A kind of thermosetting resin composition
A resin composition and thermosetting technology, applied in the field of thermosetting resin composition, prepreg and laminates for printed circuits, can solve the problem of peel strength, low interlayer adhesion and bending strength, and dielectric properties of cured products. problems such as poor, difficult process control, etc., to achieve the effect of high functionality, high structural symmetry, and poor resistance to humidity and heat.
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[0075] The technical solutions of the present invention will be further described below through specific embodiments.
[0076] The following description is the specific implementation of the embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the embodiment of the present invention, some improvements and modifications can also be made. These improvements And retouching are also regarded as the scope of protection of the embodiments of the present invention.
[0077] The embodiments of the present invention will be further described below in several embodiments. Embodiments of the present invention are not limited to the following specific examples. Appropriate changes can be made without changing the scope of the claims.
[0078] 1. Synthesis of phosphine oxide active ester P-AE1
[0079] Two (4-formyl chloride phenyl) methyl phosphine oxides of 343g, 116g hydroquinone and 1500g p...
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