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A vacuum hot pressing process for aluminum substrate

A technology of vacuum hot pressing and aluminum substrate, applied in the field of avoiding air bubbles in the production process of aluminum substrate, can solve the problems of poor effect of aluminum-based copper cladding process, etc., and achieve the effects of adjustable thermal conductivity and insulation, convenient purchase and low efficiency

Inactive Publication Date: 2018-11-27
乾乐欣展新材料技术(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] Aiming at the problem that the existing aluminum-based copper-clad process has poor effect, the present invention provides a vacuum hot-pressing process for aluminum substrates, which is simple in process and low in cost, and can produce aluminum-based copper-clad laminates with high thermal conductivity, high insulation and high peel strength

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  • A vacuum hot pressing process for aluminum substrate
  • A vacuum hot pressing process for aluminum substrate

Examples

Experimental program
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Effect test

Embodiment 1

[0045] A vacuum hot pressing process for an aluminum substrate, comprising:

[0046] Step 1), pretreatment of the aluminum substrate, degreasing and passivating the surface of the aluminum substrate;

[0047] The degreasing treatment is to treat with an alkaline degreasing solution at room temperature for 1 hour, and the alkaline degreasing solution is a sodium hydroxide solution.

[0048] Step 2), coating the thermally conductive insulating glue containing silane-modified gypsum particles on the surface of the aluminum substrate, the coating process is spraying or screen printing glue; the insulating glue contains 15% of aluminum nitride, 3% of aluminum oxide, modified The gypsum particles are 12% and the rest is epoxy resin.

[0049] The preparation process of modified gypsum is to mix gypsum particles and silylating agent KH-550 in toluene at a mass ratio of 5:1, and react at 130°C for 14 hours to obtain modified gypsum particles.

[0050] Step 3), press the copper plate ...

Embodiment 2

[0053] A vacuum hot pressing process for an aluminum substrate, comprising:

[0054] Step 1), pretreatment of the aluminum substrate, degreasing and passivating the surface of the aluminum substrate;

[0055] The degreasing treatment is to treat with an alkaline degreasing liquid at room temperature for 1 hour, and the alkaline degreasing liquid is potassium hydroxide solution.

[0056] Step 2), coating the thermally conductive insulating glue containing silane-modified gypsum particles on the surface of the aluminum substrate, the coating process is spray coating or screen printing glue coating; the insulating glue contains 20% aluminum nitride, 4% aluminum oxide, modified The gypsum particles are 15% and the rest is epoxy resin.

[0057] The preparation process of modified gypsum is to mix gypsum particles and silylating agent KH-550 in toluene at a mass ratio of 8:1, and react at 140°C for 12 hours to obtain modified gypsum particles.

[0058] Step 3), press the copper pl...

Embodiment 3

[0061] A vacuum hot pressing process for an aluminum substrate, comprising:

[0062] Step 1), pretreatment of the aluminum substrate, degreasing and passivating the surface of the aluminum substrate;

[0063] The degreasing treatment is glass ball shot peening, spraying spherical glass pellets onto the surface of the aluminum substrate to remove oil spots, controlling the spraying distance to 200 mm, the spraying angle to 50 degrees, and the spraying pressure to 3.4 kg / mm 2 .

[0064] Step 2), coating the thermally conductive insulating glue containing silane-modified gypsum particles on the surface of the aluminum substrate, the coating process is spraying or screen printing glue; the insulating glue contains 17% of aluminum nitride, 5% of aluminum oxide, modified 17% of permanent gypsum particles, the rest is epoxy resin.

[0065] The preparation process of modified gypsum is to mix gypsum particles and silylating agent KH-550 in toluene at a mass ratio of 5:1, and react a...

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Abstract

The invention relates to a vacuum hot-pressing process of an aluminum substrate. An aluminum plate, heat-conducting insulating glue containing silane modified gypsum granules and a copper foil are pressed by a vacuum hot press, so that the heat-conducting insulating glue is solidified rapidly at a high temperature to stick the aluminum substrate and the copper foil through a solidification mode. The hot press performs hot-pressing treatment at four stages, so that the heat-conducting insulating glue is solidified rapidly at a high temperature to stick the aluminum substrate and the copper foilthrough a solidification mode, and no bubble and no contamination are guaranteed.

Description

technical field [0001] The invention relates to a vacuum hot pressing process of an aluminum substrate, in particular to a method for avoiding air bubbles during the production process of the aluminum substrate. Background technique [0002] Aluminum-based copper-clad laminate is one of the raw materials for aluminum substrates. It is a plate-shaped material made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, coated with copper foil on one or both sides and hot-pressed. , known as copper-clad laminates, referred to as aluminum-based copper-clad laminates. [0003] In the production process of the aluminum substrate, it is necessary to press the aluminum plate, thermal insulating adhesive, and copper foil together, so that the thermal insulating adhesive can be rapidly cured at high temperature to bond and cure the aluminum substrate and copper foil together, while ensuring no air bubbles and no stained. [0004] CN102602111A disclose...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12B32B37/10B32B37/06
CPCB32B37/06B32B37/1009B32B37/1284
Inventor 李长岭张剑
Owner 乾乐欣展新材料技术(上海)有限公司