High-density optical waveguide structure, printing circuit board and preparation method thereof

Abstract

The invention provides a high-density optical waveguide structure, a printing circuit board and a preparation method thereof. The high-density optical waveguide structure successively comprises a lower coating layer, a core layer and an upper coating layer; and a plurality of grooves are formed in the lower coating layer at intervals, and are filled with an optical waveguide materials to form thecore layer. Optical waveguide is integrated into a PCB to implement optoelectronic interconnection; high parallel interconnection density can be realized well, good signal integrity is maintained, andsizes of devices and equipment are reduced; meanwhile, power consumption is low, heat dissipation is facilitated, simple physical architecture and design can be realized, wiring space of the printingcircuit board is increased to a maximum extent, and manufacturing of an ultra-fine wire circuit board is facilitated; and moreover, wiring density of an existing preparation method can be improved, and the reliability is improved.

Description

technical field [0001] The invention relates to the manufacturing technology of a printed circuit board or a semiconductor integrated circuit packaging substrate, in particular to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. Background technique [0002] With the development of social economy, people's demand for information increases sharply, and the amount of information increases exponentially. Only the information bit rate that Internet users need to transmit increases by 8 times every year. In the field of long-distance wired communication, optical fiber communication technology can meet this high-performance requirement. However, in the field of short-distance information transmission, due to cost and technical issues, electrical interconnection is still the mainstay. However, electrical interconnection has inherent shortcomings such as electromagnetic interference, high loss, and low bandwidth, which limit the ...

AI Technical Summary

Problems solved by technology

The defect of the prior art is: in the production process, since the core layer is made on the surface of the lower cladding layer by means of exposure, development, etc., one side of the optical waveguide circuit is connected to the lower cladding layer, and the bonding force is relatively poor. , under the attack of potion, the optical waveguide line is easy to fall off or be peeled off, forming defects. For rel

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