Heat dissipation coating for power device and preparation method thereof

Abstract

The invention discloses a heat dissipation coating for a power device and a preparation method thereof. The coating is prepared from the following raw materials in parts by weight: 40 to 48 parts of organic silicon resin, 12 to 16 parts of conductive metal powder, 9 to 13 parts of carbon nano tube, 3 to 5 parts of silicon dioxide, 4 to 8 parts of polyacrylamide, 2 to 4 parts of bentonite, 1 to 4 parts of dioctyl phthalate, 4 to 6 parts of silicon nitride, 2 to 5 parts of nano titanium dioxide, 4 to 8 parts of polyvinyl butyral, 1 to 3 parts of adhesion promoter, 0.5 to 2.8 parts of dispersingagent, 0.3 to 2.2 parts of leveling agent and 22 to 34 parts of solvent. The heat dissipation coating disclosed by the invention has a heat dissipation function, can effectively reduce temperatures ofthe surface and the inside of the power device and has obvious heat dissipation and cooling effects.

Description

technical field [0001] The invention relates to the technical field of chemical coatings, in particular to a heat dissipation coating for power devices and a preparation method thereof. Background technique [0002] In actual work, the heat generated by highly integrated high-power devices will increase the temperature of the chip. If the heat dissipation is slow, the temperature of the chip may rise to exceed the maximum allowable junction temperature, and the performance of the device will be significantly reduced, and It cannot work stably, and may even burn out directly. Therefore, controlling the heating rate of high-power devices to keep the internal temperature of the chip within the allowable junction temperature and ensure the stable operation of the machine has become the focus and difficult problem in the field of high-power device technology research. [0003] Since power devices need insulation protection, the heat dissipation of power devices mostly adopts air...

AI Technical Summary

Problems solved by technology

When the air-cooled heat dissipation mode is adopted, the specific heat capacity of the air is small, and the heat taken away by the air is relatively small. Facing the power devices with increasingly compact structure and increasing power, the air-cooled heat dissipation mode cannot meet the heat dissipation requirements

When the water-cooled plate radiator is used, the high-power devices are directly attached to the surface of the water-cooled plate radiator, and the heat is dissipated through the circulating flow of cooling water. On the one hand, this heat dissipation method may cause liquid leakage to cause shutdown, and on the other hand, the water-cooled substrate The scale formed by the long-term use of the radiator will greatly reduce the thermal conductivity, and the contact thermal resistance is large, which cannot meet the heat dissipation requirements of high-power devices

At the same time, the heat dissipation cost of these two heat dissipation methods is relatively high, resulting in a waste of resources