Phase change wave-absorption and heat-conducting material as well as preparation method and application thereof

A technology of heat-conducting materials and phase-change materials, which is applied in the direction of heat exchange materials, chemical instruments and methods, and modification using liquid cooling, etc. It can solve the problem that heat-conducting sheets or wave-absorbing sheets cannot be used, and cannot achieve good heat dissipation effects. Problems such as poor heat conduction and wave absorption performance, to achieve the effects of good lateral thermal diffusion performance, excellent interface wetting ability, and excellent thermal conductivity

Inactive Publication Date: 2018-05-08
HEFEI LCFC INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1) Occupy institutional space;
[0004] 2) The thermal conductivity of the heat-conducting material and the wave-absorbing material are different, and the thermal resistance of the interface is large, and it is impossible to achieve a good heat dissipation effect when they are bonded together;
[0005] 3) The use of heat-conducting materials and wave-absorbing materials together will lead to an increase in cost;
[0006] 4) Neither the heat-conducting sheet nor the wave-absorbing sheet can be used in a small space
However, it may have the following problems: ①The product is a solid sheet structure with poor interface wettability; ②Its thermal conductivity and magnetic permeability are low, and its thermal conductivity and wave absorption performance are not good.
However, it has the following problems: ① Its thermal conductivity and magnetic permeability are low, and its thermal conductivity and microwave absorption performance are not good. ② The wave-absorbing layer is on the outer layer, which cannot directly contact with electronic components, and the efficiency of absorbing electromagnetic interference is poor.

Method used

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  • Phase change wave-absorption and heat-conducting material as well as preparation method and application thereof
  • Phase change wave-absorption and heat-conducting material as well as preparation method and application thereof
  • Phase change wave-absorption and heat-conducting material as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] The mass formula ratio of each component of the phase-change wave-absorbing heat-conducting material is as follows:

[0051]

[0052] Add fully refined No. 58 paraffin wax, antioxidant 1076, and coupling agent γ-methacryloxypropyltrimethoxysilane to the planetary dynamic mixer according to the stated formula ratio, raise the temperature to 70°C, and stir for 45 Then add the cross-linking agent trimethoxysilane and stir for 10 minutes until the cross-linking agent is completely dissolved; add wave-absorbing and heat-conducting particles (spherical carbonyl iron powder and flake carbonyl iron powder) in batches, and stir for 75 Minutes, after observing that the mixture is uniform, vacuum defoaming was carried out for 45 minutes to obtain the phase-change wave-absorbing heat-conducting material sample 1.

Embodiment 2

[0054] The mass formula ratio of each component of the phase-change wave-absorbing heat-conducting material is as follows:

[0055]

[0056] Add low melting point wax PE80, 2,2'-methylene-bis-(4-methyl-6-tert-butylphenol), coupling agent isopropyl trioil to the planetary power mixer according to the formula ratio Acid acyloxy titanate, raise the temperature to 70°C, stir for 45 minutes to form a uniform paste; then add the cross-linking agent trimethoxysilane, stir for 10 minutes until the cross-linking agent is completely dissolved; add wave-absorbing heat conduction in batches Heat conduction particles (spherical carbonyl iron powder and flaky carbonyl iron powder) were stirred for 75 minutes. After observing that the mixture was uniform, vacuum defoaming was performed for 45 minutes to obtain phase change wave-absorbing heat conduction material sample 2.

Embodiment 3

[0058] The mass formula ratio of each component of the phase-change wave-absorbing heat-conducting material is as follows:

[0059]

[0060] Add microcrystalline wax 70#, antioxidant 1010, and coupling agent γ-aminopropyltriethoxysilane to the planetary dynamic mixer according to the formula ratio, raise the temperature to 70°C, and stir for 45 minutes to form a uniform Paste; then add the cross-linking agent zinc acetate and stir for 10 minutes until the cross-linking agent is completely dissolved; add wave-absorbing and heat-conducting heat-conducting particles (spherical carbonyl iron powder and flake carbonyl iron powder) in batches, stir for 75 minutes, and observe that the mixture is uniform , vacuum defoaming was carried out for 45 minutes to obtain phase-change wave-absorbing heat-conducting material sample 3.

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PUM

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Abstract

The invention provides a phase change wave-absorption and heat-conducting material and a preparation method thereof. The phase change wave-absorption and heat-conducting material is prepared from thefollowing components in parts by weight: 15 to 25 parts of a basic phase change material, 0.1 to 5 parts of an antioxidant, 0.1 to 5 parts of a crosslinking agent, 0.1 to 5 parts of a coupling agent and 60 to 85 parts of wave-absorption and heat-conducting particles, wherein the solid-liquid phase transformation point of the basic phase change material is 40 to 80 DEG C. The phase change wave-absorption and heat-conducting material can be used for dissipating heat of electronic equipment.

Description

technical field [0001] The invention relates to a heat dissipation material and a preparation method thereof, in particular to a phase-change wave-absorbing heat conduction material and a preparation method thereof, which can be used for heat dissipation of electronic equipment. Background technique [0002] With the trend of thinner and faster electronic devices, the problem of heat dissipation and electromagnetic interference in any part of electronic devices may become more and more serious, thus affecting the normal working performance of electronic devices and even crashing. The parts that are prone to heat dissipation problems are usually some chip positions with digital control / power amplification. In the prior art, a thermal pad is usually used to effectively export or conduct excess heat to the heat dissipation module, so that the chip does not overheat, and the surface heat spreads evenly along the surface, avoiding the occurrence of point heat source problems and ...

Claims

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Application Information

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IPC IPC(8): C09K5/06H05K7/20H05K9/00
CPCC09K5/066H05K7/2029H05K9/0081
Inventor 杨阳汪建安
Owner HEFEI LCFC INFORMATION TECH
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