TFT-LCD display screen substrate glass efficient etching liquid

Abstract

The invention discloses TFT-LCD display screen substrate glass efficient etching liquid. The etching liquid consists of the following raw materials in percentage by weight: 14 to 18 percent of phosphoric acid, 16 to 20 percent of a fluorinated compound, 9 to 14 percent of nitric acid, 11 to 13 percent of hydrofluoric acid, 16 to 20 percent of potassium dichromate, 7 to 15 percent of concentrated sulfuric acid, 6 to 10 percent of phosphate, 8 to 10 percent of a surfactant and the balance of a solvent. The etching liquid can be in contact with a glass substrate completely and is permeated into the bottom of photoresist uniformly, the etching rate on different metal is basically consistent, the reaction is stable, the etched substrate is clean and tidy in surface, residues is avoided, metal layering phenomenon is avoided, and the residual lines are flat; meanwhile, after the etching liquid for the TFT-LCD display screen is thinned on the glass substrate, the precipitate impurities attached to the surface of the glass substrate are dissolved, so that the impurities on the surface of the glass substrate can be effectively removed, the qualification rate and the yield of products can beincreased, and effective guarantee can be provided for control of the thickness of the glass substrate.

Description

technical field [0001] The invention relates to the technical field of TFT-LCD, in particular to a high-efficiency etchant for TFT-LCD display substrate glass. Background technique [0002] In the manufacturing process of the TFT-LCD display screen, a glass substrate is required. Due to the limitation of the glass substrate production process, the produced glass substrate is relatively thick. In order to further reduce the weight of the display device, more and more manufacturers adopt the method of thinning the glass substrate, and then the etching of the glass substrate becomes an important issue. There are two commonly used thinning methods, one is physical method, that is, polishing and grinding with polishing powder, this method takes a long time to thin, the precision is not easy to control, and the product yield is low; the other method is to use etching solution The chemical etching method has short thinning time, low equipment investment, high product yield, and t...

AI Technical Summary

Problems solved by technology

There are two commonly used thinning methods, one is physical method, that is, polishing and grinding with polishing powder, this method takes a long time to thin, the precision is not easy to control, and the product yield is low; the other method is to use etching solution The chemical etching method has short thinning time, low equipment investment, high product yield, and the composition of the thinning liquid is simple and low cost. It has gradually become the mainstream technical method for thinning glass substrates.

The etching rate of the substrate in the prior art is relatively fast, the etching amount is not easy to control, and the thickness of the substrate cannot be well controlled. Some cannot effectively dissolve silicate, and some will produce strong ionization, forming Excessive hydrofluoric acid will cause the etching rate to be difficult to control, and sometimes the etching solution will generate a large number of bubbles, which will reduce the etching rate