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A kind of corona resistant polyimide composite film and preparation method thereof

A polyimide and composite film technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problem of no obvious gain in electrical properties such as breakdown voltage of the composite film, and increase the overall thickness of the insulating structure and weight, the limited corona resistance of the composite film, etc., to increase the corona resistance time, shorten the preparation process flow, and have the effect of bonding performance

Active Publication Date: 2020-04-14
株洲时代华鑫新材料技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Patent document CN103832033B proposes a corona-resistant polyimide-polyperfluoroethylene propylene composite film and its preparation method. This patent uses fluororesin in the preparation process, which is commonly encountered in the production of wrapped electromagnetic wires. Insufficient adhesion, easy to open the glue, etc., and the fluorine material not only does not significantly improve the electrical properties such as the breakdown voltage of the composite film, but also increases the overall thickness and weight of the insulating structure
Patent document CN102490426A discloses a corona-resistant polyimide film with a three-layer structure, in which the middle layer is a pure polyimide base layer, and the upper and lower surface layers are corona-resistant polyimide layers. The polyimide film does not have adhesive properties, and it is still necessary to cover the surface of the film with a fluorine-containing adhesive layer before preparing the corona-resistant sintering wire. In addition, because the middle layer is a pure polyimide layer, the overall resistance of the composite film Corona performance is limited

Method used

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  • A kind of corona resistant polyimide composite film and preparation method thereof
  • A kind of corona resistant polyimide composite film and preparation method thereof
  • A kind of corona resistant polyimide composite film and preparation method thereof

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Embodiment 1

[0032] Such as figure 1 As shown, a corona-resistant polyimide composite film with a double-layer structure includes a thermosetting polyimide layer and a thermoplastic polyimide adhesive layer. The thickness of the thermosetting polyimide layer is 25 μm, and the thermosetting polyimide layer is prepared from the following materials: PMDA, 4,4'-ODA, DMAc, aluminum nitride (average particle size 30nm), aluminum nitride with nitride The aluminum nitride slurry is added in the form of aluminum nitride slurry to uniformly disperse aluminum nitride in DMAc, and at the same time, gamma-glycidoxypropyltrimethoxysilane is added to the slurry in order to improve the uniformity of dispersion.

[0033] The thickness of the thermoplastic polyimide adhesive layer is 4 μm, and the thermoplastic polyimide adhesive layer is prepared from the following substances: 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4,4' -(hexafluoroisopropyl) diphthalic dianhydride, DMAc, aluminum nitride (average part...

Embodiment 2

[0043] A double-layer corona-resistant polyimide composite film comprises a thermosetting polyimide layer and a thermoplastic polyimide adhesive layer. The thickness of the thermosetting polyimide layer is 25 μm, and the thermosetting polyimide layer is prepared from the following materials: BPDA, 3,4'-ODA, DMF, alumina (average particle size 150nm), alumina and alumina slurry Add in the form of alumina slurry to uniformly disperse alumina in DMF, and at the same time add aminopropyltriethoxysilane to the slurry in order to improve the uniformity of dispersion.

[0044] The thickness of the thermoplastic polyimide adhesive layer is 6 μm, and the thermoplastic polyimide adhesive layer is prepared from the following substances: 4,4'-(4,4'-isopropylidene diphenyl-1,1'-di Oxy)diphenylamine, 1,4-bis(trifluoromethyl)-2,3,5,6-benzenetetracarboxylic dianhydride, DMF, alumina (average particle size 150nm), alumina and alumina slurry Add in the form of alumina slurry to uniformly dispe...

Embodiment 3

[0054] A double-layer corona-resistant polyimide composite film comprises a thermosetting polyimide layer and a thermoplastic polyimide adhesive layer. The thickness of the thermosetting polyimide layer is 25 μm, and the thermosetting polyimide layer is prepared from the following materials: BTDA, 3,4'-ODA, NMP, boron nitride (average particle size 300nm), boron nitride is made of nitride Boron slurry is added in the form of boron nitride slurry, which is to disperse boron nitride in NMP evenly, and at the same time, aminopropyltriethoxysilane is added to the slurry in order to improve the uniformity of dispersion.

[0055] The thickness of the thermoplastic polyimide adhesive layer is 8 μm, and the thermoplastic polyimide adhesive layer is prepared from the following substances: 4,4'-(4,4'-isopropylidene diphenyl-1,1'-di Oxygen) diphenylamine, 1,4-difluoropyromellitic dianhydride, NMP, boron nitride (average particle size 300nm), boron nitride is added in the form of boron ni...

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Abstract

The invention provides a corona-resistant polyimide composite film which comprises a thermosetting polyimide layer and a thermoplastic polyimide adhesive layer, wherein the thermoplastic polyimide adhesive layer covers at least one side of the thermosetting polyimide layer, and each of the thermosetting polyimide layer and the thermoplastic polyimide adhesive layer contains inorganic filler. The invention also correspondingly provides a preparation method of the corona-resistant polyimide composite film. By using the thermoplastic polyimide adhesive layer for replacing a traditional fluorine adhesive layer, the thickness of a film layer can be reduced, better corona resistance can also be ensured, the breakdown voltage of the composite film can be increased, and the corona-resistant time can be prolonged.

Description

technical field [0001] The invention belongs to the field of corona-resistant materials, in particular to a corona-resistant polyimide film and a preparation method thereof. Background technique [0002] At present, the corona-resistant electromagnetic wire is sintered at high temperature using a composite corona-resistant polyimide film coated with fluororesin (such as polyperfluoroethylene propylene) on one or both sides, and the composite film and the electromagnetic wire are sintered. Tight fit, relying on corona-resistant polyimide film to improve the corona-resistant life of the winding group. [0003] When using fluororesin-modified corona-resistant polyimide film to make wrapped magnet wires, problems such as insufficient adhesion and easy ungluing are generally encountered. The reasons are due to two points: first, the surface energy of the fluorine material itself is very low, Poor adhesion with copper and polyimide film materials; secondly, when using nanomateria...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/28B32B27/06B32B27/20B29C48/18C08G73/10C08K9/06C08K3/28C08K3/22C08K3/38
CPCB29C48/21B32B27/08B32B27/20B32B27/281B32B2250/24B32B2264/10B32B2307/20C08G73/1039C08G73/105C08G73/1071C08K3/22C08K3/28C08K3/38C08K9/06C08K2003/2227C08K2003/282C08K2003/385
Inventor 张步峰廖波杨军高纪明刘杰姜其斌
Owner 株洲时代华鑫新材料技术有限公司
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