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A kind of thermosetting resin composition

A resin composition and thermosetting technology, applied in the field of thermosetting resin composition, prepreg and laminates for printed circuits, can solve the problem of peel strength, low interlayer adhesion and bending strength, and dielectric properties of cured products. problems such as poor, difficult process control, etc., to achieve the effect of high functionality, high structural symmetry, and poor resistance to humidity and heat.

Inactive Publication Date: 2019-08-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Dicarboxyarylhydrocarbyl phosphine oxide is a reactive phosphorus-containing curing agent, which can undergo a curing reaction with epoxy resin, but because its active group is carboxyl, it will generate a more polar secondary after reacting with epoxy resin. Hydroxyl, resulting in poor dielectric properties of the cured product
Moreover, the carboxyl group has strong reactivity, and its process control is too difficult
In CN103384674A, polyphosphonate or / and phosphonate-carbonate copolymer and epoxy composition with hydroxyl groups are used to form a composition, and its active group is a phenolic hydroxyl group, which also has the problem of poor dielectric properties
Disclosed in CN103694642A adopts epoxy resin, cyanate compound or / and cyanate prepolymer, polyphosphonate or / and phosphonate-carbonate copolymer to prepare the non-conductive material with good dielectric performance and heat and humidity resistance. Halogen UL94V-0 is flame retardant, but its peel strength, interlayer adhesion and bending strength are low

Method used

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  • A kind of thermosetting resin composition
  • A kind of thermosetting resin composition
  • A kind of thermosetting resin composition

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Embodiment Construction

[0075] The technical solutions of the present invention will be further described below through specific embodiments.

[0076] The following description is the specific implementation of the embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the embodiment of the present invention, some improvements and modifications can also be made. These improvements And retouching are also regarded as the scope of protection of the embodiments of the present invention.

[0077] The embodiments of the present invention will be further described below in several embodiments. Embodiments of the present invention are not limited to the following specific examples. Appropriate changes can be made without changing the scope of the claims.

[0078] 1. Synthesis of phosphine oxide active ester P-AE1

[0079] Two (4-formyl chloride phenyl) methyl phosphine oxides of 343g, 116g hydroquinone and 1500g p...

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Abstract

Provided is a thermosetting resin composition comprising a phosphorus-containing active ester, the thermosetting resin composition has the advantages of good thermal stability, moisture and heat resistance, a low dielectric constant and a dielectric loss tangent, a low water absorption, a halogen-free flame retardant effect, etc., and it has excellent processability. Also provided is a use of the thermosetting resin composition in a resin sheet, a resin composite metal foil, a prepreg, a laminate, a metal foil laminate and a printed wiring board.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a thermosetting resin composition, a prepreg using it and a laminated board for printed circuits. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/42C08L63/00
Inventor 罗成唐国坊许永静
Owner GUANGDONG SHENGYI SCI TECH