resin and manufacturing process, which is applied in the field of epoxy resin manufacturing process for sensors, can solve the problems of high thermal conductivity and low thermal expansion coefficient, and achieve high thermal conductivity, low thermal expansion coefficient, high bending and compressive strength Effect

Active Publication Date: 2018-01-09
JIANGSHAN HAIWEI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy resin sensor materials satisfying low thermal expansion coefficient, high thermal conductivity, high bending and compressive strength at the same time have not been reported yet

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) By weight, 100 parts of epoxy resin (bisphenol A type), 10 parts of red brick powder, 2 parts of poly(methyl-3,3,5-trifluoropropylsiloxane), 0.3 parts Nano silica, 0.4 parts of 5-norbornene-2-carboxylic acid, 4 parts of bentonite, 0.02 parts of dichloro(2,6,10-dodecatriene-1,12-diyl)ruthenium(IV) , 5 parts of glass fiber, 8 parts of silk and 60 parts of polyethylacrylate, heated and melted at 140°C for 1.5h, and then cooled and solidified at 32°C to obtain a modified epoxy resin;

[0022] (2) In parts by weight, use SPA-200 to defoam 100 parts of the above-mentioned modified epoxy resin, 100 parts of liquid methyl hexahydrophthalic anhydride, 10 parts of xylene, ethanol or acetone, and 1.5 parts of latex paint Stir the agent evenly, then add the curing agent under stirring and heat to 90°C. After the mixture melts into a liquid state, add the defoamer and continue stirring for 25 minutes. After the stirring is completed, the sensor epoxy resin is obtained.

[0023]...

Embodiment 2

[0025] (1) By weight, 100 parts of epoxy resin (bisphenol F type), 7 parts of red brick powder, 1 part of poly(methyl-3,3,5-trifluoropropylsiloxane), 0.1 parts Nano silica, 0.3 parts of 5-norbornene-2-carboxylic acid, 3 parts of bentonite, 0.01 parts of dichloro(2,6,10-dodecatriene-1,12-diyl)ruthenium(IV), 4 parts of glass fiber, 6 parts of silk and 55 parts of polyethyl acrylate were heated and melted at 135°C for 1.2h, and then cooled and solidified at 30°C to obtain a modified epoxy resin;

[0026] (2) By weight, 100 parts of the above-mentioned modified epoxy resin, by weight, 60 parts of liquid methyl hexahydrophthalic anhydride; 5 parts of xylene, ethanol or acetone, 1 part of latex paint Stir evenly with SPA-200 defoamer, then add curing agent while stirring and heat to 85°C. After the mixture melts into a liquid state, add defoamer and continue stirring for 15 minutes. After stirring, the sensor epoxy resin ;

[0027] (3) Coat the sensor epoxy resin on the surface of...

Embodiment 3

[0029] (1) By weight, 100 parts of epoxy resin (bisphenol A type), 13 parts of red brick powder, 5 parts of poly(methyl-3,3,5-trifluoropropylsiloxane), 0.4 parts Nano silica, 0.8 parts of 5-norbornene-2-carboxylic acid, 5 parts of bentonite, 0.1 parts of dichloro(2,6,10-dodecatriene-1,12-diyl)ruthenium(IV), 8 parts of glass fiber, 12 parts of silk and 70 parts of polyethylacrylate were heated and melted at 145°C for 2 hours, and then cooled and solidified at 35°C to obtain a modified epoxy resin;

[0030] (2) By weight, 100 parts of the above-mentioned modified epoxy resin, 140 parts of liquid methyl hexahydrophthalic anhydride; 15 parts of xylene, ethanol or acetone, and 2 parts of latex paint with SPA-200 Stir the defoamer evenly, then add the curing agent under stirring and heat to 90°C. After the mixture melts into a liquid state, add the defoamer and continue stirring for 30 minutes. After the stirring is completed, the sensor epoxy resin is obtained

[0031] (3) Coat th...

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PUM

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Abstract

The invention provides a manufacturing technology of an epoxy resin for sensors. The manufacturing technology of the epoxy resin for the sensors is prepared by uniformly stirring the following materials in parts by weight: 100 parts of modified epoxy resin, 60 to 140 parts of liquid methyl hexahydrophthalic anhydride; 5 to 15 parts of xylene, ethanol or acetone, 1 to 2 parts of SPA-200 defoamer for latex paint, then adding a curing agent under a stirring state and heating to 85 to 90 DEG C, then adding a defoamer after the mixture is melted into liquid, continuing to stir for 10 to 30 minutes,and then obtaining the epoxy resin for the sensors after completion of stirring.

Description

technical field [0001] The invention relates to an epoxy resin manufacturing process, in particular to an epoxy resin manufacturing process for a sensor. Background technique [0002] Epoxy resin generally refers to organic polymer compounds containing two or more epoxy groups in the molecule. It has good electrical insulation performance, good heat resistance, excellent environmental resistance, chemical corrosion resistance, and is easy to use. and mass production. Various sensors widely use epoxy resin as potting material. [0003] CN 201210364115.X discloses an epoxy resin potting glue and its usage method. Epoxy resin potting glue is composed of o-cresol novolac epoxy resin matrix, methyl hexahydrophthalic anhydride curing agent, electronic grade quasi-spherical silica powder filler, diluent and defoamer. The composition ratio of epoxy resin matrix to curing agent is 1:0.6-1.4; the composition ratio of epoxy resin matrix to filler is 1:0.3-2.4. The curing process of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/08C08L33/08C08L89/00C08K13/04C08K7/14C08K3/36C08K3/34C08K5/09
Inventor 刘立忠姜浩臻
Owner JIANGSHAN HAIWEI TECH
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