A method of manufacturing high-precision ultra-thin thz film circuit

Abstract

The invention discloses a method for manufacturing a high-precision ultra-thin THz film circuit. A glass substrate is provided; a first metal copper layer is deposited on the surface of the glass substrate; a photoresist mask and electroplating are made on the first metal copper layer The second metal copper layer; remove the photoresist mask, deposit a layer of silicon dioxide medium layer on the surface of the first metal copper layer and the second metal copper layer; grind and level the second metal copper layer and the silicon dioxide medium layer ; Use thin film processing technology to make ultra-thin THz thin film circuit patterns on the silicon dioxide dielectric layer; remove the first metal copper layer and the second metal copper layer to separate the ultra-thin THz thin film circuit from the glass substrate; clean the ultra-thin THz thin film circuit . The invention improves the processing dimensional accuracy of the ultra-thin THz thin film circuit and reduces the processing difficulty of the ultra-thin THz ultra-thin film circuit.

Description

technical field [0001] The invention relates to the field of manufacturing THz thin film circuits, in particular to a method for manufacturing high-precision ultra-thin THz thin film circuits. Background technique [0002] The frequency range of terahertz (THz for short) in the electromagnetic spectrum is roughly 0.1THz-10THz. THz waves have unique characteristics of transient, broadband, coherence and low energy. In recent years, THz waves have attracted more and more attention from all over the world due to their unique performance and wide potential application value. With the deepening of applied research and the continuous expansion of interdisciplinary fields, the research and application of THz waves will usher in A booming stage. [0003] At present, the terahertz module mainly adopts the structure combining ultra-thin substrate film circuit and guided wave. In order to improve the performance of high-frequency microwaves, low dielectric constant substrate materia...

AI Technical Summary

Problems solved by technology

Especially for substrate materials below 30 microns, the mechanical strength can no longer meet the needs of current photolithography, etching and scribing operations

[0006] With the continuous increase of THz application frequency, the processing size of the circuit is also continuously shrinking, and the processing accuracy is continuously improving. In the 1THz frequency band, the outer dimension of the thin film circuit is as small as 0.1mm, and the processing dimensional accuracy is required to be less than 5 microns. At the same time, there are abnormal shapes in the outer shape THz circuit processing requirements, ordinary wafer dicing machines and laser equipment can no longer meet the circuit size cutting and processing accuracy requirements

[0007] To sum up, in the prior art, due to poor mechanical strength, the ultra-thin THz thin-film circuit cannot meet the requirements of photolithography and etching processing operations, and the traditional laser and scribing processing methods cannot meet the dimensional processing accuracy requirements of ultra-thin THz thin-film circuits. problem, there is no effective solution

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