Heatproof resin composite material and preparation method thereof

A composite material and heat-resistant resin technology, applied in the field of heat-resistant resin composite materials and their preparation, to achieve the effects of good compatibility, good mechanical properties and high purity

Inactive Publication Date: 2018-06-29
SUZHOU YIKETAI ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Simple resins can no longer meet the application of copper clad laminates. Therefore, the use of composite technology not only integrates the advantages of organic and inorganic materials, but also combines different organic components. It is hoped that resin materials suitable for industrial applications can be prepared.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1 A molding compound for heat-resistant resin composite materials, the preparation method of which comprises the following steps:

[0027] (1) At room temperature, mix 3,3'-dithiodipropionic acid, dichloromethane, and acetone; then add pyridinium m-nitrobenzenesulfonate and manganese acetate, stir for 30 minutes, and then add N-methylolpropene Amide, after stirring for 3 hours, add 2,3-epoxy cyclopentyl cyclopentyl ether, after stirring for 50 minutes, add methylcyclohexene tetracarboxylic dianhydride, continue stirring for 20 minutes; then add N, N' -dicyclohexylcarbodiimide, continue to stir for 10 minutes to obtain monofunctional epoxy system;

[0028] (2) Mix nano-hollow alumina and isomeric undecyl alcohol polyoxyethylene ether for 30 minutes, then add it to diglycidyl phthalate, stir at 125°C for 20 minutes, then add 1,8-octanedithiol, Stir at 130°C for 50 minutes to obtain a bifunctional epoxy system;

[0029] (3) Add the monofunctional epoxy system ...

Embodiment 2

[0032] The molding compound prepared in Example 1 was hot-pressed to obtain a heat-resistant resin composite material. The hot-pressing conditions were 0.8MPa / 130°C / 30min+1.2MPa / 170°C / 40min+1.8MPa / 190°C / 3min+200°C / 10min, the performance test is shown in Table 1.

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PUM

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Abstract

The invention relates to a heatproof resin composite material and a preparation method thereof. The preparation method comprises following steps: at first, preparing single function group epoxy and dual function group epoxy, mixing single function group epoxy and dual function group epoxy with silicon carbide fibers, stirring the mixture in a fuming hood with a temperature of 130 DEG C for 50 minutes, pouring the mixture into a flat mould, naturally cooling, grinding the mould to obtain a moulding compound, and subjecting the moulding compound to hot pressing to obtain the heatproof resin composite material. The composite material has an excellent flame retardant performance and heatproof performance, and can meet the application and development requirements.

Description

technical field [0001] The invention belongs to the technical field of modified resin materials, and in particular relates to a heat-resistant resin composite material and a preparation method thereof, and the obtained product has good thermal properties. Background technique [0002] With the continuous development of science and technology, the application of polymer matrix composites is becoming more and more extensive. At the same time, various application fields also put forward higher requirements for different materials. Especially in cutting-edge science and technology fields such as the aerospace industry, the performance requirements of materials are more stringent. For example, they require composite materials to have high specific strength, high specific stiffness, high temperature resistance, and ablation resistance. Simple resins can no longer meet the application of copper clad laminates. Therefore, the use of composite technology not only integrates the adva...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/24C08G59/20C08G59/42C08G59/58C08K9/04C08K7/24C08K7/10
Inventor 彭代信韩建
Owner SUZHOU YIKETAI ELECTRONICS MATERIAL
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