Solder powder and preparation method for solder paste using said powder

A solder powder and slurry technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of uneven melting, poor bonding, poor melting, etc., and achieve difficult remelting and joint strength. the reducing effect of

Active Publication Date: 2018-08-21
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the solder powder stored for a long time and the solder powder stored before storage or for a short storage period have differences in the solidification start temperature due to the difference in the presence or absence of the above-mentioned intermetallic compounds or the difference in the amount of the above-mentioned intermetallic compounds. When the solder powder is reflowed at the melting temperature of the solder powder before storage or during short storage period, there may be cases where joint failure occurs due to uneven melting or poor meltability during reflow.

Method used

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  • Solder powder and preparation method for solder paste using said powder
  • Solder powder and preparation method for solder paste using said powder
  • Solder powder and preparation method for solder paste using said powder

Examples

Experimental program
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Effect test

preparation example Construction

[0037] As the solvent suitable for the preparation of the above-mentioned soldering flux, diethylene glycol monohexyl ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, tetraethylene glycol, 2- Organic solvents with boiling points above 180°C, such as ethyl-1,3-hexanediol and α-terpineol. Moreover, as rosin, gum rosin, hydrogenated rosin, polymerized rosin, ester rosin, etc. are mentioned.

[0038] In addition, as a thixotropic agent, hardened castor oil, fatty acid amide, natural oil, synthetic oil, N,N'-ethylenebis-12-hydroxystearic acid amide, 12-hydroxystearic acid, 1, 2 ,3,4-Dibenzylidene-D-sorbitol and its derivatives.

[0039] In addition, as the active agent, an amine hydrohalide salt is preferred, and specific examples include triethanolamine, diphenylguanidine, ethanolamine, butylamine, aminopropanol, polyoxyethylene oleylamine, and polyoxyethylene laurylamine , Polyoxyethylene stearamide, diethylamine, triethylamine, methoxypropylamine...

Embodiment

[0047] Next, examples of the present invention will be described in detail together with comparative examples.

[0048]

[0049] First, add 4.92×10 to 50mL of water -3 mol of nickel(II) sulfate, 1.1×10 -3 mol of sodium phosphinate, 3.88×10 -4 mol of sodium citrate was stirred with a stirrer at a rotation speed of 300 rpm for 5 minutes to prepare a solution. After the pH of the solution was adjusted to 5.0 with sulfuric acid, 0.2 g of polyvinyl alcohol 500 (polyvinyl alcohol with an average molecular weight of 500) was added as a dispersant, and further stirred at a rotation speed of 300 rpm for 10 minutes. Next, the dispersion was added to the solution, and 0.2 g of polyvinyl alcohol 500 (polyvinyl alcohol with an average molecular weight of 500) was dissolved in 50 mL of water as a dispersant, and the dispersion had an average particle size of 0.32 μm. The silver powder is 3.41g. Then, the mixture was stirred at a rotation speed of 500 rpm for 10 minutes to obtain a dispersion ...

Embodiment 2～41、 comparative example 1～36

[0052] In Examples 2 to 41 and Comparative Examples 1 to 36, the particle size of the silver powder used, the amount of silver powder added, the amount of nickel sulfate (II) and tin sulfate (II), and other ingredients were also adjusted. The solder powder was obtained in the same manner as in Example 1 except that the ratio of φ was controlled to the predetermined silver core radius, the thickness of the nickel diffusion prevention layer and the tin outermost layer, and the predetermined particle size of solder powder.

[0053]

[0054] For the solder powders obtained in Examples 1 to 41 and Comparative Examples 1 to 36, the silver content [mass%], average particle size [μm], and composition of the solder powder were measured by the method described below. The average radius of the central core [μm], the average thickness of the diffusion prevention layer made of nickel [μm], and the average thickness of the coating layer made of tin [μm]. These results are shown in Tables 1 to ...

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Abstract

A solder powder (10) of the present invention comprises a core (11) made of silver, a coating layer (12) that coats the core (11) and is made of tin, and a diffusion-preventing layer (13) that is madeof nickel and is between the core and the coating layer. The average grain diameter of the solder powder (10) is 1 [mu]m to 30 [mu]m. The proportional content of silver relative to 100 mass% of the entire amount of the solder powder (10) is 10 mass% to 81 mass%. In a solder powder (10) of the present invention, the thickness of the diffusion-preventing layer (13) made of nickel is proportionally0.04-0.50 if the radius of the core (11) is taken as 1. A method for preparing a solder paste of the present invention is a method in which a solder paste is prepared by mixing a solder powder (10) ofthe present invention with a flux for solder and converting the mixture to a paste.

Description

Technical field [0001] The present invention relates to a solder powder having a center core made of silver and a coating layer made of tin used for mounting electronic parts and the like, and a method for preparing soldering paste using the powder. In addition, this international application claims priority based on Japanese Patent Application No. 234641 (Patent Application 2015-234641) filed on December 1, 2015, and all contents of Patent Application 2015-234641 are used in this international application. Background technique [0002] Conventionally, there has been disclosed a solder powder having an average particle diameter of 5 μm or less in which the center core is made of silver and the coating layer is made of tin (for example, refer to Patent Document 1). This solder powder is lead-free in terms of environmental protection and is fine, so it has excellent printability. In addition, by setting the metal element constituting the center core to silver, not only the coating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14B22F1/00B22F1/02B23K35/26B23K35/30C22C5/06C22C13/00H05K3/34
CPCB22F1/00B23K35/26B23K35/30C22C5/06C22C13/00H05K3/34B23K35/0244B23K35/025B23K35/3006B23K35/262
Inventor 植杉隆二
Owner MITSUBISHI MATERIALS CORP
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