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Resistance paste for chip resistor

A resistance slurry and resistor technology, applied in the direction of resistors, non-adjustable metal resistors, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of poor compatibility between resistors, conductors and dielectric paste, raw material technical means Problems such as backwardness, low technical performance and reliability, etc., to achieve the effect of good dispersion, increased coverage, and low cost

Inactive Publication Date: 2018-02-23
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resistance paste is complex and has high technical content. The domestic resistance paste has low technical performance and reliability, poor compatibility between resistance, conductor and dielectric paste, raw materials and intermediate production technology are backward, and the high-quality paste required Raw materials are difficult to find and other disadvantages; although the quality of foreign resistance paste is good, but the price is high, the delivery time is long, and the service is not timely

Method used

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  • Resistance paste for chip resistor
  • Resistance paste for chip resistor
  • Resistance paste for chip resistor

Examples

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Embodiment 1

[0031] An embodiment of the resistance paste for chip resistors in the present invention, the resistance paste for chip resistors in this embodiment contains the following components in mass percentage:

[0032] Metal powder (23% palladium silver powder, 55% palladium powder) 78%, organic carrier 12%, organic additive 0.5%, inorganic additive 5.5%, organic solvent 4%;

[0033] In the metal powder, the specific surface of the palladium silver powder is 0.6m 2 / g, the specific surface of the palladium powder is 1.2m 2 / g, the palladium silver powder comprises the following components by weight: 20 parts of palladium, 80 parts of silver.

[0034] Described organic vehicle comprises: 90 parts of organic solvents (60 parts of isooctyl alcohols, 30 parts of diethylene glycol butyl ether acetate), 10 parts of polymer resins (1 part of rosin resin, 9 parts of ethyl cellulose); The molecular resin was added into the organic solvent, stirred and dissolved at 70° C. for 2 hours to obta...

Embodiment 2

[0043] An embodiment of the resistance paste for chip resistors in the present invention, the resistance paste for chip resistors in this embodiment contains the following components in mass percentage:

[0044] Metal powder (20% palladium silver powder, 44% palladium powder) 64%, organic carrier 16%, organic additive 1%, inorganic additive 14%, organic solvent 5%;

[0045] In the metal powder, the specific surface of the palladium silver powder is 1.8m 2 / g, the specific surface of the palladium powder is 2.0m 2 / g, the palladium silver powder comprises the following components by weight: 10 parts of palladium, 90 parts of silver.

[0046]Described organic vehicle comprises: 87 parts of organic solvents (57 parts of isooctyl alcohols, 30 parts of diethylene glycol butyl ether acetate), 13 parts of polymer resins (1 part of rosin resin, 12 parts of ethyl cellulose); The molecular resin was added into the organic solvent, stirred and dissolved at 80° C. for 1.5 hours to obtai...

Embodiment 3

[0055] An embodiment of the resistance paste for chip resistors in the present invention, the resistance paste for chip resistors in this embodiment contains the following components in mass percentage:

[0056] Metal powder (10% palladium silver powder, 40% palladium powder) 50%, organic carrier 20%, organic additive 1.5%, inorganic additive 22.5%, organic solvent 6%;

[0057] In the metal powder, the specific surface of the palladium silver powder is 1.8m 2 / g, the specific surface of the palladium powder is 0.8m 2 / g, the palladium silver powder comprises the following components by weight: 30 parts of palladium, 70 parts of silver.

[0058] Described organic vehicle comprises: 85 parts of organic solvents (50 parts of isooctyl alcohols, 35 parts of diethylene glycol butyl ether acetates), 15 parts of polymer resins (2 parts of rosin resins, 13 parts of ethyl celluloses); The molecular resin is added into the organic solvent, stirred and dissolved at 90° C. for 1 hour to ...

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Abstract

The invention discloses a resistance paste for a chip resistor. The resistance paste comprises metal powder, wherein the metal powder is a mixture of palladium-silver powder and palladium powder. In the resistance paste, the mass percentage content of the palladium-silver powder is 10-30%, and the mass percentage content of the palladium powder is 30-55%. A resistance value of the resistance pasteis within a range of 0.01-10 ohm, the resistance paste is used in a low-resistance chip resistor and has the advantages of environmental protection, good dispersity, good stability, high reliability,low cost, excellent printing performance and the like, and the obtained chip resistor has good performance. Compared with an imported resistance paste, the resistance paste disclosed by the inventionhas the advantages of being green and environment friendly, good in stability and low in cost, and has good application prospect.

Description

technical field [0001] The invention relates to a resistance paste, in particular to a resistance paste for chip resistors. Background technique [0002] With the popularization of electronic equipment applications and the increasing degree of automation of production technology, resistors are widely used in military, aerospace, communications, computers, automobiles and other fields, and resistor paste is also the most widely used type of electronic paste. Resistor is an important component in the circuit, and the resistance paste, which is an important part of it, has also attracted much attention. The resistance paste is mainly composed of three parts: functional phase, binder phase and organic vehicle. The resistance paste is complex and has high technical content. The domestic resistance paste has low technical performance and reliability, poor compatibility between resistance, conductor and dielectric paste, raw materials and intermediate production technology are back...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/20H01C7/00
CPCH01B1/22H01B1/20H01C7/00
Inventor 欧阳铭廖明雅宋永生吴海斌
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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