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A kind of non-fiber-reinforced fluorine-containing resin-based copper-clad laminate and preparation method thereof

A technology of fluorine-containing resin and preparation steps, applied in the field of communication materials, can solve the problems of limited improvement of mechanical strength of fluorine-containing resin substrate, and achieve the effects of good industrialized production basis, simple operation process and low production cost

Active Publication Date: 2018-07-27
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of no glass fiber cloth reinforcement, the mechanical strength of the fluororesin substrate is limited at this time

Method used

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  • A kind of non-fiber-reinforced fluorine-containing resin-based copper-clad laminate and preparation method thereof
  • A kind of non-fiber-reinforced fluorine-containing resin-based copper-clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Add 40 parts of SiO2 (Xinyi Hongrun) to a mixed solvent composed of 80 parts of water and 20 parts of ethanol, and stir evenly at room temperature; Continue stirring at 60°C for 12 hours; then, add 3 parts of ETFE emulsion (DuPont Teflon® 532-6210), stir at room temperature for 6 hours, remove the solvent by filtration, and dry the solid at 110°C for 12 hours to obtain a surface composed of KH550 and ETFE. Modified SiO2 particles; Weigh 100 parts of polytetrafluoroethylene emulsion (DuPont Teflon® PTFE DISP30, solid content 60%) and 38 parts of the above SiO2 particles modified by KH550 and ETFE, stir at room temperature for 12 hours, then add 14 parts dropwise 2wt / v% PEI aqueous solution, continue to stir for 2 hours, and then remove the solvent by filtration, and dry the solid at 120°C for 12 hours to obtain a fluorine-containing resin mixture; set the molding temperature to 380°C, and the molding pressure to 120~130kg / cm 2 , The molding time is 6 hours, and the fluor...

Embodiment 2

[0031] Add 75 parts of TiO2 (Tianjin Zhongzheng Huamei Technology) and 15 parts of SiO2 (Xinyi Hongrun) to a mixed solvent composed of 75 parts of water and 25 parts of ethanol, and stir well at room temperature; add 2 parts of silane coupling agent KH550 (Nanjing Shuguang General Chemical Plant), raise the temperature of the system to 60°C, and continue to stir for 12 hours; then, add 6.3 parts of ETFE emulsion (DuPont Teflon® 532-6210), stir at room temperature for 6 hours, remove the solvent by filtration, and dry the solid at 110°C for 12 hours , so as to obtain KH550 and ETFE co-modified TiO2 / SiO2 composite particles; Weigh 100 parts of polytetrafluoroethylene emulsion (DuPont Teflon® PTFE DISP30, solid content 60%) and 75 parts of the above TiO2 / SiO2 co-modified by KH550 and ETFE Composite particles, after stirring at room temperature for 12 hours, add 10 parts of 2wt / v% PEI aqueous solution drop by drop, continue stirring for 2 hours, then remove the solvent by filtratio...

Embodiment 3

[0033] Add 40 parts of Al2O3 (Zibo Hengbang) and 20 parts of SiO2 (Xinyi Hongrun) to a mixed solvent composed of 70 parts of water and 30 parts of ethanol, and stir evenly at room temperature; add 1.6 parts of silane coupling agent KH550 (Nanjing Shuguang Chemical General plant), raise the temperature of the system to 55°C, and continue to stir for 12h; then, add 4.5 parts of ETFE emulsion (DuPont Teflon® 532-6200), stir at room temperature for 6h, remove the solvent by filtration, and dry the solid at 110°C for 12h. In order to obtain Al2O3 / SiO2 composite particles co-modified by KH550 and ETFE; weigh 70 parts of polytetrafluoroethylene emulsion (DuPont Teflon® PTFE DISP30, solid content 60%), 30 parts of tetrafluoroethylene-perfluoroalkoxy vinyl ether Copolymer emulsion (DuPont Teflon® PFAD 335D, solid content 60%) and 50 parts of the above-mentioned Al2O3 / SiO2 composite particles modified by KH550 and ETFE were stirred at room temperature for 12 hours to obtain a uniform dis...

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Abstract

The invention belongs to the field of communication materials, and in particular relates to a non-fiber-reinforced fluorine-containing resin-based copper-clad laminate and a preparation method thereof. In the present invention, the inorganic fillers modified by the coupling agent and part of the fluorine-containing polymer are respectively loaded into the fluorine-containing resin matrix by wet method and dry method, and then cast, molded, calendered or injected into a plate, and finally combined with The copper foil covered on the surface is pressed together to prepare a high-frequency copper-clad laminate. In the present invention, the surface of the inorganic filler is modified by the coupling agent and part of the fluorine-containing polymer, so that the interaction force between the inorganic filler and the fluorine-containing resin matrix is ​​stronger, and the dispersion of the inorganic filler in the resin matrix is ​​good, ensuring The composite resin has excellent mechanical strength and thermal stability on the basis of good processing performance. The prepared copper clad laminate has excellent dielectric properties and high peel strength of copper foil, which can meet the requirements of substrate materials in the high-frequency communication field. Various comprehensive performance requirements.

Description

technical field [0001] The invention belongs to the field of communication materials, in particular to a mixture of an inorganic filler and a fluorine-containing resin modified by a coupling agent and a part of a fluorine-containing polymer and a preparation method thereof, and also to a fluorine-containing resin mixture prepared High frequency copper clad laminates without fiber reinforcement. Background technique [0002] At present, the electronic communication and information industry is rapidly developing into one of the pillar industries in all countries in the world. As one of the key materials in the electronic communication and information industry, copper clad laminates are widely used in mobile phones, computers, vending machines, communication base stations, satellites, and gradually emerging wearable devices, driverless cars, drones, and intelligent robots. field, and has received extensive attention from industry and academia. Due to its unique chemical struc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L27/18C08K9/06C08K9/04C08K3/36C08K3/22B29D7/01
Inventor 俞卫忠顾书春俞丞冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD