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A low-cost and rapid mass-fabrication method for integrated micro-thin-film thermoelectric devices

A technology for thermoelectric devices and manufacturing methods, which is applied in the manufacture/processing of thermoelectric devices, instruments, opto-mechanical equipment, etc., and can solve the problems of inapplicability to micro-thin film thermoelectric devices, complex lithography preparation process, and not reaching the micron level. , to achieve the effect of reducing preparation cost, broad application prospect and simple equipment

Active Publication Date: 2021-02-19
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is that the traditional mechanical processing method of thermoelectric devices is not suitable for the preparation of micro-thin-film thermoelectric devices, which cannot reach the micron level, and the existing photolithographic preparation process of thin-film thermoelectric devices is too complicated and expensive

Method used

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  • A low-cost and rapid mass-fabrication method for integrated micro-thin-film thermoelectric devices
  • A low-cost and rapid mass-fabrication method for integrated micro-thin-film thermoelectric devices
  • A low-cost and rapid mass-fabrication method for integrated micro-thin-film thermoelectric devices

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Experimental program
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Effect test

Embodiment 1

[0055] In the present invention, a 200 μm thick stainless steel plate is selected as the conductive base material, and Ordyl-50100 negative acrylate polymer-based dry film negative photoresist is selected as an electroplating template to replace the SU8 negative epoxy resin-based liquid photoresist. Ordyl-50100 is easy to handle and easy to remove later. Concrete preparation process is as follows:

[0056] (1) Ultrasonic cleaning, degreasing, drying and insulation of single-sided tape on the stainless steel plate of the conductive base material;

[0057] (2) The photoresist template can be heated and pressurized by using a laminating machine or equipment with a hot roller. The pressure of the hot roller is 310Kpa, and the lamination speed is set to 40cm min -1 , the equipment temperature is set to 100°C, so that the dry film melts and sticks to the stainless steel plate of the conductive base material;

[0058] (3) Print the required N-type (or P-type) thermoelectric legs de...

Embodiment 2

[0068] Different from Example 1, the present invention selects a polyimide film with a thickness of 20 μm, on which electroless copper plating is used as the conductive base material, and DFP acrylate dry film negative photoresist is selected as the electroplating template to replace the SU8 negative ring Oxygen based liquid photoresists. Concrete preparation process is as follows:

[0069] (1) Configure an electroless copper plating solution, carry out electroless copper plating to the polyimide film, carry out ultrasonic cleaning to the copper-plated polyimide base material, degrease, and dry;

[0070] (2) The photoresist template can be heated and pressurized by using a wheeled laminator or other hot roller equipment. The pressure of the hot roller is 250Kpa, and the lamination speed is set to 20cm min -1 , the temperature of the equipment is set to 50°C, so that the dry film is melted and attached to the copper-plated polyimide side. Due to the flexibility of polyimide, a...

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Abstract

The invention discloses a low-cost manufacturing method capable of rapidly and mass-preparing integrated micro-thin film thermoelectric devices. The method uses cheap thick negative photoresist dry film to replace SU-8 negative epoxy resin-based photoresist and other The type of photoresist that is difficult to process and remove is used as a template; the surface is smooth and conductive material is used as the substrate; the low-energy and low-cost exposure light source combines the photoresist dry film with the conductive material, and sequentially produces microscopic P-type and N-type thermoelectric legs. region; sequentially electrochemically deposit P-type and N-type thermoelectric leg arrays in the micro-region of thermoelectric materials; finally remove the photoresist template, transfer the thermoelectric leg arrays to the insulating substrate; assemble and integrate the thermoelectric leg arrays, and finally prepare a winding, Integrated micro-thin film thermoelectric devices of any shape, such as wheel-spoke type and multi-layer superposition type. The invention designs a dry film of photoresist with low price and simple operation process as an electroplating template combined with an electrochemical deposition method to realize low-cost, rapid and mass production of integrated thin-film thermoelectric devices.

Description

Technical field: [0001] The invention relates to a low-cost manufacturing method capable of rapidly and mass-preparing integrated micro-film thermoelectric devices, which belongs to the field of processing and integration of thermoelectric energy conversion materials and micro-energy devices. Background technique: [0002] In recent years, with the demand for energy supply of microelectronic equipment, and compared with other power generation and cooling devices, thermoelectric devices have no mechanical moving parts, conduct electrons in solids, have no vibration and noise, and have long service life, and have attracted widespread attention. Traditional thermoelectric refrigeration devices are bulky, and thermoelectric legs are often completed by traditional machining processes such as casting, cutting, and welding. With the application of small electronic devices such as wearable electronic devices and small sensors, existing mechanical processing Thermoelectric devices ca...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L35/34G03F7/00
CPCG03F7/0035H10N10/01
Inventor 刘云鹏李俊琴汤晓斌刘凯袁子程
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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