Epoxy resin structure adhesive and preparation method thereof

Abstract

The invention discloses an epoxy resin structure adhesive. The epoxy resin structure comprises a first component and a second component; the first component is prepared from the following raw materials in percentage by weight: 55 to 70 percent of a carboxyl-terminated butadiene-acrylonitrile epoxy pre-reactant, 10 to 25 percent of a plasticizer, 10 to 30 percent of an additive and 5 to 15 percentof an anti-settling agent; the second component is prepared from the following raw materials in percentage by weight: 15 to 25 percent of a curing agent A, 5 to 10 percent of a curing agent B, 5 to 20percent of a curing agent C, 2 to 5 percent of a coupling gent, 3 to 10 percent of an anti-settling agent, 25 to 40 percent of filler and 1 to 5 percent of an additive; and the weight ratio of the first component to the second component is (1.2 to 1.5) to 1. The invention also discloses a preparation method of the epoxy resin structure adhesive. The epoxy resin structure adhesive disclosed by theinvention can be cured completely at room temperature, is long in operating time, high in bonding strength, high in toughness, high in stability, high in corrosion resistance and high in mechanical property, and can be applied to the fields, such as buildings, engineering machinery and automotive bodies.

Description

technical field [0001] The invention relates to an adhesive, in particular to an epoxy structural adhesive and a preparation method thereof. Background technique [0002] Epoxy resin has excellent properties such as high stability, high strength, good corrosion resistance, good insulation, low shrinkage, good processability, strong adhesion, etc., and has a wide bonding surface. It can be used on many metals such as iron and steel or High-strength bonding can be achieved on non-metallic substrates such as glass, ceramics, wood, and plastics, and its bonding strength sometimes even exceeds the strength of the bonded material itself. Therefore, it is often used as a structural adhesive and is widely used in many stressed structures. in the file. [0003] The curing of epoxy resin is realized by the ring-opening addition polymerization of epoxy group, no low molecular substances are produced during the curing process, and the curing shrinkage rate is generally below 2%, which ...

AI Technical Summary

Problems solved by technology

However, ordinary epoxy resin has a single function, and the method of reaction modification still has its shortcomings in terms of bonding strength, service stability, and operating time.

[0005] Ordinary epoxy resins are generally glycidyl ether type, glycidyl amine type, glycidyl ester type, etc., with single reactivity

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