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A kind of epoxy base permeable mold adhesive and its application

A mold glue and epoxy-based technology, applied in the field of adhesives, can solve problems such as poor dispersion stability, no large-scale application, and complicated curing molding process

Active Publication Date: 2020-08-07
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dispersion process and curing molding process are complicated, and the dispersion prepared by using an external surfactant has poor stability and low mold strength. It has not been used on a large scale so far.

Method used

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  • A kind of epoxy base permeable mold adhesive and its application
  • A kind of epoxy base permeable mold adhesive and its application
  • A kind of epoxy base permeable mold adhesive and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] The preparation of embodiment 1 phenalkamide (amidophenalkamine):

[0078] (1) Salicylaminophenalkamine: Add 1 mole of nonylphenol, 1 mole of tetraethylenepentamine and 1 mole of formaldehyde solution (calculated based on the actual formaldehyde used) in a 1000 ml three-necked flask at 10°C, then heat up React at 70°C for 6 hours, heat up to 160°C and continue to react for 2 hours, remove water and cool to obtain 1 mole of Mannich base phenolic polyamine, then add 1 mole of o-hydroxybenzoic acid (also known as salicylic acid) and heat up to 160°C After reacting for 6 hours, the temperature was raised to 200° C. for further dehydration and amidation reaction for 3 hours. After cooling, the phenalkamide FQXA1-salicylamidophenalkamine shown in formula (1) was mainly obtained. Sampling, infrared detection, obtained as figure 1 The infrared spectrum shown.

[0079] (2) Methoxybenzamidophenalkamine: add 1 mole of cardanol, 1 mole of pentaethylenehexamine and 1 mole of parafo...

Embodiment 3

[0084] The preparation of embodiment 3 aromatic amidoamines

[0085] (1) Hydroxymethylbenzamidoamine: Add 1 mole of tetraethylenepentamine and 1 mole of o-hydroxymethylbenzoic acid lactone to a 500-ml three-neck flask at room temperature, and heat up to 100°C for 3 hours , and then heated up to 150° C. to react for 1 hour, and cooled to obtain mainly aromatic amidoamine FXXA6-hydroxymethylbenzamidoamine as shown in formula (4). Sampling, infrared detection, obtained as Figure 5 The infrared spectrum shown.

[0086] (2) Salicylamidoamine: Add 1 mole of diethylenetriamine and 1 mole of salicylic acid to a 500-ml three-necked flask, heat up to 160°C for 5 hours, then heat up to 200°C for 3 hours and remove water, cooling, to obtain mainly aromatic amidoamine FXXA7-salicylamidoamine as shown in formula (4). Sampling, infrared detection, obtained as Figure 6 The infrared spectrum shown.

Embodiment 4

[0087] The preparation of embodiment 4 polyamide

[0088] (1) Add 2 moles of triethylenetetramine and 1 mole of C21 dibasic acid (Medevisvik C21 dibasic acid DIACID 1550) into a 1000 ml three-necked flask, heat up to 120°C for 2 hours, then heat up React at 160°C for 8 hours, remove water, and cool to obtain polyamide PA8, which is set aside.

[0089] (2) In a three-necked flask of 1000 milliliters, add 1.5 moles of triethylenetetramine, 0.5 moles of m-xylylenediamine and 1 mole of high-purity dimer acid ATUREX 1001 (dimer C36 dibasic acid content 99.1wt% , Jiangxi Aiturike Industrial Co., Ltd.), heated to 120 ° C for 1 hour, then heated to 170 ° C for 2 hours, then heated to 200 ° C for 1 hour and removed water, cooled to obtain polyamide PA9, set aside.

[0090] (3) Add 1 mole of triethylenetetramine, 1 mole of N-aminoethylpiperazine and 1 mole of high-purity dimer acid ATUREX 1004 (dimer C36 dibasic acid content 88.3 wt%, trimer C54 tribasic acid content is 11.2wt%, Jiang...

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Abstract

The invention discloses an epoxy permeable mold glue and application thereof. The permeable mold glue consists of a self-emulsifying compound amine type curing agent system, an epoxy resin system andan aqueous phase slurry pore-forming agent, wherein organic active matters of the self-emulsifying compound amine type curing agent system comprise 20wt% to 40wt% of phenolic amide / phenolic imine, 5wt% to 25wt% of cyclic polyamine / aromatic acylamino amide, 30wt% to 55wt% of polyamide and 0 to 15wt% of a thinner. At room temperature, the epoxy resin system and the curing agent system are uniformlymixed in proportion according to the mass ratio of 100: (50 to 100) for procuring for 2 to 10 min, the aqueous phase slurry pore-forming agent occupying 60% to 75% of total glue weight is added, and after the components are quickly and uniformly mixed, a through hole type permeable mold with relatively high strength can be formed through casting, so that the epoxy permeable mold glue can be applied to the fields of porous permeable molds, filter pressing materials, adsorption separation materials, grouting materials and the like.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to an epoxy-based water-permeable mold adhesive and its application. Background technique [0002] Gypsum-type permeable molds are traditional molds used in the ceramic industry for a long time, but the weaknesses of gypsum, such as low strength, short service life, poor quality, and low production efficiency, severely limit the transformation and upgrading of the domestic ceramic industry. Therefore, the development of new molds with high strength and high Efficiency and wear-resistant precision molds have become an important issue that needs to be solved urgently. [0003] Polymer porous mold or porous plastic mold formed by organic resin glue has light weight, high strength, good toughness, acid and alkali corrosion resistance and long service life, and is easy to form various complex molds. It is a better mold for ceramic molding. Material. Epoxy resin has almost no shrink...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L71/02C08K3/36C08K3/22C08K3/26C08K3/34C08J9/28C08G59/46C08G59/56
CPCC08G59/46C08G59/56C08J9/28C08J2363/00C08J2471/02C08K3/346C08K3/36C08K2003/2227C08K2003/265
Inventor 黄月文刘海俊王斌
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI