A vacuum hot pressing process for aluminum substrate
A technology of vacuum hot pressing and aluminum substrate, applied in the field of avoiding air bubbles in the production process of aluminum substrate, can solve the problems of poor effect of aluminum-based copper cladding process, etc., and achieve the effects of adjustable thermal conductivity and insulation, convenient purchase and low efficiency
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Embodiment 1
[0045] A vacuum hot pressing process for an aluminum substrate, comprising:
[0046] Step 1), pretreatment of the aluminum substrate, degreasing and passivating the surface of the aluminum substrate;
[0047] The degreasing treatment is to treat with an alkaline degreasing solution at room temperature for 1 hour, and the alkaline degreasing solution is a sodium hydroxide solution.
[0048] Step 2), coating the thermally conductive insulating glue containing silane-modified gypsum particles on the surface of the aluminum substrate, the coating process is spraying or screen printing glue; the insulating glue contains 15% of aluminum nitride, 3% of aluminum oxide, modified The gypsum particles are 12% and the rest is epoxy resin.
[0049] The preparation process of modified gypsum is to mix gypsum particles and silylating agent KH-550 in toluene at a mass ratio of 5:1, and react at 130°C for 14 hours to obtain modified gypsum particles.
[0050] Step 3), press the copper plate ...
Embodiment 2
[0053] A vacuum hot pressing process for an aluminum substrate, comprising:
[0054] Step 1), pretreatment of the aluminum substrate, degreasing and passivating the surface of the aluminum substrate;
[0055] The degreasing treatment is to treat with an alkaline degreasing liquid at room temperature for 1 hour, and the alkaline degreasing liquid is potassium hydroxide solution.
[0056] Step 2), coating the thermally conductive insulating glue containing silane-modified gypsum particles on the surface of the aluminum substrate, the coating process is spray coating or screen printing glue coating; the insulating glue contains 20% aluminum nitride, 4% aluminum oxide, modified The gypsum particles are 15% and the rest is epoxy resin.
[0057] The preparation process of modified gypsum is to mix gypsum particles and silylating agent KH-550 in toluene at a mass ratio of 8:1, and react at 140°C for 12 hours to obtain modified gypsum particles.
[0058] Step 3), press the copper pl...
Embodiment 3
[0061] A vacuum hot pressing process for an aluminum substrate, comprising:
[0062] Step 1), pretreatment of the aluminum substrate, degreasing and passivating the surface of the aluminum substrate;
[0063] The degreasing treatment is glass ball shot peening, spraying spherical glass pellets onto the surface of the aluminum substrate to remove oil spots, controlling the spraying distance to 200 mm, the spraying angle to 50 degrees, and the spraying pressure to 3.4 kg / mm 2 .
[0064] Step 2), coating the thermally conductive insulating glue containing silane-modified gypsum particles on the surface of the aluminum substrate, the coating process is spraying or screen printing glue; the insulating glue contains 17% of aluminum nitride, 5% of aluminum oxide, modified 17% of permanent gypsum particles, the rest is epoxy resin.
[0065] The preparation process of modified gypsum is to mix gypsum particles and silylating agent KH-550 in toluene at a mass ratio of 5:1, and react a...
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