Phase change wave-absorption and heat-conducting material as well as preparation method and application thereof

Abstract

The invention provides a phase change wave-absorption and heat-conducting material and a preparation method thereof. The phase change wave-absorption and heat-conducting material is prepared from thefollowing components in parts by weight: 15 to 25 parts of a basic phase change material, 0.1 to 5 parts of an antioxidant, 0.1 to 5 parts of a crosslinking agent, 0.1 to 5 parts of a coupling agent and 60 to 85 parts of wave-absorption and heat-conducting particles, wherein the solid-liquid phase transformation point of the basic phase change material is 40 to 80 DEG C. The phase change wave-absorption and heat-conducting material can be used for dissipating heat of electronic equipment.

Description

technical field [0001] The invention relates to a heat dissipation material and a preparation method thereof, in particular to a phase-change wave-absorbing heat conduction material and a preparation method thereof, which can be used for heat dissipation of electronic equipment. Background technique [0002] With the trend of thinner and faster electronic devices, the problem of heat dissipation and electromagnetic interference in any part of electronic devices may become more and more serious, thus affecting the normal working performance of electronic devices and even crashing. The parts that are prone to heat dissipation problems are usually some chip positions with digital control / power amplification. In the prior art, a thermal pad is usually used to effectively export or conduct excess heat to the heat dissipation module, so that the chip does not overheat, and the surface heat spreads evenly along the surface, avoiding the occurrence of point heat source problems and ...

AI Technical Summary

Problems solved by technology

[0003] 1) Occupy institutional space;

[0004] 2) The thermal conductivity of the heat-conducting material and the wave-absorbing material are different, and the thermal resistance of the interface is large, and it is impossible to achieve a good heat dissipation effect when they are bonded together;

[0005] 3) The use of heat-conducting materials and wave-absorbing materials together will lead to an increase in cost;

[0006] 4) Neither the heat-conducting sheet nor the wave-absorbing sheet can be used in a small space

However, it may have the following problems: ①The product is a solid sheet structure with poor interface wettability; ②Its thermal conductivity and magnetic permeability are low, and its thermal conductivity and wave absorption performance are not good.

However, it has the following problems: ① Its thermal conductivity and magnetic permeability are low, and its thermal conductivity and microwave absorption performance are not good. ② The wave-absorbing layer is on the outer layer, which cannot directly contact with electronic components, and the efficiency of absorbing electromagnetic interference is poor.

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