Pressure maintaining-free PUR hot-melt adhesive and preparation method thereof

A technology of hot melt adhesives and functional additives, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve problems such as poor initial adhesion, low efficiency, and long holding time, and achieve strength No attenuation, wide application range, and the effect of improving production efficiency

Inactive Publication Date: 2018-07-17
SHENZHEN PROSPER DOBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of poor initial adhesion, long holding time and low efficiency of existing PUR hot melt adhesive pr...

Method used

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  • Pressure maintaining-free PUR hot-melt adhesive and preparation method thereof
  • Pressure maintaining-free PUR hot-melt adhesive and preparation method thereof
  • Pressure maintaining-free PUR hot-melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0040] The preparation method of the pressure-holding-free PUR hot-melt adhesive that the present invention proposes, the steps are as follows:

[0041] Step 1: Weigh the Portions

[0042] Each component is weighed according to the proportion of the pressure-free PUR hot melt adhesive, wherein, as required, the components of the functional additive are selected, and the specific gravity of each component is determined.

[0043] Step 2: Raw material dehydration

[0044] Put the polyether polyol and thermoplastic resin into the reaction kettle, stir and dissolve in vacuum at 120~130°C for 2 hours; then add crystalline polyester polyol, liquid non-crystalline polyester polyol, solid non-crystalline polyester polyol 1. Put it into the reaction kettle, under the nitrogen condition of 120-130 ℃, vacuum stir to remove water for more than 1 hour, until the water content does not exceed 500ppm, and obtain the primary mixture. When the input components contain powder, first turn on th...

Embodiment 1

[0070] The present embodiment is formulated from the following raw materials in weight percentage:

[0071]

[0072] According to the above weight percentage formula, the process steps of preparing pressure-free hot melt adhesive are as follows:

[0073] (1) Dehydration of raw materials: Put 25 parts of polyether polyol 2120 and 15 parts of acrylic resin BR106 into a dual planetary mixer reactor, stir and dissolve in vacuum at 120-130°C for 2 hours, and under nitrogen, mix 20 parts of crystalline polyester polyol Alcohol POL-536, 10 parts of crystalline polyester polyol dynacoll 7360, 14 parts of non-crystalline polyester polyol dynacoll 7150, antioxidant Irganon245, defoamer BYK A-550 were put into the reactor, the nitrogen gas was turned off, and the reactor was sealed. After the material is basically melted, turn on stirring and dispersing. Under the condition of 120-130°C, remove water under vacuum for 2 hours, and test the moisture content of the material. If the moist...

Embodiment 2

[0080] The present embodiment is formulated from the following raw materials in weight percentage:

[0081]

[0082] According to the above weight percentage formula, the process steps of preparing pressure-free hot melt adhesive are as follows:

[0083] (1) Dehydration of raw materials: Put 20 parts of polyether polyol WD2110 and 12 parts of acrylic resin BR113 into a dual planetary mixer reactor, stir and dissolve in vacuum at 120-130°C for 2 hours, and under nitrogen, mix 32 parts of crystalline polyester polyol Alcohol POL-538, 10 parts of non-crystalline polyester polyol dynacoll 7210, 10 parts of non-crystalline polyester polyol dynacoll 7150, 0.15 parts of defoamer BYKA-550, 0.1 part of dehydrating agent Additive TI were put into the reactor, and the nitrogen gas was turned off. Seal the reaction kettle. After the material is basically melted, start the stirring and start the dispersion. Under the condition of 120-130 ℃, remove the water in vacuum for 2 hours, and te...

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Abstract

The invention discloses a pressure maintaining-free PUR hot-melt adhesive and a preparation method thereof. The pressure maintaining-free PUR hot-melt adhesive is prepared from, by weight, 0-30.0% ofpolyether polyol, 15.0-45.0% of crystalline polyester polyol, 0-20.0% of liquid non-crystalline polyester polyol, 0-20.0% of solid non-crystalline polyester polyol, 10.0-30.0% of isocyanate monomer, 0-30.0% of thermoplastic resin, 0.05-1.0% of catalyst and 0-10.0% of functional agent. Compared with the traditional PUR hot-melt adhesive, the pressure maintaining-free PUR hot-melt adhesive has excellent initial adhesive performance, good adhesive performance and good high temperature resistance performance. The pressure maintaining-free PUR hot-melt adhesive has good adhesion and working stability to common engineering plastics, such as PC, ABS and the like, common metal materials, such as stainless steel, aluminum and the like, and various types of ink.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a pressure-holding-free PUR hot-melt adhesive used for electronic products such as mobile phones and tablet computers and a preparation method thereof. Background technique [0002] Polyurethane (PUR) hot melt adhesive refers to the base material of polyurethane prepolymer with isocyanate group as the end group, and then add various additives that do not react with it, such as thermoplastic resin, filler, catalyst, etc. After heating, the adhesive melts and can be flowed and dispersed on the surface of the substrate, and the adherend is bonded and then cooled to form a bond. Then, because the surface of the substrate contains a small amount of moisture or other compounds containing active hydrogen or moisture in the air, it reacts with isocyanate groups to extend the chain, thereby forming a polymer with a cross-linked network and high cohesion, which further enhanc...

Claims

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Application Information

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IPC IPC(8): C09J175/06C09J175/08C09J133/00C08G18/48C08G18/42
CPCC08G18/4018C08G18/4238C08G18/4825C08L2201/02C08L2203/20C09J175/06C09J175/08C09J2301/304C08L75/08C08L33/00
Inventor 贺超刘行袁海宾章松贺珍
Owner SHENZHEN PROSPER DOBOND TECH
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