UV adhesion-reduced film and preparation method thereof

Abstract

The invention relates to the technical field of protective films, in particular to a UV adhesion-reduced film and a preparation method thereof. The UV adhesion-reduced film comprises a substrate layer, a UV adhesion-reduced layer and a release film layer which are sequentially adhered, wherein the UV adhesion-reduced layer is obtained by coating the surface of the substrate layer with UV adhesion-reduced composition, the UV adhesion-reduced composition contains an antistatic agent; the surface resistivity of the substrate layer is lower than or equal to 10<11> omega/m<2>. The preparation method of the UV adhesion-reduced film comprises the following steps: coating the surface of the substrate layer with the UV adhesion-reduced composition, adhering the release film layer on the UV adhesion-reduced composition after pre-drying, and performing curing to obtain the UV adhesion-reduced film. The UV adhesion-reduced film has excellent adhesive force before UV irradiation, the adhesive forceis greatly reduced after UV irradiation, and the ad film is easy to peel off and has excellent antistatic effect when used cooperatively with a substrate having antistatic effect.

Description

technical field [0001] The invention relates to the technical field of protective films, in particular to a UV mucous reducing film and a preparation method thereof. Background technique [0002] In the semiconductor manufacturing process, when cutting and polishing semiconductor wafers, in order to reduce the defect density of silicon thin layers, wafer cutting and adhesion-reducing protective films are often used. Anti-adhesive protective film means that the adhesive force is strong when it is used, and the adhesive force is weakened for peeling in the later peeling process. [0003] At present, most of the anti-adhesive protective films on the market are UV anti-adhesive protective films, which means that they have high adhesive force and good adhesion before UV irradiation, and the adhesive force decreases significantly after UV irradiation and is easy to peel off. In the domestic market, most of the UV viscosifying adhesives used for protection of wafer cutting and pic...

AI Technical Summary

Problems solved by technology

In the domestic market, most of the UV viscosifying adhesives used for wafer cutting and picking process protection are mainly in Japan and Taiwan, China. There are also several domestic UV viscosifying adhesives that are developing and promoting, but their performance is not yet fully stable.

Moreover, the base material of the UV anti-adhesive protective film is prone to static electricity due to friction during use, and its use in the field of electronic parts with high static requirements is limited, such as easy to absorb dust, and then transferred to the attached product The surface, or the electrostatic voltage is too high, resulting in defective parts, etc.

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