High-transparency organosilicon heat-conduction pouring sealant for electronic products and preparation method of pouring sealant

Abstract

The invention discloses a high-transparency organosilicon heat-conduction pouring sealant for electronic products. The pouring sealant is prepared from a component A and a component B, wherein the component A comprises raw materials in parts by weight as follows: 100 parts of vinyl silicone oil, 8-12 parts of hydrogen-containing silicone oil, 20-40 parts of liquid coumarone-indene resin, 0.3-0.6 parts of 1-methyl-1-butynol, 30-50 parts of inorganic and transparent heat-conduction modified filler, 0.5-1.5 parts of antimony pentoxide and 0.5-1.5 parts of a silane coupling agent; the component Bcomprises raw materials in parts by weight as follows: 15-25 parts of vinyl silicone oil and 0.5-1 part of a platinum catalyst. The pouring sealant is applicable to electronic product machining such as transparent heat-insulation and heat-condition encapsulation of electronic products such as power modules, high-frequency transformers, connectors, sensors, electric heating parts, circuit boards and the like; the pouring sealant has good heat conductivity, transparency and flame retardance, is in a soft rubber form after being cured, is good in impact resistance and high in adhesion force and has excellent insulating, shockproof, dampproof, corona-resistant, electric-leakage-resistant and chemical-media-resistant properties.

Description

technical field [0001] The invention relates to the technical field of electronic product processing materials, in particular to a high-transparency silicone heat-conducting potting glue for electronic products and a preparation method thereof. Background technique [0002] In recent years, potting adhesives have been widely used in electronic circuits, LEDs, capacitor potting, etc., mainly for bonding, sealing, potting and coating protection of electronic components, and the usage is increasing year by year. Electronic potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the performance, material, and production process of the product. After the potting glue is completely cured, its use value can be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, sealing, anti-corrosion, temperature-resistant, and shock-proof. At present, there are many types of electronic potting adhes...

AI Technical Summary

Problems solved by technology

[0004] The material of silicone potting glue is soft after curing, which can eliminate most mechanical stress and play a protective effect of shock absorption. It has stable physical and chemical properties, good high and low temperature resistance, excellent weather resistance, and is not easy to yellow. , at the same time has excellent electrical properties and insulation capabilities, has excellent repair ability, and can quickly and conveniently take out the sealed components for repair and replacement, so it has been widely used, but the silicone potting adhesive has poor bonding performance Poor, and poor thermal conductivity, can not meet the requirements of the prior art for the use of potting glue