Preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite material

A mesoporous silica and epoxy resin technology, applied in the direction of silica, silicon oxide, etc., can solve the problems of affecting the dispersion and interface compatibility of the matrix resin, affecting material performance, and poor interface compatibility, etc., to achieve Solve the problem of interface compatibility, improve the overall performance, and reduce the cost

Inactive Publication Date: 2018-01-26
GUILIN UNIVERSITY OF TECHNOLOGY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the interfacial compatibility between the matrix resin and the nanoparticles is poor, which affects the performance of the material.
[0003] Studies have shown that the size of inorganic nanoparticles, as well as the dispersion and interfacial compatibility in the mat

Method used

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  • Preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite material
  • Preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite material

Examples

Experimental program
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[0022] Example 1:

[0023] (1) Dissolve the soft template agent and the hard template agent in an aqueous solution of absolute ethanol, add an aqueous ammonia solution, the weight ratio of anhydrous ethanol to the mixed solution is 25%, sonicate for 0.5h, stir at 30℃ for 4h, and then use normal Ethyl silicate is used as the silicon source, and the mass ratio of ethyl orthosilicate to hard template is 1:1. Add it dropwise to the mixed solution. The mass ratio of soft template, hard template, ammonia and ethyl orthosilicate is 0.4:1.8:1:1.8, stirring at a constant temperature of 40°C for 24h, then transfer the reaction product to a hydrothermal reactor and place it in an oven at 60°C, crystallize for 24h, then wash, filter, and dry at 60°C for 6h The obtained powder is calcined in a horse boiling furnace at 550°C for 500 min to prepare hollow mesoporous silica microspheres.

[0024] (2) Dry the hollow mesoporous silica microspheres prepared in step (1) at 150°C for 3 hours, and then...

Example Embodiment

[0033] Example 2:

[0034] Except that the amount of the coupled hollow mesoporous silica microspheres prepared in step (2) used in step (3) is changed to 2.0 g, the other steps are the same as in Example 1.

Example Embodiment

[0035] Example 3:

[0036] Except that the amount of the coupled hollow mesoporous silica microspheres obtained in step (2) used in step (3) is changed to 3.0 g, the other steps are the same as in Example 1.

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Abstract

The invention discloses a preparation method of a hollow mesoporous silica microsphere-reinforced epoxy resin composite material. The preparation method comprises preparing hollow mesoporous silica microspheres, carrying out coupling treatment through a silane coupling agent, adding the coupled microspheres into an epoxy resin oligomer, carrying out vacuum mixing, ultrasonic treatment and vacuum-pumping treatment to obtain a hollow mesoporous silica microsphere/epoxy resin mixture, adding a curing agent and a promoter into the mixture, carrying out curing at 80-100 DEG C for 3-6h, and carryingout curing at 140-180 DEG C for 4-8h to obtain the hollow mesoporous silica microsphere-reinforced epoxy resin composite material. The preparation method has simple processes, realizes a low cost andeasily satisfies the requirements of industrial production. The hollow mesoporous silica microsphere-reinforced epoxy resin composite material has good comprehensive performances. Compared with the pure epoxy resin cured product, the composite material has higher glass-transition temperature, higher storage modulus, better tensile strength and better bending strength.

Description

technical field [0001] The invention belongs to the technical field of modified epoxy resin composite materials, and in particular relates to a preparation method of hollow mesoporous silica microsphere-reinforced epoxy resin composite materials. Background technique [0002] Epoxy resin (EP) has a highly cross-linked three-dimensional network structure, which endows it with excellent mechanical properties, electrical insulation, adhesion, good heat resistance, solvent resistance, easy processing and low cost And other advantages, so it is widely used as the matrix resin of adhesives, coatings and various composite materials. However, the highly cross-linked network structure also leads to its low impact resistance and crack resistance, which greatly limits the application of epoxy resin. Therefore, it is a common method to improve the comprehensive performance of epoxy resin by modifying it. At present, the modification of epoxy resin is mainly through toughening modificat...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K7/26C08G59/42C01B33/18
Inventor 余传柏高朋罗海强刘远立
Owner GUILIN UNIVERSITY OF TECHNOLOGY
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