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Moisture and heat resistant carbon membrane and preparation method thereof

A technology of damp heat resistance and carbon film, which is applied in the direction of resistance manufacturing, thick film resistors, non-adjustable metal resistors, etc., can solve the problems of carbon film resistance to heat and humidity, etc., to enhance hydrophobicity, improve strength, and excellent high temperature resistance The effect of discoloration

Inactive Publication Date: 2018-04-24
SICHUAN QIXING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to: aim at the problem that the above existing carbon film has poor heat and humidity resistance due to the use of phenolic resin, the present invention provides a heat and humidity resistant carbon film and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A damp and heat resistant carbon film, comprising the following raw materials in parts by weight: 20 parts of graphite, 5 parts of carbon black, 3 parts of polyvinylidene fluoride resin, 2 parts of nano silicon dioxide, 2 parts of copper powder, and 1 part of damp and heat resistant adhesive.

[0028] A preparation method of heat and humidity resistant carbon film, comprising the following steps:

[0029] (1) Put the insulating matrix into water and ethanol in turn for ultrasonic cleaning and drying;

[0030] (2) The insulating substrate is placed in a vacuum coating machine and coated with a bottom carbon film layer with a thickness of 1-3 μm, and the vacuum degree is 5×10 -4 Above, the coating speed is 50nm / s;

[0031] (3) Mix graphite, carbon black, polyvinylidene fluoride resin, nano-silicon dioxide, copper powder and a part of heat and humidity resistant adhesive evenly, and prepare a suspension. The solvent used in the suspension is propanol, and the volume fract...

Embodiment 2

[0036] The only difference between this embodiment and Embodiment 1 is: a heat-and-moisture resistant carbon film, comprising the following raw materials in parts by weight: 25 parts of graphite, 6 parts of carbon black, 3.5 parts of polyvinylidene fluoride resin, nano silicon dioxide 2.5 parts, copper powder 2.2 parts, heat and humidity resistant adhesive 1.5 parts.

Embodiment 3

[0038] The only difference between this embodiment and Embodiment 1 is: a heat-and-moisture resistant carbon film, comprising the following raw materials in parts by weight: 30 parts by weight of graphite, 8 parts by carbon black, polyvinylidene fluoride 4 parts of resin, 3.5 parts of nano silicon dioxide, 2.5 parts of copper powder, 2 parts of heat and humidity resistant adhesive.

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Abstract

The invention discloses a heat-and-humidity resistant carbon film and a preparation method thereof, comprising the following raw materials in parts by weight: 20-40 parts of graphite, 5-10 parts of carbon black, 3-6 parts of polyvinylidene fluoride resin, and nano silicon dioxide 2‑5 parts, 2‑3 parts copper powder, 1‑3 parts heat and humidity resistant adhesive. The present invention uses polyvinylidene fluoride resin to replace traditional phenolic resin, which solves the problem of poor heat and humidity resistance of the existing carbon film, and adds nano-silica to fully and uniformly disperse it into polyvinylidene fluoride resin, Improve the strength, elongation, wear resistance and anti-aging performance of polyvinylidene fluoride resin, and use the small size effect of nano-silica to help make the carbon film denser and form a silica structure on the surface of the carbon film. Auxiliary to enhance the hydrophobicity of the carbon film, and further improve the moisture resistance of the carbon film.

Description

technical field [0001] The invention belongs to the technical field of resistor preparation, and in particular relates to a damp heat resistant carbon film and a preparation method thereof. Background technique [0002] Carbon film resistors are formed by coating carbon ink, graphite and fillers into a suspension on an insulating substrate with an organic binder, and then polymerized by heating. Carbon film resistors used to be the most widely used resistors in electronics, electrical appliances, and information products. They have the cheapest price, good quality stability, and high reliability. However, the existing carbon films generally contain phenolic resin, and the phenolic hydroxyl group in phenolic resin is strong. Polar groups are easy to absorb water, which reduces the electrical properties of phenolic resins and is brittle. The phenolic hydroxyl groups are also susceptible to heat or changes under the action of ultraviolet light, forming quinones or other structu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/00H01C17/065
CPCH01C7/003H01C17/065
Inventor 江明泓
Owner SICHUAN QIXING ELECTRONICS