Planar strip-type nano thermoelectric generator for microcontroller

Abstract

The invention discloses a planar strip-type nano thermoelectric generator for a microcontroller. The substrate is an N-type silicon wafer, and a P-type arm 2 of a thermopile, an N-type arm 3 of the thermopile, polymethyl methacrylate 4, a first silicon nitride isolation layer 5, a metal aluminum connecting wire 6, a second silicon nitride isolation layer 7 and a cooling plate 8 are prepared. A positive electrode and a negative electrode are connected as shown in Figure 2, the P-type thermoelectric arm 2 and the N-type thermoelectric arm 3 are connected through the metal aluminum 6, and in particular, the thermopile is formed by a series of P-type polysilicon nanowire clusters and N-type polysilicon nanowire clusters, and details are seen in local enlargement in Figure 2. Through thermoelectric conversion, thermal dissipation power generated by working of the microcontroller can be recovered; the thermal conductivity of the adopted silicon nano-particles is much lower than that of the traditional material, heat transfer is suppressed while electronic transportation is maintained, the thermoelectric generation efficiency is improved; and finally, the electric energy generated duringthe above process can be provided for low-power consumption equipment near the microcontroller.

Description

technical field [0001] The invention provides a planar elongated nanothermoelectric generator used for a microcontroller, which belongs to the technical field of micro-electro-mechanical systems (MEMS). Background technique [0002] One of the processor revolutions is the application of multi-core and multi-threading. Multi-core is usually used in notebooks and servers, and it has also appeared in the field of microcontrollers for some computing-intensive applications, such as industrial equipment and automotive applications. However, the development of microcontrollers is also facing new challenges, that is, power consumption and memory bandwidth restrict the expansion of the core. The higher and higher power consumption also brings a lot of heat loss, and at the same time causes the decline of its reliability. [0003] According to the Seebeck effect, miniature thermocouples are made of different semiconductor materials. The principle is very simple. As long as there is a...

AI Technical Summary

Problems solved by technology

However, the development of microcontrollers is also facing new challenges, that is, power consumption and memory bandwidth restrict the expansion of the core.

The higher and higher power consumption also brings a lot of heat loss, and at the same time causes the decline of its reliability

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