Processing method for etching and cutting sapphire through laser-induced KOH chemical reaction
A chemical reaction, laser-induced technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of unavoidable edge chipping and cracks, low corrosion removal rate, etc. The effect of increasing the corrosion rate
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[0031] In order to make the technical solution of the present invention more clearly expressed, the present invention will be further described below by selecting reasonable process parameters of the laser system with reference to the accompanying drawings.
[0032] see figure 2 , a laser-induced KOH chemical reaction etching and cutting sapphire processing method, including:
[0033] (1) Cover the sapphire surface with a layer of KOH powder:
[0034] First, grind the KOH powder, and the mesh number is required to be greater than 60 meshes. The ground KOH powder is covered on the upper surface of the sapphire sample, and the thickness of the covering layer is 0.2 mm to 2 mm.
[0035] The size of the sapphire sample is 30×30×2mm 3 , and fix the sapphire in a reasonable position on the worktable, so that the processing position is exactly the center of the sapphire sheet.
[0036] (2) Determine the process parameters of the laser system for laser etching sapphire:
[0037] ...
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