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Nano powder and polyimide resin composition

A technology of nano-powder and polyimide, which is applied in the field of polyimide resin composition, can solve the problems of poor dispersion, insignificant effect of modified nano-powder, difficulty in scaling up the process, etc., and achieve good dispersion Performance and compatibility, low thermal expansion coefficient, high heat resistance effect

Inactive Publication Date: 2018-08-14
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the dispersibility of the nanopowder in the solvent is not good, the effect of modifying the surface of the modifier on the nanopowder will be less significant.
In addition, solvents with better dispersibility may also be toxic solvents, so the process is difficult to scale up

Method used

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  • Nano powder and polyimide resin composition
  • Nano powder and polyimide resin composition
  • Nano powder and polyimide resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment E1

[0057] 1. Preparation of polymerized nanopowder

[0058] first surface modification

[0059] Put the nanoparticles into the reaction tank and fill with liquid carbon dioxide, soak and stir as pretreatment. Wherein, the material of the nanoparticles is silicon dioxide. A silane-based modifier with an amino group at the end and an auxiliary solvent are added. Wherein, the silane modifier is 3-aminopropyltriethoxysilane, and the auxiliary solvent is methanol. Next, the pressure and temperature of the reaction tank are increased until the liquid carbon dioxide is transformed into a carbon dioxide supercritical fluid, and the reaction is carried out at a certain speed for about 2 hours. Wherein, the pressure of the carbon dioxide supercritical fluid may be 73 bar to 200 bar (bar), and the temperature may be 40°C to 60°C. After the reaction, the reaction tank is depressurized and the powder material is taken out, and the nanoparticles are cleaned with an organic solvent capable ...

Embodiment E2

[0065] 1. Preparation of polymerized nanopowder

[0066] The preparation method of the polymerized nanopowder in this example is the same as that in Example E1.

[0067] 2. Preparation of polyimide resin composition

[0068] The method for preparing the polyimide resin composition in this example is roughly the same as in Example E1, except that polyamic acid A is replaced by polyamic acid B, and polyamic acid B is changed from 2, 3, 3', 4' - Composed of biphenyltetracarboxylic dianhydride (BPDA), p-phenylenediamine (PDA) and 4,4'-diaminodicyclohexylmethane (MBCHA).

Embodiment E3

[0070] 1. Preparation of polymerized nanopowder

[0071] The preparation method of the polymerized nanopowder in this example is the same as that in Example E1.

[0072] 2. Preparation of polyimide resin composition

[0073] The method for preparing the polyimide resin composition in this example is roughly the same as that of Example E1, except that the polyamic acid A is replaced by polyamic acid C, and the secondary surface modification added to the polyamic acid C solution The ratio of the quality nano-powder of the present invention is about 5% by weight, wherein polyamic acid C is composed of pyromellitic dianhydride (PMDA) and 3,4'-diaminodiphenyl ether (3,4'-ODA) composition.

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PUM

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Abstract

The present invention provides nano powder comprising a plurality of nanoparticles, and the surfaces of the nanoparticles have polymerized functional groups, wherein each polymerized functional groupcomprises a polyimide functional group, and the polymerized functional group base is produced by chemically synthesizing the nanoparticles with a synthetic monomer.

Description

technical field [0001] The present invention relates to nanopowder and polyimide resin composition prepared therefrom, in particular to a modified nanopowder and polyimide resin composition with low thermal expansion coefficient. Background technique [0002] Due to the rapid development of electronic products, flexible substrates must be developed towards more refined and more functional. Therefore, the requirements on material properties have also become more stringent, and must meet the characteristics of high heat resistance, low moisture absorption, high dimensional stability and excellent electrical properties. Polyimide (Polyimide, PI) is a polymer with imide repeating units. Although it has good mechanical and electrical properties, with the development of multifunctional requirements, in addition to modifying properties from molecular structure design, Adding inorganic nanopowder to polyimide is also one of the methods. [0003] In the current technology, when add...

Claims

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Application Information

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IPC IPC(8): C08K9/06C08K9/04C08K3/36C08K3/22C08G73/10C08L79/08
CPCC08G73/1067C08G73/1071C08G73/1082C08K3/22C08K3/36C08K9/04C08K9/06C08K9/08C08K2003/2227C08K2003/2241C08K2003/2272C08K2201/011C08L2201/08C08L79/08Y02P20/54
Inventor 张育勳陈秋风
Owner TAIFLEX SCI
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