Phase change wave-absorption and heat-conducting material as well as preparation method and application thereof

A technology of heat-conducting materials and phase-change materials, which is applied in the direction of heat exchange materials, chemical instruments and methods, and modification using liquid cooling, etc. It can solve the problem that heat-conducting sheets or wave-absorbing sheets cannot be used, and cannot achieve good heat dissipation effects. Problems such as poor heat conduction and wave absorption performance, to achieve the effects of good lateral thermal diffusion performance, excellent interface wetting ability, and excellent thermal conductivity
CN108003841AInactive Publication Date: 2018-05-08HEFEI LCFC INFORMATION TECH
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HEFEI LCFC INFORMATION TECH
Publication Date
2018-05-08
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a phase change wave-absorption and heat-conducting material and a preparation method thereof. The phase change wave-absorption and heat-conducting material is prepared from thefollowing components in parts by weight: 15 to 25 parts of a basic phase change material, 0.1 to 5 parts of an antioxidant, 0.1 to 5 parts of a crosslinking agent, 0.1 to 5 parts of a coupling agent and 60 to 85 parts of wave-absorption and heat-conducting particles, wherein the solid-liquid phase transformation point of the basic phase change material is 40 to 80 DEG C. The phase change wave-absorption and heat-conducting material can be used for dissipating heat of electronic equipment.
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Description

technical field

[0001] The invention relates to a heat dissipation material and a preparation method thereof, in particular to a phase-change wave-absorbing heat conduction material and a preparation method thereof, which can be used for heat dissipation of electronic equipment. Background technique

[0002] With the trend of thinner and faster electronic devices, the problem of heat dissipation and electromagnetic interference in any part of electronic devices may become more and more serious, thus affecting the normal working performance of electronic devices and even crashing. The parts that are prone to heat dissipation problems are usually some chip positions with digital control / power amplification. In the prior art, a thermal pad is usually used to effectively export or conduct excess heat to the heat dissipation module, so that the chip does not overheat, and the surface heat spreads evenly along the surface, avoiding the occurrence of point heat source problems and ...

Claims

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